10AX048E4F29E3SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 5664768 480000 780-BBGA, FCBGA |
|---|---|
| Quantity | 923 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA, FC (29x29) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 183590 | Number of Logic Elements/Cells | 480000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5664768 |
Overview of 10AX048E4F29E3SG – Arria 10 GX FPGA, 780-BBGA FCBGA
The 10AX048E4F29E3SG is an Intel Arria 10 GX field-programmable gate array (FPGA) supplied in a 780-ball BGA FCBGA package (supplier package: 780‑FBGA, FC, 29×29). It provides a high-density programmable fabric for midrange applications that require a combination of performance and power efficiency.
Built for markets including wireless, wireline, broadcast, computing and storage, medical, and military applications, this device targets high-performance, power-sensitive designs with integrated logic, memory, and I/O resources.
Key Features
- Logic Capacity 480,000 logic elements (cells) to implement complex digital functions and custom accelerators.
- On-Chip Memory 5,664,768 total RAM bits for embedded buffers, FIFOs, and memory-mapped structures.
- I/O Resources 360 device I/Os to support broad interfacing and external memory or transceiver connectivity.
- Adaptive Logic Module Architecture Architecture elements described in the device family overview to support the Arria 10 programmable fabric.
- Transceiver and Connectivity Features Device overview documents include enhanced PCS/PHY hard IP blocks, PCIe Gen1/Gen2/Gen3 hard IP, and support for 10 Gbps Ethernet and Interlaken—enabling high-speed serial interfaces.
- Clocking and PLLs Multiple clock networks and PLL clock sources with fractional synthesis and I/O PLL options as described in the device overview.
- Partial and Dynamic Reconfiguration Support for dynamic and partial reconfiguration to update logic regions without full device reprogramming, as documented in the family overview.
- Power and Thermal Core voltage supply range 870 mV to 980 mV and device-grade thermal operating range 0 °C to 100 °C for extended-grade deployments.
- Package and Mounting 780‑BBGA FCBGA package, surface-mount assembly, supplier package 780‑FBGA (29×29) for high-density board integration.
- Regulatory RoHS compliant.
Typical Applications
- Wireless infrastructure Channel and switch cards in remote radio heads and mobile backhaul equipment where programmable logic and high-speed I/O are required.
- Wireline networking 40G/100G muxponders, transponders, and line cards that rely on high-speed serial interfaces and onboard packet processing.
- Broadcast and Pro AV Studio switches, transport and server functions for professional audio/video pipelines that need flexible protocol handling and buffering.
- Computing and storage Flash cache, cloud server acceleration, and server offload functions using dense logic and embedded memory for data-path acceleration.
- Imaging and sensing Diagnostic imaging and medical scanners leveraging on-chip memory and programmable compute for custom signal processing.
Unique Advantages
- High logic density: 480,000 logic elements provide a large fabric for implementing complex SoC-like designs and hardware accelerators.
- Substantial embedded memory: Over 5.6 million RAM bits enable deep buffering, wide FIFOs, and memory-intensive algorithms without external memory.
- Robust I/O capability: 360 I/Os support diverse external interfaces and high-bandwidth connectivity options.
- Designed for performance and efficiency: The Arria 10 family overview highlights higher performance and power-efficiency features suitable for power-sensitive midrange applications.
- Flexible reconfiguration: Support for dynamic and partial reconfiguration enables in-field updates and runtime adaptability for evolving application requirements.
- Extended-grade operation: Rated for operation from 0 °C to 100 °C and supplied in a 780‑BBGA FCBGA package for compact, board-level integration.
Why Choose 10AX048E4F29E3SG?
The 10AX048E4F29E3SG Arria 10 GX FPGA combines large logic capacity, significant embedded memory, and extensive I/O in a compact 780‑ball FCBGA package, positioning it for midrange designs that need a balance of performance and power efficiency. It is suitable for engineers deploying programmable acceleration, protocol bridging, high-speed networking, or signal-processing functions in commercial and extended-temperature applications.
Supported by the Intel Arria 10 device documentation and device overview material, this FPGA is a choice for teams that require a programmable platform with documented connectivity IP, clocking resources, and power management capabilities for scalable system designs.
Request a quote or submit an RFQ to check availability and pricing for 10AX048E4F29E3SG and to discuss quantity, lead time, and delivery options.

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