10AX032H3F34E2SG

IC FPGA 384 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 21040128 320000 1152-BBGA, FCBGA

Quantity 1,270 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O384Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs119900Number of Logic Elements/Cells320000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits21040128

Overview of 10AX032H3F34E2SG – Arria 10 GX FPGA, 320000 logic elements, 1152‑BBGA

The 10AX032H3F34E2SG is an Intel Arria 10 GX field programmable gate array (FPGA) optimized for midrange designs that require high logic capacity and embedded memory. Built on the Arria 10 device family architecture, it targets high‑performance, power‑sensitive applications across communications, broadcast, computing, storage, medical, and defense markets.

This device combines a large logic fabric with substantial on‑chip RAM, flexible I/O, and package options suitable for surface‑mount assembly, enabling system designers to integrate complex digital functions with scalable performance and power efficiency.

Key Features

  • Logic Capacity – 320,000 logic elements to support complex combinational and sequential logic implementations.
  • Embedded Memory – 21,040,128 total RAM bits for large on‑chip buffering, lookup tables, and memory‑centric accelerators.
  • I/O and Interfaces – 384 I/O pins providing broad connectivity for parallel and serial interfaces and general‑purpose I/O needs.
  • Transceiver and Protocol Support – Arria 10 family features include low‑power serial transceivers, enhanced PCS hard IP, and support for high‑speed protocols such as PCIe Gen1/Gen2/Gen3 and 10 Gbps Ethernet (series‑level capabilities).
  • DSP and Timing – Variable‑precision DSP blocks and advanced clock networks with PLL clock sources and fractional synthesis for precise timing and high‑throughput signal processing (series‑level capabilities).
  • Power and Process – Part of a 20‑nm device family designed for power efficiency; device supply voltage range specified at 870 mV to 930 mV.
  • Package and Mounting – 1152‑BBGA (FCBGA) package, supplier package 1152‑FBGA FC (35×35), surface mount for compact board integration.
  • Operating Range and Compliance – Extended grade with an operating temperature range of 0 °C to 100 °C and RoHS compliance.

Typical Applications

  • Wireless Infrastructure – Channel and switch cards in remote radio heads and mobile backhaul nodes where high logic density and on‑chip memory accelerate baseband and control functions.
  • Wireline Networking – 40G/100G muxponders, transponders, and line cards leveraging the device's serial transceiver capabilities and protocol hard IP for high‑speed data transport.
  • Broadcast and Media – Studio switches, professional audio/video processing, and videoconferencing gear that benefit from large on‑chip RAM and DSP resources for real‑time media processing.
  • Computing and Storage – Flash caching, server acceleration, and cloud compute offload where logic capacity and embedded memory provide hardware acceleration for data‑intensive workloads.
  • Medical and Defense Systems – Diagnostic imaging, radar, and secure communications applications that require a balance of performance and power efficiency (series‑level suitability noted in datasheet content).

Unique Advantages

  • High Logic Density: 320,000 logic elements allow complex system functions and multiple concurrent accelerators on a single device, reducing board complexity.
  • Substantial On‑Chip Memory: Over 21 million RAM bits enable wide buffering, large tables, and efficient data staging without relying exclusively on external memory.
  • Broad I/O Count: 384 I/Os provide designers flexibility to interface with diverse peripherals, memory devices, and high‑speed links.
  • Integrated High‑Speed Features: Series‑level support for serial transceivers, enhanced PCS hard IP, and PCIe hard IP streamlines implementation of high‑bandwidth protocols.
  • Power‑Aware Architecture: Part of a 20‑nm, power‑efficient device family with a defined core voltage range (870 mV to 930 mV) to help manage system power budgets.
  • Production‑Ready Packaging: 1152‑BBGA surface‑mount package supports dense board layouts and standard assembly processes.

Why Choose 10AX032H3F34E2SG?

The 10AX032H3F34E2SG Arria 10 GX FPGA delivers a balance of high logic capacity, significant embedded memory, and extensive I/O in a production‑ready BGA package. It is positioned for designers who need midrange FPGA performance with attention to power efficiency and integration, enabling consolidation of multiple functions onto a single device.

This device is well suited for system designs in communications, broadcast, compute acceleration, and instrumentation where on‑chip resources, flexible I/O, and series‑level protocol support reduce board complexity and accelerate time‑to‑market.

Request a quote or submit your specifications to our sales team to get pricing, availability, and custom supply information for the 10AX032H3F34E2SG Arria 10 GX FPGA.

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