10AX027H2F34E1SG

The 10AX027H2F34E1SG is an Intel Arria 10 GX series FPGA device built on a 20 nm process node. It delivers a mid‑range FPGA architecture focused on balancing high performance and power efficiency for demanding embedded and communications applications.

Typical market segments for this device include wireless and wireline communications, broadcast, computing and storage, medical imaging, and defense systems where a mix of logic density, embedded memory, and ample I/O is required.

Key Features

• Logic Capacity  270,000 logic elements (cells), providing substantial programmable logic resource for complex designs.
• Embedded Memory  17,870,848 total RAM bits for on‑chip buffering, packet processing, and local data storage.
• I/O Count  384 user I/O pins to support wide external interface connectivity and high channel counts.
• Package and Mounting  1152‑FBGA (1152‑BBGA / 1152‑FCBGA) surface‑mount package, supplier package noted as 1152‑FCBGA (35×35 mm).
• Power Supply  Low‑voltage core operation with supply range from 870 mV to 980 mV.
• Operating Range and Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C.
• RoHS Compliance  Device is RoHS compliant.

Typical Applications

• Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul systems where programmable logic and memory accelerate signal processing and control functions.
• High‑Speed Wireline  40G/100G muxponders, transponders, and line cards that require significant logic capacity and on‑chip memory for packet handling and protocol processing.
• Broadcast and Professional AV  Studio switches and transport equipment benefiting from flexible I/O and embedded memory for video frame buffering and routing.
• Compute Acceleration and Storage  Server acceleration, flash caching, and data-plane processing tasks that leverage abundant logic and embedded RAM for offloading compute workloads.
• Imaging and Defense Systems  Diagnostic imaging, radar, and secure communications where deterministic logic and memory resources support real‑time processing.

Unique Advantages

• High Logic Density: 270,000 logic elements enable implementation of complex control, DSP, and packet-processing designs without external ASICs.
• Substantial On‑Chip Memory: Nearly 17.9 Mbits of embedded RAM reduces dependence on external memory for buffering and accelerates data‑intensive tasks.
• Generous I/O Resources: 384 I/O lines support broad peripheral and high‑channel interface requirements, simplifying board-level routing and partitioning.
• Compact Surface‑Mount Package: 1152‑FCBGA (35×35) packaging provides a dense, industry‑standard form factor for space‑constrained designs.
• Low‑Voltage Core Operation: 0.87–0.98 V supply range supports efficient power delivery schemes for thermal and power‑sensitive applications.
• Extended Operating Grade: 0 °C to 100 °C rating meets extended commercial temperature needs for deployed systems.

Why Choose 10AX027H2F34E1SG?

The 10AX027H2F34E1SG Arria 10 GX device combines significant logic and memory resources with a large complement of I/O in a compact FCBGA package, positioning it for mid‑range applications that require both performance and power efficiency. Its specifications align with common requirements across wireless, wireline, broadcast, compute acceleration, and imaging markets.

As a member of the Intel Arria 10 family, this device benefits from documented device features and design guidance, making it suitable for engineering teams seeking a scalable FPGA platform with verifiable electrical and thermal characteristics for production designs.

Request a quote or submit a procurement inquiry to receive availability and pricing details for the 10AX027H2F34E1SG Arria 10 GX FPGA.