10AX032H4F35E3LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 21040128 320000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 571 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA, FC (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 384 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 119900 | Number of Logic Elements/Cells | 320000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21040128 |
Overview of 10AX032H4F35E3LG – Arria 10 GX Field Programmable Gate Array (FPGA), 320,000 logic elements, 1152-BBGA
The 10AX032H4F35E3LG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) offered in a 1152-BBGA surface-mount package. As part of the Arria 10 device family, it delivers 20 nm mid-range FPGA architecture targeted at high-performance, power-sensitive midrange applications across diverse markets.
With 320,000 logic elements, 21,040,128 bits of embedded RAM, and 384 I/O, this device is built for complex digital signal processing, high-speed interfaces, and system-level integration where performance and power efficiency are key design drivers.
Key Features
- Core Capacity — 320,000 logic elements for implementing large-scale logic and control functions.
- Embedded Memory — 21,040,128 total RAM bits to support deep buffering, on-chip data storage, and memory-intensive algorithms.
- I/O Density — 384 I/O pins to connect multiple external interfaces and peripherals.
- Process and Efficiency — Part of the Intel Arria 10 family built on 20 nm technology and designed for improved performance and power efficiency.
- Package and Mounting — Surface-mount 1152-BBGA (FCBGA); supplier device package listed as 1152-FBGA, FC (35×35), enabling compact board integration.
- Power Supply — Core voltage supply range of 870 mV to 980 mV for compatible power-rail design.
- Operating Range and Grade — Extended-grade device rated for 0 °C to 100 °C operation.
Typical Applications
- Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul implementations leveraging high logic density and embedded memory.
- Wireline Communications — 40G/100G muxponders, transponders and line cards that benefit from high I/O count and programmable transceiver integration.
- Broadcast and Professional AV — Studio switches, videoconferencing and professional audio/video processing where on-chip memory and logic accelerate media handling.
- Computing and Storage — Server acceleration and flash cache applications that use the device’s logic capacity and embedded RAM for caching and custom data paths.
- Medical and Defense Systems — Diagnostic imaging, radar and electronic warfare functions that require configurable logic and embedded resources for algorithm deployment.
Unique Advantages
- High Logic Density: 320,000 logic elements enable complex control, DSP and protocol implementations without external logic expansion.
- Substantial On-Chip Memory: Over 21 million bits of embedded RAM reduce external memory dependence and improve data throughput for streaming and buffering tasks.
- Robust I/O Capability: 384 I/O pins provide flexible interfacing options for multiport and high-channel-count designs.
- Compact, Surface-Mount Packaging: 1152-BBGA (1152-FBGA supplier package) offers a high-density footprint suitable for space-constrained PCBs.
- Designed for Power Efficiency: As an Arria 10 device, it incorporates power-saving technologies targeting improved performance per watt for midrange systems.
- Extended Operating Range: Extended-grade rating with 0 °C to 100 °C operation supports a wide range of commercial and industrial-adjacent deployments.
Why Choose 10AX032H4F35E3LG?
The 10AX032H4F35E3LG positions itself as a high-capacity, power-conscious midrange FPGA within the Intel Arria 10 family. It brings together significant logic resources, large embedded memory, and substantial I/O in a compact 1152-BBGA package to address demanding signal-processing, communications, and system-acceleration tasks.
Design teams seeking a programmable platform that balances performance, integration, and thermal/power characteristics will find this device suitable for scalable designs across wireless, wireline, broadcast, computing, medical, and defense markets. Its extended-grade rating and documented Arria 10 device family features provide a foundation for long-term deployment and development.
Request a quote or submit a purchase inquiry to obtain pricing, lead-time, and availability for the 10AX032H4F35E3LG Arria 10 GX FPGA.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018