10AX027H2F34E1HG

IC FPGA 384 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 17870848 270000 1152-BBGA, FCBGA

Quantity 176 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O384Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs101620Number of Logic Elements/Cells270000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits17870848

Overview of 10AX027H2F34E1HG – Arria 10 GX FPGA, 1152-FCBGA

The 10AX027H2F34E1HG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1152-ball FCBGA package. It is a 20 nm mid-range FPGA device intended for high-performance, power-sensitive applications across markets such as wireless, wireline, broadcast, computing and storage, medical, and military.

With large logic capacity, abundant embedded memory, and a broad I/O complement, this device targets midrange systems that require performance and integration while supporting platform-level features described in the Arria 10 device family overview.

Key Features

  • Core Architecture  Arria 10 GX family device built on a 20 nm process with adaptive logic modules and variable-precision DSP blocks as described in the device overview.
  • Logic Capacity  270,000 logic elements to implement complex digital logic and signal-processing functions.
  • Embedded Memory  17,870,848 total RAM bits for on-chip buffering, caches, and deep FIFOs.
  • I/O and Connectivity  384 I/O pins to support broad external-device interfacing; the family overview also documents support for external memory interfaces and high-speed serial transceivers.
  • Package & Mounting  Supplied in a 1152-ball FCBGA (1152-BBGA) surface-mount package, supplier package dimension 35 × 35 mm.
  • Power  Supported core voltage range of 870 mV to 980 mV and family-level power-saving technologies described in the device overview.
  • Reliability & Configuration  Family features listed include dynamic and partial reconfiguration options and SEU error detection and correction mechanisms.
  • Operating Range  Extended grade with an operating temperature range of 0 °C to 100 °C.

Typical Applications

  • Wireless infrastructure  Channel and switch cards in remote radio heads and mobile backhaul implementations that need programmable logic and DSP capability.
  • Wireline networking  40G/100G muxponders, transponders, and line-card functions where high I/O count and on-chip memory support packet buffering and protocol processing.
  • Broadcast and professional AV  Studio switches, videoconferencing, and transport systems that require flexible I/O routing and real-time processing.
  • Computing and storage acceleration  Server acceleration, flash cache, and cloud computing use cases leveraging on-chip logic and memory.
  • Medical and defense  Diagnostic imaging, radar, and guidance systems that can use the device’s logic density and reconfiguration capabilities.

Unique Advantages

  • High logic density: 270,000 logic elements enable implementation of complex algorithms and large-scale digital blocks on a single device.
  • Substantial on-chip memory: 17,870,848 total RAM bits reduce reliance on external memory for many buffering and caching needs.
  • Broad I/O support: 384 I/O pins provide flexibility for heterogeneous interfaces and multi-channel designs.
  • System-level features: Family-level support for dynamic and partial reconfiguration and SEU detection/correction helps maintain uptime and enables field updates.
  • Compact, surface-mount package: 1152-ball FCBGA (35 × 35 mm) balances high pin count with a compact footprint for board-level integration.
  • Extended operating range: Extended-grade device rated from 0 °C to 100 °C for a wide set of commercial and industrial-adjacent applications.

Why Choose 10AX027H2F34E1HG?

The 10AX027H2F34E1HG delivers Arria 10 GX family capabilities—high logic capacity, significant embedded memory, and extensive I/O—in a compact 1152-ball FCBGA package. It is suited for midrange systems that require a balance of performance, on-chip integration, and reconfigurability.

Designers targeting wireless, networking, broadcast, compute acceleration, medical, or defense applications will find the device’s combination of logic elements, RAM bits, and family-level features useful for consolidating functions, simplifying board-level design, and enabling in-field flexibility.

Request a quote or submit an inquiry to discuss availability, pricing, and lead time for the 10AX027H2F34E1HG.

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