10AX048H2F34E1HG

IC FPGA 492 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 492 5664768 480000 1152-BBGA, FCBGA

Quantity 1,021 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O492Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs183590Number of Logic Elements/Cells480000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits5664768

Overview of 10AX048H2F34E1HG – Arria 10 GX Field Programmable Gate Array, 1152-FCBGA

The 10AX048H2F34E1HG is an Intel Arria 10 GX FPGA in a 1152-FCBGA (35×35) package, optimized for mid-range, high-performance, power-sensitive applications. Built on a 20 nm architecture, this device combines high logic density, sizable embedded memory, and integrated high-speed I/O to address wireless, wireline, broadcast, computing, medical, and defense market segments.

Its value proposition centers on delivering scalable logic and memory resources alongside low-power serial transceivers and advanced configuration features, enabling designers to implement complex data-paths and connectivity in a compact surface-mount package.

Key Features

  • Logic Capacity — 480,000 logic elements provide substantial programmable compute fabric for mid-range FPGA designs.
  • On-Chip Memory — 5,664,768 total RAM bits of embedded memory to support buffering, packet processing, and algorithm acceleration.
  • I/O and High-Speed Connectivity — 492 I/O pins and integrated low-power serial transceivers with enhanced PCS hard IP supporting high-speed protocols including 10 Gbps Ethernet and Interlaken.
  • Transceiver and Protocol Support — Device-level support for PCIe Gen1/Gen2/Gen3 hard IP and advanced PMA/PCS features suitable for high-throughput interfaces.
  • DSP and Algorithm Acceleration — Variable-precision DSP blocks and adaptive logic modules for implementing signal-processing and custom datapaths (as described in device overview).
  • Configuration and Reconfiguration — Support for dynamic and partial reconfiguration to update logic while maintaining system operation.
  • Power and Voltage — Core supply range specified between 870 mV and 980 mV, benefiting power-sensitive designs.
  • Package and Mounting — 1152-FCBGA (35×35) package, surface-mount mounting type for compact board layouts.
  • Operating Range and Grade — Extended grade device with an operating temperature range of 0 °C to 100 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • Wireless Infrastructure — Channel and switch cards, remote radio head modules and mobile backhaul equipment requiring dense logic and high-speed transceivers.
  • Wireline Communications — 40G/100G muxponders, transponders and line cards where PCIe and high-speed serial interfaces are required.
  • Broadcast and Media — Studio switches, video routing and transport equipment leveraging embedded memory and programmable datapaths.
  • Computing and Storage Acceleration — Flash cache, cloud server acceleration and packet processing tasks that benefit from large on-chip memory and DSP blocks.
  • Medical and Defense Systems — Diagnostic imaging and radar/missile guidance subsystems that require configurable logic with partial reconfiguration capabilities.

Unique Advantages

  • High Logic Density: 480,000 logic elements enable complex designs and integration of multiple functions into a single device, reducing board-level BOM.
  • Substantial On-Chip Memory: 5,664,768 RAM bits support large buffers and memory-intensive algorithms without relying solely on external memory.
  • Robust High-Speed I/O: 492 I/O pins and integrated serial transceivers with protocol hard IP (PCIe, 10 Gbps Ethernet, Interlaken) simplify high-bandwidth system design.
  • Flexible Reconfiguration: Dynamic and partial reconfiguration support enables in-field updates and runtime adaptability for evolving system requirements.
  • Power-Conscious Core Supply: Core voltage range of 870 mV–980 mV suited to power-sensitive mid-range applications.
  • Compact, Surface-Mount Package: 1152-FCBGA (35×35) package provides a dense footprint for space-constrained boards.

Why Choose 10AX048H2F34E1HG?

The 10AX048H2F34E1HG Arria 10 GX FPGA delivers a balance of programmable logic density, embedded memory, and integrated high-speed connectivity in a compact surface-mount FCBGA package. It is positioned for mid-range, power-sensitive designs that require sizable on-chip resources and advanced transceiver capabilities.

For engineers building wireless infrastructure, high-speed communications, media processing, or compute-acceleration systems, this device offers a combination of performance, reconfiguration flexibility, and measurable on-chip resources that support scalable designs and long-term deployment.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the 10AX048H2F34E1HG Arria 10 GX FPGA.

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