10AX048E2F29I1HG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 5664768 480000 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,020 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 183590 | Number of Logic Elements/Cells | 480000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5664768 |
Overview of 10AX048E2F29I1HG – Arria 10 GX FPGA, 480,000 Logic Elements, 780‑BBGA
The 10AX048E2F29I1HG is an Intel Arria 10 GX field‑programmable gate array (FPGA) device built on the Arria 10 device family architecture. It combines a high logic density fabric and embedded memory with family‑level features for serial transceivers, DSP blocks, and external memory interfacing to address mid‑range, performance‑sensitive applications.
Target markets include wireless and wireline communications, broadcast, computing and storage, medical imaging, and military applications where a combination of logic capacity, embedded RAM and industrial temperature operation are required.
Key Features
- Core logic — 480,000 logic elements to implement complex programmable logic and custom acceleration functions.
- Logic fabric details — Arria 10 family architecture with adaptive logic modules and variable‑precision DSP blocks as part of the device family feature set.
- On‑chip memory — 5,664,768 total RAM bits of embedded memory for buffering, caches, and in‑logic data storage.
- I/O and interfaces — 360 general purpose I/O pins; device family supports low‑power serial transceivers, PCIe hard IP and external memory interfaces per the Arria 10 family documentation.
- Power — Operates from a core voltage supply range of 870 mV to 980 mV, allowing integration with system power rails designed for Arria 10 devices.
- Thermal and grade — Industrial grade device rated for an operating temperature range of −40 °C to 100 °C.
- Package and mounting — 780‑FBGA (29 × 29) FCBGA package, surface‑mount mounting type suitable for compact system designs.
- Compliance — RoHS‑compliant for lead‑free assembly and environmental regulatory alignment.
Typical Applications
- Wireless systems: Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging the device family’s performance and transceiver support.
- Wireline networking: 40G/100G muxponders, transponders and line cards where programmable logic and external memory interfaces are required.
- Broadcast and professional AV: Studio switches, servers and transport functions that require high logic density and embedded memory for video processing.
- Computing and storage: Server acceleration, flash cache and cloud compute elements that benefit from reconfigurable logic and on‑chip RAM.
- Medical and defense systems: Diagnostic imaging, radar and secure communications applications that require industrial temperature operation and high integration.
Unique Advantages
- High logic density: 480,000 logic elements provide substantial programmable capacity to consolidate functions and reduce external components.
- Significant on‑chip memory: 5,664,768 bits of embedded RAM support large buffering and data‑intensive algorithms without immediate need for external memory.
- Comprehensive I/O: 360 I/O pins plus family support for serial transceivers and PCIe hard IP enable flexible system interfacing and high‑speed links.
- Industrial temperature rating: −40 °C to 100 °C operation supports deployment in temperature‑sensitive and ruggedized environments.
- Compact, manufacturable package: 780‑FBGA (29×29) FCBGA surface‑mount package balances board integration density and thermal considerations.
- Regulatory readiness: RoHS compliance simplifies assembly and meets common environmental requirements.
Why Choose 10AX048E2F29I1HG?
The 10AX048E2F29I1HG positions itself as a mid‑range, high‑density Arria 10 GX FPGA that combines large logic capacity and embedded memory with family‑level capabilities for DSP, serial transceivers and external memory interfacing. Its industrial temperature rating and robust package make it suitable for systems that require durable operation and significant on‑device resources.
Design teams looking to consolidate functionality, accelerate compute‑intensive algorithms, or implement complex I/O and data‑path logic will find the device’s mix of logic, RAM and I/O compelling. Backed by Intel Arria 10 family documentation and support resources, the part supports scalable designs and long‑term deployment needs.
Request a quote or contact sales to discuss availability and volume pricing for 10AX048E2F29I1HG or to request technical procurement details.

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