10AX048H1F34I1HG

IC FPGA 492 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 492 5664768 480000 1152-BBGA, FCBGA

Quantity 972 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O492Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs183590Number of Logic Elements/Cells480000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits5664768

Overview of 10AX048H1F34I1HG – Arria 10 GX FPGA, 480,000 Logic Elements, 1152‑FCBGA

The Intel Arria 10 GX Field Programmable Gate Array (FPGA) 10AX048H1F34I1HG is a 20 nm mid-range FPGA optimized for high-performance, power-sensitive designs. It combines a large programmable fabric with embedded memory, DSP and transceiver features targeted at wireless, wireline, broadcast, computing, medical and military applications.

This device provides a balance of capacity and integration with 480,000 logic elements, 5,664,768 total RAM bits and 492 general-purpose I/Os in a 1152‑FCBGA (35×35) surface-mount package, supporting industrial operation and a wide supply range for deployment in demanding environments.

Key Features

  • Logic Capacity — 480,000 logic elements provide extensive programmable fabric for complex digital designs and system integration.
  • Embedded Memory — 5,664,768 total RAM bits of on-chip memory for buffering, look-up tables and system data storage.
  • I/O and Packaging — 492 I/Os delivered in a 1152‑FBGA (35×35) surface-mount package for high pin-count designs and dense board layouts.
  • Transceivers and Interfaces — Includes low-power serial transceivers and hard IP for PCIe Gen1/2/3 plus enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet (as described in device documentation).
  • DSP and Clocking — Variable-precision DSP blocks and extensive clock networks with PLL clock sources support signal processing and timing architectures.
  • Power and Supply — Supported core voltage range of 870 mV to 980 mV to accommodate targeted power domains and efficient operation.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • RoHS Compliant — Device meets RoHS environmental requirements.

Typical Applications

  • Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul systems where programmable logic and transceivers handle PHY and MAC layer functions.
  • Wireline Communications — 40G/100G muxponders, transponders and 100G line cards requiring high-speed interfaces and protocol hard IP.
  • Broadcast and Video — Studio switches, transport equipment and videoconferencing systems that need real-time processing and flexible I/O.
  • Computing and Storage Acceleration — Flash cache, cloud server acceleration and server offload applications leveraging DSP blocks and embedded memory.
  • Medical and Military Systems — Diagnostic imaging, radar, electronic warfare and secure communications benefiting from high logic density and industrial temperature operation.

Unique Advantages

  • High Logic Density: 480,000 logic elements enable consolidating multiple functions into a single FPGA, reducing BOM and board complexity.
  • Substantial On‑Chip Memory: 5,664,768 RAM bits support large buffering and local data storage for high-throughput designs.
  • Comprehensive Interface IP: Integrated hard IP for PCIe Gen1/2/3 and enhanced PCS for Interlaken and 10 Gbps Ethernet accelerates time-to-market for communications systems.
  • Industrial Reliability: Rated operation from −40 °C to 100 °C and RoHS compliance support deployment in industrial environments with strict thermal and regulatory requirements.
  • Flexible Power Envelope: Core supply support from 870 mV to 980 mV provides design flexibility for power and thermal optimization.
  • High I/O Count in Compact Package: 492 I/Os in a 1152‑FCBGA (35×35) surface-mount package enable dense connectivity for multi-channel systems.

Why Choose 10AX048H1F34I1HG?

The 10AX048H1F34I1HG Arria 10 GX FPGA is positioned for mid-range designs that require a blend of sizable programmable logic, embedded memory, DSP capability and high-speed interface support. Its industrial temperature rating and compact 1152‑FCBGA package make it suitable for systems where reliability and I/O density matter.

Designed as part of the Intel Arria 10 family, this device suits engineers building high-performance, power-sensitive applications across communications, broadcast, computing, medical and defense markets, offering a scalable platform with on-chip resources to consolidate functions and simplify board-level design.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for 10AX048H1F34I1HG.

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