10AX027H1F35E1SG

The 10AX027H1F35E1SG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) IC in a 1152‑FBGA (35×35) package. It is part of the Arria 10 family of 20 nm mid‑range FPGAs designed for high‑performance, power‑sensitive applications.

Built for midrange markets including wireless, wireline, broadcast, computing and medical applications, this device combines substantial logic capacity, on‑chip RAM, and a dense I/O footprint to support system integration and protocol offload in compact surface‑mount packages.

Key Features

• Logic Capacity  Provides 270000 logic elements for implementing complex digital designs and large FPGA fabrics.
• Adaptive Logic & DSP  Arria 10 architecture includes adaptive logic modules and variable‑precision DSP blocks to support mixed logic and signal processing workloads.
• Embedded Memory  Total on‑chip RAM of 17,870,848 bits across embedded memory blocks for frame buffers, caches, and intermediate storage.
• I/O Density & Protocol Support  384 I/O pins and Arria 10 series features such as PCIe Gen1/2/3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low‑power serial transceivers to enable high‑throughput interfaces.
• Power and Supply  Operation across a core voltage range of 870 mV to 980 mV and family‑level power‑efficiency features from the 20 nm process.
• Package & Mounting  Surface‑mount 1152‑FCBGA (35×35 mm) package suitable for compact, high‑density board designs.
• Grade & Temperature  Extended grade device with an operating temperature range of 0 °C to 100 °C for applications requiring extended commercial‑temperature operation.
• Compliance  RoHS compliant for reduced hazardous substance content.

Typical Applications

• Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment using the device’s logic and transceiver features for real‑time signal processing.
• Wireline Networking  40G/100G muxponders, transponders and line cards that leverage embedded memory and protocol hard IP for packet aggregation and transport.
• Broadcast & Pro AV  Studio switches, videoconferencing and professional audio/video systems requiring deterministic processing and high I/O density.
• Computing & Storage  Flash cache, server acceleration and cloud computing peripherals where on‑chip RAM and DSP blocks support acceleration tasks.
• Medical Imaging  Diagnostic scanners and imaging systems that benefit from combined DSP resources and sizable embedded memory for image processing pipelines.

Unique Advantages

• High logic density: 270000 logic elements enable large designs and complex control or processing functions without external logic.
• Substantial on‑chip RAM: 17,870,848 bits of embedded RAM reduce external memory dependence and simplify board-level memory architectures.
• Rich I/O and protocol support: 384 I/Os plus Arria 10 series hard IP for PCIe and high‑speed Ethernet streamline system integration and protocol offload.
• Compact, surface‑mount package: 1152‑FCBGA (35×35) delivers high integration in a space‑efficient package suitable for dense board layouts.
• Extended operating range: Extended grade and 0 °C to 100 °C operation provide predictable behavior across a broad temperature span.
• Designed for power efficiency: Based on the Arria 10 20 nm family’s power‑efficiency features, suitable for power‑sensitive midrange designs.

Why Choose 10AX027H1F35E1SG?

The 10AX027H1F35E1SG positions designers to implement substantial logic and memory‑intensive systems while maintaining compact board footprints and a high I/O count. Its Arria 10 GX heritage brings architecture‑level features—adaptive logic modules, DSP capabilities, and transceiver/IP support—that align with midrange, high‑performance, power‑sensitive applications.

This device is suited for engineering teams building network, broadcast, compute acceleration, and imaging systems that need an integrated FPGA with verified series‑level features and Intel Arria 10 documentation and support. Its combination of logic capacity, embedded RAM, protocol IP, and extended temperature grade offers a scalable platform for production designs.

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