10AX032H3F35I2LG

The 10AX032H3F35I2LG is an Intel Arria 10 GX Field Programmable Gate Array designed for mid-range, high‑performance and power‑sensitive applications. It integrates a large logic fabric, significant embedded memory, and flexible I/O in a 1152‑FBGA package targeted at industrial temperature environments.

Typical use cases include communications, compute and storage acceleration, broadcast and medical imaging systems where a balance of performance, power efficiency and integration is required.

Key Features

• Core Logic 320,000 logic elements provide substantial programmable logic capacity for complex designs.
• Embedded Memory 21,040,128 total RAM bits to support large on‑chip buffers, packet processing and caching functions.
• Programmable Logic Blocks Logic architecture consistent with the Arria 10 family, including adaptive logic and DSP resources referenced in product documentation.
• I/O and Interfaces 384 I/O pins enable broad external connectivity for high‑bandwidth peripherals and memory interfaces.
• Power Supply Range Core voltage supply from 870 mV to 930 mV to match precise board power rails.
• Package and Mounting 1152‑FBGA (35 × 35 mm) surface‑mount package (1152‑BBGA, FCBGA style) for dense PCB integration.
• Temperature and Grade Industrial grade operation from −40 °C to 100 °C for deployment in demanding environments.
• Standards and Compliance RoHS‑compliant for regulatory and manufacturing alignment.

Typical Applications

• Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging high logic density and embedded memory.
• Wireline and Optical Networking 40G/100G muxponders, transponders and line cards where programmable logic and high I/O count are required for protocol handling and packet processing.
• Broadcast and Professional AV Studio switches, transport and videoconferencing equipment that need flexible I/O and on‑chip buffering.
• Compute and Storage Acceleration Flash cache and cloud server acceleration use cases benefiting from large programmable fabric and RAM capacity.
• Medical and Defense Systems Diagnostic imaging, radar and secure communications that require industrial temperature operation and substantial processing resources.

Unique Advantages

• High logic density: 320,000 logic elements enable integration of complex functions and multiple subsystems on a single device.
• Large on‑chip memory: Over 21 million RAM bits reduce external memory dependence and improve deterministic data paths.
• Extensive I/O capability: 384 I/O pins allow broad interfacing options for high‑speed links and multiple peripherals.
• Industrial temperature range: −40 °C to 100 °C operation supports deployment in harsh or temperature‑variable environments.
• Compact, manufacturable package: 1152‑FBGA (35×35 mm) surface‑mount package enables high‑density PCB layouts while supporting standard assembly processes.
• Regulatory readiness: RoHS compliance aids integration into modern manufacturing supply chains.

Why Choose 10AX032H3F35I2LG?

The 10AX032H3F35I2LG Arria 10 GX FPGA positions itself as a flexible, high‑capacity programmable device for mid‑range systems requiring significant logic, memory and I/O integration. Its balance of 320,000 logic elements, 21,040,128 RAM bits and 384 I/O pins makes it suitable for communications, compute acceleration, broadcast and industrial applications that demand both performance and robustness.

Backed by Intel Arria 10 device documentation and design resources, this FPGA supports developers aiming to consolidate functionality, reduce board complexity and scale designs within the Arria 10 family footprint.

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