10AX048E2F29E2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 5664768 480000 780-BBGA, FCBGA |
|---|---|
| Quantity | 131 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA, FC (29x29) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 183590 | Number of Logic Elements/Cells | 480000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5664768 |
Overview of 10AX048E2F29E2LG – Arria 10 GX FPGA, 780‑BBGA FCBGA
The 10AX048E2F29E2LG is an Intel Arria 10 GX field‑programmable gate array supplied in a 780‑ball FCBGA (29 × 29) package. It delivers a high resource count for midrange FPGA applications with 480,000 logic elements, 5,664,768 total RAM bits and 360 general‑purpose I/O.
Part of the Arria 10 family of 20‑nm midrange FPGAs, this device is positioned for applications that require a balance of performance and power efficiency across markets such as wireless, wireline, broadcast, computing and medical systems. It is an extended‑grade, surface‑mount FPGA with a 0 °C to 100 °C operating range and RoHS compliance.
Key Features
- Logic Capacity — 480,000 logic elements provide substantial programmable logic resources for complex designs and custom processing functions.
- Embedded Memory — 5,664,768 total RAM bits supporting on‑chip buffering, packet processing, and data‑stream storage needs.
- I/O — 360 I/O pins to support broad interfacing options for external memory, transceivers, and system peripherals.
- Package & Mounting — 780‑ball BGA (FCBGA) in a 29 × 29 supplier device package; surface mount for PCB integration.
- Power Supply Range — Core voltage support from 870 mV to 980 mV for core power planning and supply design.
- Temperature & Grade — Extended grade device rated for 0 °C to 100 °C operation for commercial and certain demanding environments.
- Compliance — RoHS‑compliant construction for regulatory and assembly needs.
- Arria 10 Family Capabilities — Family‑level features documented for Arria 10 devices include DSP blocks, embedded memory architectures, PLL clock sources, PCIe Gen1/2/3 hard IP, low‑power serial transceivers and enhanced PCS hard IP for high‑speed interfaces.
Typical Applications
- Wireless Infrastructure — Channel and switch card implementations where programmable logic is used for baseband processing and data plane functions.
- Wireline Optics & Switching — 40G/100G muxponder, transponder and line card designs that require on‑chip packet processing and high‑speed interface support.
- Broadcast & Media — Studio switching, video transport and professional audio/video processing leveraging on‑chip memory and logic density.
- Computing & Storage — Server acceleration, flash cache and cloud compute functions that benefit from programmable acceleration and buffering resources.
- Medical & Defense Systems — Diagnostic imaging, radar and electronic warfare subsystems that use high logic density and embedded memory for real‑time processing.
Unique Advantages
- High Logic Density: 480,000 logic elements enable complex, high‑parallelism designs without immediate migration to larger device families.
- Substantial On‑Chip Memory: 5,664,768 RAM bits reduce external memory dependence for many buffering and intermediate data‑storage requirements.
- Broad I/O Count: 360 I/O pins support diverse interface mixes and system expansion without extensive external logic.
- Arria 10 Architecture: Family features such as DSP blocks, PLLs and hard IP for PCIe and high‑speed serial links provide a foundation for common communication and signal‑processing tasks.
- Practical Packaging: 780‑ball FCBGA (29 × 29) surface‑mount package simplifies board layout for high‑pin‑count applications.
- Regulatory Compliance: RoHS conformity supports modern manufacturing and assembly requirements.
Why Choose 10AX048E2F29E2LG?
The 10AX048E2F29E2LG provides a balanced combination of logic capacity, embedded memory and I/O resources within the Arria 10 family architecture. Its extended grade rating and surface‑mount 780‑ball FCBGA package make it suitable for demanding midrange applications across wireless, wireline, broadcast, computing, medical and defense markets where programmable flexibility and on‑chip integration reduce external BOM and accelerate design cycles.
Design teams seeking a midrange FPGA with documented Arria 10 family capabilities—along with clear electrical, thermal and package data for system planning—will find this device tailored for scalable, power‑sensitive implementations backed by Intel’s device documentation.
Request a quote or submit an inquiry for availability and pricing for part 10AX048E2F29E2LG to evaluate fit for your next design.

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