10AX048E2F29I1SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 5664768 480000 780-BBGA, FCBGA |
|---|---|
| Quantity | 22 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 13 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 183590 | Number of Logic Elements/Cells | 480000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5664768 |
Overview of 10AX048E2F29I1SG – Arria 10 GX FPGA, 480,000 logic elements, 780-FBGA (29×29)
The 10AX048E2F29I1SG is an Intel Arria 10 GX field-programmable gate array (FPGA) offering a high-density, power-conscious 20 nm architecture for mid-range applications. This device combines 480,000 logic elements with embedded memory and high pin-count I/O to address networking, broadcast, compute acceleration and other performance-sensitive markets.
Designed for surface-mount deployment in a 780-BBGA / FCBGA package (supplier package: 780-FBGA, 29×29) and rated for industrial temperature operation, the device targets designs that require significant programmable logic, substantial on-chip RAM, and a flexible I/O complement.
Key Features
- Logic Capacity 480,000 logic elements, enabling large-scale programmable logic implementations and complex custom datapaths.
- Embedded Memory 5,664,768 total RAM bits on-chip to support deep buffers, on-chip caches, and custom memory structures.
- I/O Density 360 general-purpose I/O pins for broad connectivity to peripherals, memory interfaces, and high-speed front-ends.
- Package and Mounting 780-BBGA, FCBGA package with surface-mount mounting; supplier package specified as 780-FBGA (29×29) for compact, high-pin-count board designs.
- Voltage Supply Core supply range specified from 870 mV to 980 mV, enabling precise power budgeting in system designs.
- Operating Range Industrial temperature rating from −40°C to 100°C for deployment in temperature-challenging environments.
- Family Capabilities As part of the Arria 10 family, the device series includes power-saving technologies and supports features such as PCIe Gen1–Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers.
Typical Applications
- Wireless Infrastructure Channel processing and backhaul aggregation where high logic density and on-chip memory accelerate baseband and control functions.
- Wireline Networking Line cards and transport modules that require programmable packet processing and high-speed serial connectivity.
- Broadcast and Professional AV Studio switching, video transport and processing applications that benefit from large programmable logic and substantial embedded RAM.
- Compute and Storage Acceleration Server acceleration, flash cache and cloud compute offload using custom logic and memory for low-latency tasks.
- Medical and Defense Systems Imaging, radar and secure communications where industrial temperature range and programmable logic flexibility are needed.
Unique Advantages
- High programmable density: 480,000 logic elements enable integration of large custom datapaths and complex control logic into a single device, reducing board-level component count.
- Significant on-chip RAM: 5,664,768 bits of embedded memory support buffering, caching and state storage without relying solely on external memory.
- Broad I/O count: 360 I/O pins provide the flexibility to connect multiple interfaces and memory devices directly to the FPGA fabric.
- Industrial temperature rating: −40°C to 100°C qualification supports deployment in temperature-demanding environments for robust field operation.
- Compact, high-pin package: 780-BBGA / FCBGA (supplier: 780-FBGA, 29×29) balances board space with high I/O and thermal considerations for densely packed systems.
- Family-level power efficiency: Built on the Arria 10 20 nm architecture with power-saving technologies to help manage system-level energy consumption.
Why Choose 10AX048E2F29I1SG?
The 10AX048E2F29I1SG positions itself as a high-capacity, industrial-grade Arria 10 GX FPGA optimized for mid-range, performance-sensitive applications. Its combination of 480,000 logic elements, multi-megabit on-chip RAM and 360 I/Os makes it suitable for designs that require consolidation of complex functions into a single programmable device.
Choose this device when your design needs scalable programmable logic, substantial embedded memory, and a robust industrial operating range—backed by the Arria 10 family’s architectural features and power-aware design.
Request a quote or submit an inquiry to get pricing, availability, and delivery options for the 10AX048E2F29I1SG.

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