10AX032H4F34I3LG

The 10AX032H4F34I3LG is an Intel Arria 10 GX field programmable gate array (FPGA) packaged in a 1152‑ball FCBGA/FBGA (35×35 mm) format. It belongs to the Arria 10 device family of 20 nm mid‑range FPGAs and SoCs designed for high‑performance, power‑sensitive midrange applications.

This device combines high logic capacity, substantial on‑chip RAM, and a large I/O complement to address demanding applications in wireless and wireline infrastructure, broadcast and professional AV, computing and storage, and medical imaging.

Key Features

• Core logic — 320,000 logic elements provide substantial programmable capacity for complex digital designs and system acceleration.
• On‑chip memory — 21,040,128 total RAM bits support large buffering, lookup tables, and data path storage directly on the FPGA fabric.
• I/O capacity — 384 I/O pins enable wide external interfacing for high‑density routing to memory, PHYs, and peripherals.
• Package and mounting — Available in 1152‑BBGA / FCBGA and 1152‑FBGA (FC, 35×35 mm) packages; surface mount construction suited for automated PCB assembly.
• Power envelope — Core voltage supply specified from 0.870 V to 0.980 V, enabling operation within a defined low‑voltage power domain.
• Thermal and grade — Industrial grade operation across −40 °C to +100 °C for deployment in temperature‑challenging environments.
• Family capabilities (Arria 10) — Device family features called out in the Arria 10 overview include variable‑precision DSP blocks, embedded memory blocks, low‑power serial transceivers, PCIe Gen1/2/3 hard IP, 10 Gbps Ethernet support, clock networks with PLLs, dynamic and partial reconfiguration, SEU detection/correction, and power management.
• Compliance — RoHS compliant for environmental and regulatory conformance.

Typical Applications

• Wireless infrastructure — Baseband processing, channel cards, and remote radio head aggregation where high logic density and on‑chip memory reduce external BOM and latency.
• Wireline and networking — Line cards, muxponders, and aggregation platforms leveraging high I/O count and family transceiver/IP options for high‑speed links and packet processing.
• Broadcast and professional AV — Video processing, format conversion, and routing systems that benefit from large on‑chip RAM and reconfigurable DSP resources.
• Computing and storage — Acceleration, caching, and data path offload in servers and storage appliances using the device’s logic and memory resources.

Unique Advantages

• High programmable capacity: 320,000 logic elements enable implementation of complex custom logic, accelerators, and protocol stacks on a single device.
• Substantial embedded RAM: Over 21 million bits of on‑chip RAM reduce reliance on external memory for buffering and fast lookup operations.
• Large I/O complement: 384 I/O pins allow broad interfacing options for parallel buses, multi‑lane PHYs, and extensive peripheral connectivity.
• Industrial temperature rating: −40 °C to +100 °C operation supports deployment in demanding ambient conditions without derating design functionality.
• Low‑voltage core operation: 0.870–0.980 V core supply supports power‑sensitive system designs and helps manage overall board power consumption.
• Proven family features: Arria 10 family capabilities such as DSP blocks, serial transceivers, PCIe and Ethernet hard IP, and partial reconfiguration enable flexible system architectures and runtime adaptability.

Why Choose 10AX032H4F34I3LG?

The 10AX032H4F34I3LG positions itself for midrange, performance‑centric designs that require a balance of logic density, on‑chip memory, and broad I/O. Its Arria 10 GX heritage brings a set of family features for DSP, transceivers, and hard IP that accelerate time to market for communication, compute, and imaging applications.

Engineers targeting systems that must operate across industrial temperature ranges and within a defined low‑voltage core domain will find this device a capable building block. The combination of logic capacity, embedded RAM, and packaging options supports scalable designs and integration into complex PCBs with automated assembly.

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