10AX048H1F34I1HG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 492 5664768 480000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 972 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 492 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 183590 | Number of Logic Elements/Cells | 480000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5664768 |
Overview of 10AX048H1F34I1HG – Arria 10 GX FPGA, 480,000 Logic Elements, 1152‑FCBGA
The Intel Arria 10 GX Field Programmable Gate Array (FPGA) 10AX048H1F34I1HG is a 20 nm mid-range FPGA optimized for high-performance, power-sensitive designs. It combines a large programmable fabric with embedded memory, DSP and transceiver features targeted at wireless, wireline, broadcast, computing, medical and military applications.
This device provides a balance of capacity and integration with 480,000 logic elements, 5,664,768 total RAM bits and 492 general-purpose I/Os in a 1152‑FCBGA (35×35) surface-mount package, supporting industrial operation and a wide supply range for deployment in demanding environments.
Key Features
- Logic Capacity — 480,000 logic elements provide extensive programmable fabric for complex digital designs and system integration.
- Embedded Memory — 5,664,768 total RAM bits of on-chip memory for buffering, look-up tables and system data storage.
- I/O and Packaging — 492 I/Os delivered in a 1152‑FBGA (35×35) surface-mount package for high pin-count designs and dense board layouts.
- Transceivers and Interfaces — Includes low-power serial transceivers and hard IP for PCIe Gen1/2/3 plus enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet (as described in device documentation).
- DSP and Clocking — Variable-precision DSP blocks and extensive clock networks with PLL clock sources support signal processing and timing architectures.
- Power and Supply — Supported core voltage range of 870 mV to 980 mV to accommodate targeted power domains and efficient operation.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- RoHS Compliant — Device meets RoHS environmental requirements.
Typical Applications
- Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul systems where programmable logic and transceivers handle PHY and MAC layer functions.
- Wireline Communications — 40G/100G muxponders, transponders and 100G line cards requiring high-speed interfaces and protocol hard IP.
- Broadcast and Video — Studio switches, transport equipment and videoconferencing systems that need real-time processing and flexible I/O.
- Computing and Storage Acceleration — Flash cache, cloud server acceleration and server offload applications leveraging DSP blocks and embedded memory.
- Medical and Military Systems — Diagnostic imaging, radar, electronic warfare and secure communications benefiting from high logic density and industrial temperature operation.
Unique Advantages
- High Logic Density: 480,000 logic elements enable consolidating multiple functions into a single FPGA, reducing BOM and board complexity.
- Substantial On‑Chip Memory: 5,664,768 RAM bits support large buffering and local data storage for high-throughput designs.
- Comprehensive Interface IP: Integrated hard IP for PCIe Gen1/2/3 and enhanced PCS for Interlaken and 10 Gbps Ethernet accelerates time-to-market for communications systems.
- Industrial Reliability: Rated operation from −40 °C to 100 °C and RoHS compliance support deployment in industrial environments with strict thermal and regulatory requirements.
- Flexible Power Envelope: Core supply support from 870 mV to 980 mV provides design flexibility for power and thermal optimization.
- High I/O Count in Compact Package: 492 I/Os in a 1152‑FCBGA (35×35) surface-mount package enable dense connectivity for multi-channel systems.
Why Choose 10AX048H1F34I1HG?
The 10AX048H1F34I1HG Arria 10 GX FPGA is positioned for mid-range designs that require a blend of sizable programmable logic, embedded memory, DSP capability and high-speed interface support. Its industrial temperature rating and compact 1152‑FCBGA package make it suitable for systems where reliability and I/O density matter.
Designed as part of the Intel Arria 10 family, this device suits engineers building high-performance, power-sensitive applications across communications, broadcast, computing, medical and defense markets, offering a scalable platform with on-chip resources to consolidate functions and simplify board-level design.
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