10AX032H3F35E2LG

The 10AX032H3F35E2LG is an Intel Arria 10 GX field programmable gate array provided in a 1152-ball BGA surface-mount package. It delivers a high logic density architecture with on-chip memory and extensive I/O for mid-range, performance-conscious applications.

Designed for markets such as wireless, wireline, broadcast, computing and storage, and defense, this device combines large logic capacity, substantial embedded RAM, and a wide I/O count while operating within a defined supply and temperature envelope.

Key Features

• Core Logic 320,000 logic elements for implementing complex custom logic and datapaths.
• Embedded Memory 21,040,128 total RAM bits to support large on-chip buffering, packet processing, and algorithm state storage.
• I/O Density 384 I/O pins to support wide parallel interfaces, multiple high-speed links, or mixed-signal front-end connections.
• Package and Mounting 1152-ball BGA (1152-FBGA, FC 35×35 mm) surface-mount package suitable for compact board designs.
• Power Supply Range Core voltage supply specified from 870 mV to 930 mV to match system power-rail planning.
• Operating Temperature Rated for operation from 0 °C to 100 °C (extended grade) for thermal planning in controlled environments.
• Environmental Compliance RoHS compliant to meet standard environmental and manufacturing requirements.

Typical Applications

• Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul equipment that need programmable logic and on-board memory.
• Wireline Communications 40G/100G muxponders, transponders, and line cards requiring flexible protocol handling and packet processing.
• Broadcast and Video Studio switches, professional audio/video processing, and videoconferencing systems that require real-time data handling and custom I/O.
• Computing and Storage Acceleration Flash cache controllers, cloud server acceleration, and storage front-end processing leveraging large logic and memory resources.
• Defense and Secure Communications Radar, electronic warfare, and secure communications subsystems where programmable hardware and substantial on-chip memory are required.

Unique Advantages

• High Logic Capacity: 320,000 logic elements enable complex finite-state machines, datapaths, and custom accelerators without external logic.
• Large On-Chip Memory: Over 21 million bits of embedded RAM minimize external memory dependence for buffering and real-time processing.
• Ample I/O for System Integration: 384 I/O pins allow direct interfacing to a wide range of peripherals and high-speed lanes, reducing the need for additional interface chips.
• Compact, Production-Ready Package: 1152-ball BGA (35×35 mm) supports high-density PCB designs while enabling automated surface-mount assembly.
• Defined Power and Thermal Envelope: Specified core voltage range (870–930 mV) and 0 °C to 100 °C operating range help with predictable power-supply and thermal design.
• Compliance and Manufacturing Fit: RoHS compliance aligns the device with common environmental and manufacturing requirements.

Why Choose 10AX032H3F35E2LG?

The 10AX032H3F35E2LG positions itself as a high-density Arria 10 GX FPGA option for designs that require substantial programmable logic, significant embedded RAM, and a broad I/O complement in a compact BGA package. Its specification set supports mid-range systems across communications, broadcast, computing, and defense markets where integration and predictable electrical and thermal characteristics are important.

For development teams and procurement looking for a vendor-backed FPGA with 20 nm Arria 10 family credentials, this device offers a balance of logic capacity, memory, and I/O in a surface-mount form factor, backed by RoHS compliance and extended-grade temperature operation.

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