10AX048E3F29E2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 5664768 480000 780-BBGA, FCBGA |
|---|---|
| Quantity | 496 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA, FC (29x29) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 183590 | Number of Logic Elements/Cells | 480000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5664768 |
Overview of 10AX048E3F29E2SG – Arria 10 GX FPGA, 360 I/O, 480,000 logic elements, 780‑BBGA (FCBGA)
The 10AX048E3F29E2SG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) device built on the Arria 10 family architecture. It combines high logic density and embedded memory with a mid-range, power-conscious 20 nm FPGA architecture suitable for a broad set of communications, broadcast, computing, and specialized applications.
Key design points include 480,000 logic elements, 5,664,768 total RAM bits and 360 I/O pins, packaged in a 780‑BBGA FCBGA (29 × 29) surface‑mount package. The device is offered in Extended grade with an operating range of 0 °C to 100 °C and RoHS compliance.
Key Features
- Logic Capacity — 480,000 logic elements providing substantial programmable fabric for complex digital designs.
- Embedded Memory — 5,664,768 total RAM bits for on‑chip buffering, state storage and data path implementations.
- I/O and Connectivity — 360 I/O pins to support multiple external interfaces and board-level connectivity.
- Core Voltage — Core supply specified at 870 mV to 930 mV, matching the device’s defined power requirements.
- Package & Mounting — 780‑BBGA, FCBGA package (supplier package: 780‑FBGA, FC 29×29), designed for surface‑mount PCB assembly.
- Operating Range & Grade — Extended grade device with operating temperature from 0 °C to 100 °C.
- Family-Level Architecture — Arria 10 family design includes adaptive logic modules, variable‑precision DSP blocks, embedded memory blocks, programmable clock networks and PLL support as part of the device series capabilities.
- Regulatory Compliance — RoHS compliant.
Typical Applications
- Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul modules that require programmable logic and embedded memory.
- Wireline Communications — 40G/100G muxponders, transponders and line cards where on‑board logic and I/O density are used for packet processing and aggregation.
- Broadcast & Media — Studio switching, professional audio/video processing and videoconferencing equipment leveraging programmable logic for signal routing and format handling.
- Computing & Storage — Applications such as flash cache, cloud server acceleration and server offload functions that use FPGA logic and embedded RAM for data path acceleration.
Unique Advantages
- High logic density: 480,000 logic elements enable implementation of large, complex designs without external gate arrays.
- Significant on‑chip memory: 5,664,768 total RAM bits reduce the need for external buffering and enable efficient on‑device data handling.
- Generous I/O count: 360 I/O pins provide flexibility for multi‑lane interfaces and mixed signal board designs.
- Power-conscious family design: Arria 10 family emphasis on power efficiency combined with the specified 870–930 mV core supply supports power‑sensitive mid‑range applications.
- Production-ready package: 780‑BBGA FCBGA (29×29) surface‑mount package simplifies board integration for volume production.
- Extended operating grade: 0 °C to 100 °C rated operation fits a range of commercial and enterprise applications requiring broader thermal tolerance.
Why Choose 10AX048E3F29E2SG?
The 10AX048E3F29E2SG positions itself as a mid‑range Arria 10 GX FPGA option that balances high logic and memory resources with a package and I/O complement suited for demanding communications, broadcast, and compute acceleration tasks. Its Extended grade and defined operating and supply ranges make it appropriate for systems that require reliable, high‑capacity programmable logic within those thermal and power boundaries.
Customers designing with this device gain the benefits of the Arria 10 family architecture—including adaptive logic modules, DSP and embedded memory support—while leveraging Intel’s device documentation and family resources to scale designs across related device variants.
Request a quote or submit a pricing inquiry to obtain availability and ordering information for the 10AX048E3F29E2SG Arria 10 GX FPGA.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018