10AX048E4F29I3SG

The 10AX048E4F29I3SG is an Intel Arria 10 GX FPGA family device implemented on a 20 nm architecture. This industrial-grade, surface-mount FCBGA device integrates high logic density, substantial embedded RAM, and comprehensive I/O to address mid-range, performance-sensitive applications.

Designed for markets such as wireless, wireline, broadcast, compute/storage, medical, and defense, the device emphasizes performance and power efficiency while providing on-chip features extracted from the Arria 10 device family overview.

Key Features

• Logic Capacity  The device provides 480,000 logic elements suitable for complex FPGA designs and large-scale integration.
• Embedded Memory  Total on-chip RAM of 5,664,768 bits supports large buffering, lookup tables, and memory-intensive processing.
• I/O Resources  Up to 360 I/O pins enable broad interfacing options for high-density system designs.
• Transceivers and High-speed Interfaces  Family-level features include low-power serial transceivers and enhanced PCS hard IP supporting 10 Gbps Ethernet and Interlaken, plus PCIe Gen1/Gen2/Gen3 hard IP (as described in the Arria 10 device overview).
• DSP and Logic Architecture  The Arria 10 family includes variable-precision DSP blocks and adaptive logic modules for flexible signal processing and compute tasks (family-level capability referenced in the device overview).
• Clocking and PLLs  Integrated clock networks with fractional synthesis and multiple PLL clock sources support complex timing and multi-domain clocking (family-level capability).
• Configuration and Reliability  Supports dynamic and partial reconfiguration, SEU error detection and correction, and enhanced configuration options as outlined in the Arria 10 overview.
• Power and Operating Range  Voltage supply range of 870 mV to 980 mV with device-level power-management technologies referenced in the family overview; industrial operating temperature range of −40°C to 100°C.
• Package and Mounting  780-BBGA FCBGA package (supplier package: 780-FBGA, FC, 29×29) for surface-mount board integration.

Typical Applications

• Wireless Infrastructure  Channel and switch cards, remote radio head functions and mobile backhaul designs benefit from the device's logic density and high-speed serial capabilities.
• Wireline Networking  40G/100G muxponders, transponders, and line cards can use the device's embedded memory and high-speed interface hard IP for packet processing and line-rate operations.
• Broadcast and Professional AV  Studio switching, transport, and videoconferencing systems leverage the FPGA's I/O density and reconfiguration capabilities for audio/video processing pipelines.
• Data Center and Storage Acceleration  Flash cache, cloud compute acceleration, and server offload tasks can exploit the device's DSP resources and substantial embedded RAM.
• Medical and Defense Systems  Diagnostic imaging, radar, and secure communications applications benefit from the device's industrial temperature range and configurable logic resources.

Unique Advantages

• High logic density: 480,000 logic elements enable large designs and system-on-FPGA implementations without immediate need for multi-chip solutions.
• Large on-chip RAM: 5,664,768 total RAM bits reduce external memory dependence for buffering and data-path storage.
• Comprehensive I/O: 360 I/O pins provide flexible interfacing for a wide range of peripherals and board-level connections.
• Industrial operating range: Rated from −40°C to 100°C for deployment in temperature-challenging environments.
• Family-level high-speed IP: Arria 10 family features such as PCIe Gen1/2/3 hard IP, 10 Gbps Ethernet support, and low-power serial transceivers facilitate integration of common high-speed protocols.
• Robust configuration options: Support for dynamic and partial reconfiguration and SEU detection/correction enables maintainable, field-upgradable designs.

Why Choose 10AX048E4F29I3SG?

The 10AX048E4F29I3SG positions itself as a mid-range, high-capacity FPGA option within the Intel Arria 10 family, combining a large logic fabric, extensive embedded memory, and broad I/O in a 780-BBGA FCBGA surface-mount package. Its industrial temperature rating and family-level features—such as DSP blocks, programmable clocking, and high-speed interface hard IP—make it suitable for demanding communications, compute, and imaging designs where performance and power efficiency are important.

This device is ideal for engineering teams building scalable, reconfigurable hardware platforms that require on-chip memory, high I/O counts, and established family capabilities for high-speed serial protocols and system reliability features.

Request a quote or submit a pricing request for the 10AX048E4F29I3SG to evaluate it for your next FPGA-based design.