10AX048E1F29I1SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 5664768 480000 780-BBGA, FCBGA |
|---|---|
| Quantity | 39 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 13 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 183590 | Number of Logic Elements/Cells | 480000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5664768 |
Overview of 10AX048E1F29I1SG – Arria 10 GX FPGA, 480,000 logic elements
The 10AX048E1F29I1SG is an Intel Arria 10 GX field-programmable gate array (FPGA) implemented on a 20 nm mid-range device architecture. It combines high logic capacity and embedded memory with FPGA system features such as DSP blocks, PLLs, and serial I/O capabilities, targeting applications that require performance and power efficiency.
Typical market segments include wireless and wireline communications, broadcast, computing and storage, medical imaging, and other performance-sensitive industrial applications where programmable logic, on-chip memory, and flexible I/O are required.
Key Features
- Logic Capacity — 480,000 logic elements to implement large custom logic, control, and signal-processing functions.
- Embedded Memory — 5,664,768 total RAM bits for on-chip buffering, state storage, and memory-intensive algorithms.
- I/O and Packaging — 360 I/O pins in a 780-BBGA (29×29) FCBGA package; surface-mount device suitable for dense board integration.
- Power Supply — Core voltage supply range from 870 mV to 980 mV to match system power rails and enable defined power sequencing.
- Industrial Temperature Range — Rated for −40 °C to 100 °C operation for deployment in industrial environments.
- DSP and Clocking — Contains variable-precision DSP blocks and flexible clock networks with PLLs for precise timing and signal processing (series-level feature).
- High-Speed Interfaces — Series documentation indicates support for low-power serial transceivers and hardened protocol IP such as PCIe and Ethernet (series-level feature).
- Compliance — RoHS compliant.
Typical Applications
- Wireless Infrastructure — Channel cards, switch cards, and remote radio head functions that require programmable logic and on-chip memory for data aggregation and processing.
- Wireline and Networking — Line cards, muxponders, and transponders where programmable I/O, protocol hard IP, and on-chip buffering are used for high-throughput packet handling.
- Broadcast and AV Transport — Studio switches and professional audio/video systems that need flexible signal routing and deterministic logic control.
- Computing and Storage — Server acceleration and flash-cache controllers leveraging DSP resources and embedded memory for offload and caching tasks.
- Medical and Industrial Imaging — Diagnostic imaging and scanner systems that benefit from high logic density and programmable processing blocks.
Unique Advantages
- Large programmable fabric: 480,000 logic elements provide capacity for complex algorithms, state machines, and interface bridging without external logic.
- Significant on-chip memory: Over 5.6 million RAM bits reduce external memory dependence and improve latency for buffering and real-time processing.
- Integrated signal-processing resources: Variable-precision DSP blocks and PLL-based clocking support numerically intensive and timing-sensitive designs (series-level capabilities).
- Industrial-ready operating range: −40 °C to 100 °C temperature rating supports deployment in demanding industrial environments.
- High-density package: 780-BBGA (29×29) surface-mount package enables compact board layouts while providing 360 I/O for flexible system connectivity.
- Standards and protocol support (series-level): Documentation indicates integrated hard IP and transceiver capabilities for common high-speed interfaces, simplifying protocol implementation.
Why Choose 10AX048E1F29I1SG?
The 10AX048E1F29I1SG delivers a balance of high logic capacity, substantial embedded memory, and industrial-grade operating range—making it well suited for mid-range to high-performance embedded systems. Its package and I/O complement allow dense board integration while the device-level features documented for the Arria 10 family (DSP blocks, PLLs, serial transceivers, and hard IP) provide a flexible platform for communications, compute acceleration, and imaging tasks.
Designed and supported by Intel, this Arria 10 GX device is appropriate for engineers and procurement teams building scalable, robust systems that require programmable logic, on-chip resources, and documented series-level capabilities for power-efficient performance.
Request a quote or submit a procurement inquiry today to evaluate 10AX048E1F29I1SG for your next design project.

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