10AX032H4F34E3LG

IC FPGA 384 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 21040128 320000 1152-BBGA, FCBGA

Quantity 33 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O384Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs119900Number of Logic Elements/Cells320000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits21040128

Overview of 10AX032H4F34E3LG – Arria 10 GX FPGA, 320000 logic elements

The 10AX032H4F34E3LG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 1152-BBGA FCBGA package, designed for mid-range, performance-sensitive applications. Built on the Arria 10 device family architecture, this device targets applications that require high logic density, large embedded memory, and flexible high-speed I/O.

As part of the Arria 10 family, the device emphasizes performance and power efficiency through architecture-level power-saving features and supports advanced I/O and connectivity options suitable for wireless, wireline, broadcast, computing, medical, and secure communications systems.

Key Features

  • Core Logic — 320,000 logic elements providing substantial programmable compute resources for complex finite state machines, protocol offloads, and custom accelerators.
  • Embedded Memory — 21,040,128 total RAM bits for large on-chip buffering, packet storage, or lookup tables.
  • I/O and Packaging — 384 user I/Os in a 1152-BBGA (FCBGA, 35×35) surface-mount package suited for high-density board designs.
  • Power Supply — Supported core voltage range from 870 mV to 980 mV for core power domains.
  • Operating Conditions — Extended grade with an operating temperature range of 0 °C to 100 °C for commercial-to-extended-environment deployments.
  • High-speed Connectivity — Arria 10 GX family features referenced in the product overview include low-power serial transceivers, PCIe Gen1/Gen2/Gen3 hard IP, and 10 Gbps Ethernet support for demanding link and protocol requirements.
  • DSP and Clocking — Family-level features such as variable-precision DSP blocks and a comprehensive PLL/clock network support high-performance signal processing and precise timing architectures.
  • Configuration and Reliability — Family capabilities include dynamic and partial reconfiguration workflows and SEU error detection and correction mechanisms to support maintainable, field-configurable systems.
  • RoHS Compliant — Device conforms to RoHS environmental requirements.

Typical Applications

  • Wireless Infrastructure — Channel and switch cards for remote radio heads and mobile backhaul that require programmable logic density and high-speed transceivers.
  • Wireline Networking — 40G/100G muxponders, transponders, and line cards where embedded memory and PCIe/10 GbE interfaces enable packet processing and aggregation.
  • Broadcast and Media — Studio switching, video transport, and professional audio/video processing leveraging large on-chip RAM and DSP resources.
  • Computing and Storage Acceleration — Server offload, flash cache, and acceleration tasks that benefit from high logic element counts and flexible I/O connectivity.
  • Medical and Imaging Systems — Diagnostic scanners and imaging pipelines that use programmable DSP blocks and embedded memory for real-time processing.

Unique Advantages

  • High programmable compute density: 320,000 logic elements enable substantial on-chip acceleration and custom logic implementation without external ASICs.
  • Large on-chip memory: 21,040,128 RAM bits reduce external memory dependency for buffering, packet queues, and lookup tables.
  • Dense I/O in a compact package: 384 I/Os in a 1152-BBGA FCBGA footprint support complex board-level routing and high pin-count interfaces.
  • Broad connectivity support: Family-level hard IP for PCIe Gen1/2/3 and 10 Gbps Ethernet plus low-power transceivers simplify integration of high-speed links.
  • Flexible power and thermal profile: Core voltage range of 870–980 mV and extended operating temperature (0 °C to 100 °C) support diverse deployment environments.
  • Field configurability and reliability: Partial/dynamic reconfiguration and SEU error detection and correction features support maintainable systems and in-field updates.

Why Choose 10AX032H4F34E3LG?

The 10AX032H4F34E3LG positions itself as a high-density, mid-range FPGA option within the Intel Arria 10 GX family, delivering a balance of logic capacity, embedded memory, and high-speed I/O in a compact FCBGA package. Its combination of 320,000 logic elements, over 21 million RAM bits, and family-level support for high-speed serial interfaces makes it suitable for designs that require significant on-chip processing and flexible connectivity.

Designers targeting wireless infrastructure, high-speed networking, media processing, server acceleration, or medical imaging can leverage the Arria 10 architecture and Intel documentation resources to develop scalable, power-aware systems with field-update capabilities and reliable configuration management.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the 10AX032H4F34E3LG.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up