10AX048E1F29E1SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 5664768 480000 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,246 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 13 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 183590 | Number of Logic Elements/Cells | 480000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5664768 |
Overview of 10AX048E1F29E1SG – Arria 10 GX FPGA, 780-BBGA FCBGA
The 10AX048E1F29E1SG is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 780-ball BGA (29×29) FCBGA package. It delivers a mid-range FPGA architecture optimized for performance and power efficiency across a variety of communications, broadcast, computing and defense applications.
Built for designs requiring high logic density, embedded memory and flexible I/O and transceiver resources, this device targets wireless and wireline infrastructure, server acceleration, video and imaging, and other applications where integration and power-aware performance matter.
Key Features
- Logic Capacity 480,000 logic elements provide substantial on-chip programmable logic for complex algorithms and custom processing pipelines.
- Embedded Memory 5,664,768 total RAM bits for on-chip storage, buffering and state retention to support high-throughput designs.
- I/O Density 360 general-purpose I/Os to interface with external memory, peripherals and board-level signals.
- Package & Mounting 780-BBGA (FCBGA) package, supplier package 780-FBGA (29×29), designed for surface-mount assembly.
- Power and Voltage Core supply range specified at 870 mV to 980 mV to support power-optimized designs.
- Operating Range Extended grade with an operating temperature range of 0 °C to 100 °C for a wide set of commercial and industrial-adjacent environments.
- Family-Level Capabilities Arria 10 family features such as variable-precision DSP blocks, embedded memory blocks, PLL clock sources, PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for high-speed protocols, and low-power serial transceivers—enabling common mid-range FPGA use cases.
- Manufacturing and Compliance Surface-mount package and RoHS-compliant construction for modern PCB assembly and regulatory requirements.
Typical Applications
- Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging on-chip logic and DSP resources for signal processing.
- Wireline Networking 40G/100G muxponders, transponders and line cards using high-speed serial transceivers and PCIe hard IP for packet and transport processing.
- Broadcast & Video Studio switches, transport and videoconferencing equipment that require flexible I/O and embedded memory for frame buffering and format conversion.
- Computing & Storage Server acceleration and flash-cache controllers where programmable logic and embedded RAM accelerate data-paths and offload tasks from CPUs.
- Medical & Defense Systems Diagnostic imaging, radar and guidance subsystems that utilize the device’s processing resources and extended temperature capability for reliable operation.
Unique Advantages
- High Logic Density: 480,000 logic elements enable large-scale custom logic and system integration on a single device, reducing external component count.
- Substantial On-Chip Memory: Over 5.6 Mbits of RAM bits to support buffering, look-up tables and stateful processing without immediate dependence on external memory.
- Extensive I/O: 360 I/Os provide flexible board-level interfacing for multi-protocol systems and high-pin-count peripherals.
- Family Feature Set: Arria 10 family capabilities—DSP blocks, PLLs, PCIe hard IP and low-power transceivers—enable common high-performance functions without adding external IP blocks.
- Power-Focused Supply Range: Core voltage range (870 mV–980 mV) aligns with power-optimized system designs to help manage thermal and energy budgets.
- Production-Ready Packaging: 780-BBGA surface-mount package in a 29×29 footprint supports high-density PCB layouts and automated assembly workflows.
Why Choose 10AX048E1F29E1SG?
The 10AX048E1F29E1SG positions itself as a mid-range, performance- and power-aware FPGA option within the Intel Arria 10 GX family. With 480,000 logic elements, multi-megabit embedded RAM, and hundreds of I/Os in a compact 780-BBGA package, it is suited to designs that require significant on-chip processing, flexible interfacing and family-level features such as DSP blocks and high-speed transceivers.
This device is well matched to teams developing communications equipment, video and imaging systems, server accelerators and defense electronics who need a balance of integration, configurability and operational robustness across a 0 °C–100 °C range. The RoHS-compliant, surface-mount package and supported Arria 10 capabilities offer a clear path for scalable deployment and long-term platform support.
Request a quote or submit an inquiry to get pricing, availability and delivery information for the 10AX048E1F29E1SG Arria 10 GX FPGA.

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