10AX032H4F34I3SG

The 10AX032H4F34I3SG is an Intel Arria 10 GX field‑programmable gate array (FPGA) provided in a 1152‑ball FCBGA package. This device combines a high logic element count with substantial embedded RAM and a broad complement of I/O to address midrange, performance‑sensitive applications.

Designed for applications that require high integration and flexible programmable logic, this Arria 10 GX part delivers 320,000 logic elements, 21,040,128 total RAM bits and 384 I/O pins while supporting industrial temperature operation.

Key Features

• Logic Capacity — 320,000 logic elements suitable for complex digital designs and system integration.
• On‑chip Memory — 21,040,128 total RAM bits for large buffering, packet processing, or algorithmic storage requirements.
• I/O Count — 384 I/O pins to support multiple interfaces, parallel buses, and high channel counts.
• Power Supply Range — Core voltage supply range of 870 mV to 980 mV to match system power architectures.
• Thermal and Environmental — Industrial temperature rating from −40 °C to 100 °C for deployment in harsh environments.
• Package and Mounting — Surface‑mount 1152‑BBGA (FCBGA) package, supplier package specified as 1152‑FBGA, FC (35×35), for dense board integration.
• Arria 10 Family Features (device series) — Series capabilities include variable‑precision DSP blocks, embedded memory blocks and advanced clocking and PLL options, as described for the Arria 10 device family.

Typical Applications

• Wireless infrastructure — Channel and switch cards, remote radio head functions and mobile backhaul equipment leveraging programmable logic for signal processing and control.
• Wireline networking — Line cards, muxponders and transponders where large on‑chip RAM and significant logic capacity enable packet processing and aggregation.
• Broadcast and video — Studio switching, video transport and conferencing systems that require buffering and custom processing pipelines.
• Computing and storage acceleration — Server offload, flash cache controllers and cloud acceleration tasks that benefit from dense logic and memory resources.
• Industrial and medical systems — Control, imaging and diagnostic equipment using programmable logic within an industrial temperature range.

Unique Advantages

• High integration density: 320,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing board complexity and BOM count.
• Large on‑chip memory: Over 21 million bits of RAM on the device enable substantial buffering, lookup tables and local storage without external memory.
• Generous I/O resources: 384 I/O pins provide flexibility to interface with numerous peripherals, buses and parallel interfaces concurrently.
• Industrial temperature support: Rated for −40 °C to 100 °C operation to meet the demands of harsh and industrial environments.
• Compact, manufacturable package: 1152‑ball FCBGA in a 35×35 supplier footprint supports dense routing while remaining surface‑mount manufacturable.
• Series‑level architectural features: The Arria 10 family includes DSP blocks, embedded memory types, and advanced clocking and PLL resources to support diverse midrange applications.

Why Choose 10AX032H4F34I3SG?

This Arria 10 GX FPGA part combines substantial logic density, large embedded RAM and a wide I/O complement in an industrial‑rated FCBGA package, making it well suited for midrange systems that require programmable performance and reliability. The device aligns with applications that demand integration of complex logic, buffering and multiple interfaces while operating across a broad temperature range.

Backed by the Arria 10 device family documentation and design resources, 10AX032H4F34I3SG provides a scalable platform for developers and system designers seeking a balance of performance, integration and robustness for communications, compute acceleration, broadcast and industrial applications.

Request a quote or submit an RFQ today to check availability and discuss pricing and lead times for 10AX032H4F34I3SG.