10AX027H1F35I1HG

The 10AX027H1F35I1HG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) IC built on a 20 nm mid-range device architecture. It combines high logic capacity and substantial embedded memory with a broad I/O set to address performance- and power-sensitive applications.

This device is targeted at markets such as wireless, wireline, broadcast, computing and storage, medical, and military applications that require a balance of performance, power efficiency, and industrial temperature operation.

Key Features

• Core Logic  Approximately 270,000 logic elements for high-density programmable logic and complex digital functions.
• Configurable Logic Blocks  101,620 configurable logic blocks consistent with Arria 10 device architecture for flexible design partitioning.
• Embedded Memory  17,870,848 total RAM bits to support on-chip buffering, caching, and state storage.
• I/O Capacity  384 general-purpose I/O pins to interface with high-pin-count systems and multiple external devices.
• Package & Mounting  1152‑FBGA (1152‑FCBGA, 35×35) package in a surface-mount form factor for compact system integration.
• Supply Voltage  Core supply range from 870 mV to 980 mV to support the device's power domain requirements.
• Operating Temperature  Industrial temperature grade rated from −40 °C to 100 °C for use in demanding environments.
• Regulatory  RoHS compliant.
• Arria 10 Series Architecture  Leverages Arria 10 device features such as adaptive logic modules, DSP blocks, and a focus on performance with power efficiency (20 nm technology).

Typical Applications

• Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul systems that need high-density logic and on-chip memory.
• Wireline and Optical Networking  40G/100G muxponders, transponders and line cards where large I/O counts and programmable logic accelerate packet processing and transport functions.
• Broadcast and Pro AV  Studio switches, videoconferencing and professional audio/video systems requiring flexible datapath and timing architectures.
• Computing and Storage  Flash cache, cloud server acceleration and storage interface offload where embedded RAM and logic density enable in-line processing.
• Imaging and Medical Systems  Diagnostic scanners and imaging subsystems that benefit from configurable processing pipelines and industrial temperature operation.

Unique Advantages

• High Logic Capacity: 270,000 logic elements provide the room to implement complex custom hardware accelerators and datapath logic.
• Large On‑Chip Memory: 17.9 million bits of RAM reduce dependency on external memory for buffering and state storage, simplifying board-level design.
• Extensive I/O: 384 I/O pins enable dense peripheral connectivity and multi-channel interface implementations without extra bridge logic.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in harsh and industrial environments.
• Compact FCBGA Package: 1152‑FCBGA (35×35) surface-mount package helps conserve PCB area while supporting high pin count.
• Power‑Efficient 20 nm Architecture: Arria 10 series design emphasis on performance with power efficiency helps manage thermal and power budgets.

Why Choose 10AX027H1F35I1HG?

The 10AX027H1F35I1HG offers a balanced combination of high logic density, substantial embedded memory, and broad I/O in an industrial-temperature, surface-mount FCBGA package. It is well suited for mid-range, performance-sensitive designs that require programmable flexibility together with on-chip resources to minimize external components.

As part of the Arria 10 device family, this FPGA fits applications that need scalable logic and memory resources while benefiting from the series’ focus on performance and power efficiency. Its specification set supports robust system integration across communications, computing, broadcast, and imaging markets.

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