10AX048E2F29I1SG

IC FPGA 360 I/O 780FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 5664768 480000 780-BBGA, FCBGA

Quantity 22 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs183590Number of Logic Elements/Cells480000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits5664768

Overview of 10AX048E2F29I1SG – Arria 10 GX FPGA, 480,000 logic elements, 780-FBGA (29×29)

The 10AX048E2F29I1SG is an Intel Arria 10 GX field-programmable gate array (FPGA) offering a high-density, power-conscious 20 nm architecture for mid-range applications. This device combines 480,000 logic elements with embedded memory and high pin-count I/O to address networking, broadcast, compute acceleration and other performance-sensitive markets.

Designed for surface-mount deployment in a 780-BBGA / FCBGA package (supplier package: 780-FBGA, 29×29) and rated for industrial temperature operation, the device targets designs that require significant programmable logic, substantial on-chip RAM, and a flexible I/O complement.

Key Features

  • Logic Capacity  480,000 logic elements, enabling large-scale programmable logic implementations and complex custom datapaths.
  • Embedded Memory  5,664,768 total RAM bits on-chip to support deep buffers, on-chip caches, and custom memory structures.
  • I/O Density  360 general-purpose I/O pins for broad connectivity to peripherals, memory interfaces, and high-speed front-ends.
  • Package and Mounting  780-BBGA, FCBGA package with surface-mount mounting; supplier package specified as 780-FBGA (29×29) for compact, high-pin-count board designs.
  • Voltage Supply  Core supply range specified from 870 mV to 980 mV, enabling precise power budgeting in system designs.
  • Operating Range  Industrial temperature rating from −40°C to 100°C for deployment in temperature-challenging environments.
  • Family Capabilities  As part of the Arria 10 family, the device series includes power-saving technologies and supports features such as PCIe Gen1–Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers.

Typical Applications

  • Wireless Infrastructure  Channel processing and backhaul aggregation where high logic density and on-chip memory accelerate baseband and control functions.
  • Wireline Networking  Line cards and transport modules that require programmable packet processing and high-speed serial connectivity.
  • Broadcast and Professional AV  Studio switching, video transport and processing applications that benefit from large programmable logic and substantial embedded RAM.
  • Compute and Storage Acceleration  Server acceleration, flash cache and cloud compute offload using custom logic and memory for low-latency tasks.
  • Medical and Defense Systems  Imaging, radar and secure communications where industrial temperature range and programmable logic flexibility are needed.

Unique Advantages

  • High programmable density: 480,000 logic elements enable integration of large custom datapaths and complex control logic into a single device, reducing board-level component count.
  • Significant on-chip RAM: 5,664,768 bits of embedded memory support buffering, caching and state storage without relying solely on external memory.
  • Broad I/O count: 360 I/O pins provide the flexibility to connect multiple interfaces and memory devices directly to the FPGA fabric.
  • Industrial temperature rating: −40°C to 100°C qualification supports deployment in temperature-demanding environments for robust field operation.
  • Compact, high-pin package: 780-BBGA / FCBGA (supplier: 780-FBGA, 29×29) balances board space with high I/O and thermal considerations for densely packed systems.
  • Family-level power efficiency: Built on the Arria 10 20 nm architecture with power-saving technologies to help manage system-level energy consumption.

Why Choose 10AX048E2F29I1SG?

The 10AX048E2F29I1SG positions itself as a high-capacity, industrial-grade Arria 10 GX FPGA optimized for mid-range, performance-sensitive applications. Its combination of 480,000 logic elements, multi-megabit on-chip RAM and 360 I/Os makes it suitable for designs that require consolidation of complex functions into a single programmable device.

Choose this device when your design needs scalable programmable logic, substantial embedded memory, and a robust industrial operating range—backed by the Arria 10 family’s architectural features and power-aware design.

Request a quote or submit an inquiry to get pricing, availability, and delivery options for the 10AX048E2F29I1SG.

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