10AX048E1F29E1HG

IC FPGA 360 I/O 780FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 5664768 480000 780-BBGA, FCBGA

Quantity 1,323 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeExtendedOperating Temperature0°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs183590Number of Logic Elements/Cells480000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits5664768

Overview of 10AX048E1F29E1HG – Arria 10 GX FPGA, 480000 logic elements, 780‑FBGA

The 10AX048E1F29E1HG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) supplied in a 780‑FBGA (29×29) surface‑mount package. It combines a high logic capacity and large embedded memory with I/O density and on‑device hard IP, making it suited to midrange designs that require performance and power efficiency.

Engineered as part of the Arria 10 family, this device targets applications in wireless, wireline, broadcast, computing and medical markets where system‑level integration, power efficiency and programmable hardware acceleration are priorities.

Key Features

  • Logic Capacity — Approximately 480,000 logic elements and 183,590 logic blocks provide substantial programmable fabric for complex digital designs.
  • Embedded Memory — 5,664,768 total RAM bits of on‑chip memory to support buffering, caching and state storage without external memory for many functions.
  • I/O Density — 360 user I/O pins to support wide parallel interfaces, multiple memory channels and diverse peripheral connectivity.
  • Power and Supply — Operates from a core voltage range of 870 mV to 980 mV, enabling compatibility with Arria 10 power domains and efficient core operation.
  • Package and Mounting — Delivered in a 780‑ball FCBGA package (29×29) for surface‑mount assembly, suitable for compact system boards.
  • Operating Range and Grade — Extended grade with an operating temperature range of 0 °C to 100 °C to match a variety of commercial and enterprise environments.
  • Family Features (from Arria 10 series) — Device family characteristics include 20 nm process architecture, power‑efficiency optimizations, variable‑precision DSP blocks, embedded memory block options, and hard IP for protocols such as PCIe and high‑speed Ethernet.
  • Compliance — RoHS compliant, supporting environmental requirements for lead‑free assembly.

Typical Applications

  • Wireless Infrastructure — Implements channel processing, backhaul and remote radio head functions where programmable logic and DSP resources accelerate signal processing tasks.
  • Wireline Networking — Serves in 40G/100G aggregation, muxponder and line‑card designs that require high I/O count and on‑chip memory for packet buffering and protocol handling.
  • Broadcast and Pro AV — Used in studio switching, video transport and encoding/decoding pipelines that benefit from large logic capacity and embedded memory.
  • Computing and Storage — Enables server acceleration, flash cache controllers and custom offload functions where on‑chip logic and memory reduce system latency.
  • Medical Diagnostic Equipment — Supports imaging and signal processing pipelines that require high throughput and programmable acceleration while fitting compact board layouts.

Unique Advantages

  • High Programmable Capacity: 480,000 logic elements and large logic block count enable complex custom hardware implementations without partitioning across multiple FPGAs.
  • Substantial Embedded Memory: Nearly 5.7 million RAM bits reduce reliance on external memory for buffering and state retention, simplifying system BOM and layout.
  • Robust I/O Count: 360 user I/Os provide flexibility to interface multiple high‑speed peripherals, memory channels and expansion headers on the same device.
  • Arria 10 Family Capabilities: Access to Arria 10 series features such as variable‑precision DSP blocks and hard protocol IP (as defined by the device family) accelerates development of communication and compute functions.
  • Compact, Standard Package: 780‑FBGA (29×29) surface‑mount package enables dense board integration while supporting high pin count I/O.
  • Environmentally Compliant: RoHS compliance supports modern lead‑free manufacturing processes.

Why Choose 10AX048E1F29E1HG?

The 10AX048E1F29E1HG is positioned for midrange designs that need a balance of large programmable fabric, embedded memory and substantial I/O in a compact package. Its inclusion in the Intel Arria 10 family brings device‑level features focused on performance and power efficiency, making it suitable for communications, compute acceleration and professional AV applications.

Designers seeking scalability and integration for enterprise and commercial systems will find the device’s logic density, on‑chip RAM and I/O resources beneficial for reducing system complexity and accelerating time to market.

Request a quote or submit your project requirements to receive pricing and availability for 10AX048E1F29E1HG. Our team can provide lead times and support for volume and prototype orders.

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