10AX032H2F35E1HG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 21040128 320000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 957 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 384 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 119900 | Number of Logic Elements/Cells | 320000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21040128 |
Overview of 10AX032H2F35E1HG – Arria 10 GX FPGA, 320,000 logic elements
The 10AX032H2F35E1HG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 1152-FCBGA (35×35) package. It delivers a mid-range, high-performance FPGA architecture with on-chip memory and DSP capabilities suited to complex, power-sensitive designs.
Drawn from the Arria 10 device family, this device targets applications across wireless, wireline, broadcast, computing, medical and military markets where higher performance and power efficiency are required.
Key Features
- Core Logic 320,000 logic elements provide the programmable fabric for complex logic and control implementations, based on the Arria 10 device architecture.
- Embedded Memory 21,040,128 total RAM bits of on-chip memory across embedded memory blocks to support buffering, caches and on-chip data storage.
- I/O and Package 384 general-purpose I/Os and a 1152-FCBGA (35×35) surface-mount package enable high-density board integration and signal connectivity.
- Power and Voltage Core voltage supply range 870 mV to 980 mV, enabling low-voltage operation for power-sensitive designs.
- Temperature and Grade Extended grade device with an operating temperature range of 0 °C to 100 °C for deployment in extended-environment applications.
- High-speed Interfaces and Hard IP Supports integrated hard IP such as PCIe Gen1/Gen2/Gen3 and enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, plus low-power serial transceivers.
- DSP and Clocking Variable-precision DSP blocks and a flexible clocking architecture including PLLs and fractional synthesis for precise clock management and signal processing.
- Surface Mount 1152-FCBGA package is surface-mount compatible for modern PCB assembly workflows.
- RoHS Compliant Device is RoHS compliant.
Typical Applications
- Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment that require programmable logic and transceiver integration.
- Wireline networking — 40G/100G muxponders, transponders and line cards for bridging and aggregation where high-speed interfaces and packet processing are needed.
- Broadcast and media — Studio switches, videoconferencing and professional audio/video processing that benefit from on-chip memory and DSP resources.
- Computing and storage — Server acceleration, flash cache and cloud infrastructure applications that use programmable logic for acceleration and data-path customization.
- Medical and defense systems — Diagnostic imaging, radar and electronic warfare systems where a combination of performance and power efficiency is required.
Unique Advantages
- Significant programmable capacity: 320,000 logic elements enable implementation of sizable digital systems and complex custom IP.
- Large on-chip memory: Over 21 million bits of embedded RAM reduce external memory dependency for many buffering and caching tasks.
- High I/O density: 384 I/Os support extensive external connectivity and multi-channel interfacing without immediate need for additional SERDES chips.
- Integrated high-speed hard IP: Built-in PCIe and enhanced PCS support accelerate deployment of common networking and interconnect protocols.
- Low-voltage core operation: 870–980 mV supply range supports designs that prioritize power efficiency.
- Extended temperature grade: Rated for 0 °C to 100 °C operation, suitable for extended-environment applications.
Why Choose 10AX032H2F35E1HG?
The 10AX032H2F35E1HG brings Arria 10 GX architecture to mid-range FPGA designs that demand a blend of programmable logic capacity, on-chip memory and integrated high-speed interfaces. Its combination of 320,000 logic elements, abundant embedded RAM and 384 I/Os makes it well suited for data-path acceleration, networking, wireless and broadcast applications where performance and power efficiency are important.
Designed as part of the Intel Arria 10 device family, this device benefits from the device-level documentation and ecosystem support intended for system designers deploying complex, power-sensitive mid-range FPGA solutions.
Request a quote or submit an inquiry for pricing, availability and lead-time information for the 10AX032H2F35E1HG.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018