10AX048E2F29I2SG

IC FPGA 360 I/O 780FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 5664768 480000 780-BBGA, FCBGA

Quantity 971 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA, FC (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs183590Number of Logic Elements/Cells480000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits5664768

Overview of 10AX048E2F29I2SG – Arria 10 GX FPGA, 780‑BBGA FCBGA, 360 I/O

The 10AX048E2F29I2SG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) supplied in a 780‑ball BGA package (29×29) and intended for surface-mount applications. It delivers midrange, high-performance silicon with a focus on power efficiency and integration for applications across wireless, wireline, broadcast, computing, medical, and defense markets.

This device provides a large logic fabric and embedded memory combined with flexible I/O and industry-grade environmental specifications, making it suitable for performance- and temperature-sensitive designs that require significant on-chip resources.

Key Features

  • Logic Fabric — 480,000 logic elements provide substantial programmable capacity for complex digital designs and custom IP integration.
  • Embedded Memory — 5,664,768 total RAM bits of on-chip memory to support buffering, packet processing, and data-intensive functions.
  • I/O Capacity — 360 I/O pins to interface with multiple external devices and high-density board-level connectivity.
  • Power and Voltage — Operates with a supply voltage range of 870 mV to 980 mV, enabling compatibility with modern low-voltage power domains.
  • Package and Mounting — 780‑BBGA (FCBGA) package, 29×29, surface-mount form factor for robust board integration.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
  • Device Family Capabilities — Part of the Intel Arria 10 family, which notes features such as adaptive logic modules, variable-precision DSP blocks, embedded memory blocks, and clock networks with PLLs as device-level capabilities.
  • Serial and Protocol Support (Device-level) — The Arria 10 family documentation references low-power serial transceivers, enhanced PCS hard IP for high-speed protocols, and PCIe hard IP options at the device level.
  • Standards and Compliance — RoHS compliant.

Typical Applications

  • Wireless Infrastructure — Channel and switch cards, remote radio head functions, and mobile backhaul where high logic density and power efficiency are required.
  • Wireline and Networking — 40G/100G muxponders, transponders, and line cards that leverage large on-chip memory and configurable I/O for packet processing and aggregation.
  • Broadcast and Video — Studio switches, video transport, and high-performance audio/video processing using abundant logic and embedded RAM.
  • Computing and Storage — Flash cache and server acceleration tasks that need substantial programmable logic and memory resources.
  • Medical and Defense Systems — Diagnostic imaging, radar, and secure communications where industrial temperature range and high integration are beneficial.

Unique Advantages

  • High logic density: 480,000 logic elements enable complex algorithms and multi-function designs on a single device, reducing the need for multiple FPGAs.
  • Large on-chip RAM: 5,664,768 total RAM bits support buffering and data-path acceleration without external memory for many use cases.
  • Generous I/O: 360 I/Os simplify board routing and enable connections to numerous peripherals, transceivers, and memory interfaces.
  • Industrial operating range: −40 °C to 100 °C supports deployment in demanding temperature environments.
  • Power-conscious silicon: The Arria 10 family emphasizes power efficiency and includes device-level power-saving technologies to help manage system power budgets.
  • Robust packaging: 780‑ball FCBGA (29×29) surface-mount package provides a compact, board-friendly footprint for high-density designs.

Why Choose 10AX048E2F29I2SG?

The 10AX048E2F29I2SG positions itself as a high-capacity, power-aware midrange FPGA within the Intel Arria 10 family. Its combination of 480,000 logic elements, more than 5.6 million bits of embedded RAM, and 360 I/Os makes it well suited to designs that require substantial on-chip resources, flexible interfacing, and deployment over a broad temperature range.

For engineering teams targeting wireless, networking, broadcast, compute acceleration, medical imaging, or defense systems, this device offers the integration and performance characteristics needed to consolidate functionality, simplify board-level design, and support long-lived deployments in industrial environments.

Request a quote or submit a procurement inquiry today to evaluate 10AX048E2F29I2SG for your next high-performance, industrial FPGA design.

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