10AX032H2F35I2LG

The 10AX032H2F35I2LG is an Intel Arria 10 GX field programmable gate array (FPGA) supplied in a 1152‑BBGA (35×35) FCBGA package. It combines a high logic density with embedded memory and a broad I/O complement to address mid‑range, performance‑sensitive designs.

Target markets for this device include wireless and wireline communications, broadcast, computing and storage, medical imaging, and military and secure communications where performance, power efficiency, and integration are key.

Key Features

• Logic Capacity 320,000 logic elements provide substantial programmable logic resources for complex digital designs.
• Embedded Memory 21,040,128 total RAM bits for on‑chip storage and buffering in memory‑intensive functions.
• I/O Density 384 user I/O pins to support multiple high‑pin count interfaces and external device connectivity.
• Package 1152‑BBGA, FCBGA (supplier package: 1152‑FBGA, FC 35×35) suitable for high‑pin, surface‑mount board designs.
• Power Core voltage supply range of 870 mV to 980 mV allowing compatible low‑voltage power systems.
• Temperature Range Industrial operating range from −40 °C to 100 °C for deployment in demanding environments.
• Arria 10 Family Capabilities Series features include adaptive logic modules, variable‑precision DSP blocks, embedded memory blocks, PLL clock sources, PCIe Gen1/Gen2/Gen3 hard IP, serial transceivers, and enhanced PCS/Interlaken and 10 Gbps Ethernet support as described in the Arria 10 device overview.
• Mounting Surface mount device for standard PCB assembly processes.

Typical Applications

• Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging on‑chip DSP and transceiver capabilities.
• Wireline Networking 40G/100G muxponders, transponders, and line card applications that require high logic density and PCIe/serial connectivity.
• Broadcast and Media Studio switches, transport and videoconferencing equipment utilizing embedded memory and programmable logic for video processing.
• Compute and Storage Acceleration Flash cache, server acceleration, and cloud compute functions that benefit from high logic count and on‑chip RAM.
• Medical and Defense Systems Diagnostic imaging, radar, and secure communications systems where industrial temperature range and integration matter.

Unique Advantages

• High Logic Density: 320,000 logic elements enable implementation of large-scale, complex designs without splitting functionality across multiple FPGAs.
• Significant On‑Chip Memory: Over 21 million bits of RAM reduce external memory dependency for buffering and data‑path functions.
• Broad I/O Count: 384 I/O pins simplify integration with multiple high‑speed interfaces and peripheral devices.
• Industrial‑Grade Temperature: −40 °C to 100 °C operating range supports deployment in harsh and temperature‑variable environments.
• Compact High‑Pin Package: 1152‑BBGA (35×35 FCBGA) packs high pin count in a compact footprint for space‑constrained boards.
• Low‑Voltage Core Compatibility: 870–980 mV supply range aligns with modern low‑voltage power domains for efficient designs.

Why Choose 10AX032H2F35I2LG?

The 10AX032H2F35I2LG positions itself as a mid‑range, performance‑oriented Arria 10 GX FPGA that balances high logic capacity, substantial embedded memory, and robust I/O in a single industrial‑temperature package. Its Arria 10 family features—variable‑precision DSP blocks, embedded memory architectures, PLLs, serial transceivers, and PCIe hard IP—provide a flexible platform for demanding communications, compute, and imaging applications.

This device suits design teams that need a scalable, integrated FPGA solution with verified series‑level capabilities and vendor documentation for system‑level integration and long‑term deployment.

Request a quote or submit an RFQ to review availability and pricing for 10AX032H2F35I2LG and to discuss how it fits your next design.