10AX032H2F35I1HG

The 10AX032H2F35I1HG is an Intel Arria 10 GX Field Programmable Gate Array supplied in a 1152‑ball FCBGA (35×35) package. As part of the Arria 10 family, this device targets mid‑range, high‑performance and power‑sensitive applications across wireless, wireline, broadcast, computing, medical and defense markets.

Key architectural attributes include a large logic fabric, substantial on‑chip RAM, and abundant I/O, combined with the Arria 10 family emphasis on higher performance and power efficiency relative to prior generations.

Key Features

• Logic Capacity  320,000 logic elements to implement complex custom logic, data path processing, and control functions.
• On‑chip Memory  21,040,128 total RAM bits to support large buffers, FIFOs, and embedded data storage.
• I/O Density  384 I/O pins for extensive peripheral, memory and host interface connectivity.
• Package & Mounting  1152‑ball FCBGA (35×35) package, surface‑mount mounting type suitable for dense board integration.
• Voltage & Power  Core voltage operation from 870 mV to 980 mV, enabling design integration with low‑voltage power domains.
• Temperature Range  Industrial operating range from −40°C to 100°C for deployment in temperature‑challenging environments.
• Family Architecture Highlights  Arria 10 family features referenced in device documentation include adaptive logic modules, variable‑precision DSP resources, embedded memory blocks, clock networks and high‑speed transceiver and protocol hard IP options.
• Compliance  RoHS compliant.

Typical Applications

• Wireless Infrastructure  Channel and switch cards, remote radio heads and mobile backhaul equipment that require programmable logic and DSP capacity.
• High‑Speed Wireline Systems  40G/100G muxponders, transponders and line cards where FPGA logic, on‑chip memory and I/O density enable protocol handling and packet processing.
• Broadcast and Media  Studio switches, video transport and professional audio/video processing relying on programmable logic for format conversion and routing.
• Computing and Storage  Server acceleration, flash cache and cloud infrastructure applications that leverage large logic arrays and embedded RAM.
• Medical and Defense  Diagnostic imaging, radar, guidance and secure communications where industrial temperature range and programmable integration are required.

Unique Advantages

• Substantial Logic Resources: 320,000 logic elements provide the capacity to implement complex algorithms and large state machines on a single device, reducing external component count.
• Large On‑Die Memory: Over 21 million bits of embedded RAM support deep buffering, lookup tables and data storage for real‑time processing workloads.
• High I/O Count in a Compact Package: 384 I/Os in a 1152‑ball FCBGA (35×35) enable dense board designs with broad peripheral and memory connectivity.
• Industrial Temperature Rating: −40°C to 100°C operation supports deployments in demanding environmental conditions.
• Low‑Voltage Core Operation: 870 mV to 980 mV supply range helps integrate the FPGA into modern low‑power system architectures.
• Arria 10 Family Capabilities: Family documentation highlights power‑efficiency features and advanced IP blocks for clocks, DSP and high‑speed serial protocols, aiding system integration and design scalability.

Why Choose 10AX032H2F35I1HG?

The 10AX032H2F35I1HG Arria 10 GX FPGA combines a large logic fabric, significant embedded RAM and robust I/O in a dense FCBGA package, positioning it for mid‑range applications that require both performance and power efficiency. Its industrial temperature range and low core voltage make it suitable for systems operating in challenging conditions while maintaining integration density.

This part is appropriate for engineering teams building communication endpoints, high‑speed data processing modules, compute accelerators and embedded platforms that benefit from the Arria 10 family’s architectural features and supporting device documentation.

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