10AX032H2F34I2SG

The 10AX032H2F34I2SG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1152‑ball BGA package. It is a 20‑nm mid‑range FPGA family member designed for high‑performance, power‑sensitive applications across wireless, wireline, broadcast, computing, medical and defense markets.

With a high logic capacity, substantial on‑chip RAM and broad I/O, this device targets midrange designs that require a balance of performance, integration and power efficiency.

Key Features

• Logic Capacity — 320,000 logic elements to implement complex digital functions and system logic.
• Large Embedded Memory — 21,040,128 total RAM bits for buffering, caches and on‑chip data storage.
• I/O and Package — 384 user I/O in a 1152‑BBGA (1152‑FBGA, FC 35×35) surface‑mount package for dense, high‑pin count board designs.
• Operating Range — Industrial grade with a specified operating temperature range of −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Supply Voltage — Core supply range of 870 mV to 980 mV, reflecting the device’s low‑voltage 20‑nm architecture.
• Power and Performance Focus — Part of the Arria 10 family described as high‑performance and power‑efficient 20‑nm mid‑range FPGAs, suitable for power‑sensitive designs.
• Mounting — Surface mount device optimized for modern PCB assembly processes.
• RoHS Compliant — Meets RoHS requirements for lead‑free assemblies.

Typical Applications

• Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment that require a mix of DSP and programmable logic.
• Wireline Networking — 40G/100G muxponders, transponders and line cards where high logic density and on‑chip memory support packet processing and protocol handling.
• Broadcast and Media — Studio switches and professional audio/video processing that benefit from programmable I/O and embedded memory for buffering and format conversion.
• Computing and Storage — Flash cache, cloud server acceleration and other data‑centric functions that leverage logic density and embedded RAM.
• Medical and Defense Systems — Diagnostic imaging, radar and secure communications where the industrial temperature rating and FPGA flexibility are advantageous.

Unique Advantages

• High Logic Density: 320,000 logic elements enable integration of complex algorithms and subsystems on a single chip, reducing board-level component count.
• Substantial On‑Chip RAM: Over 21 million RAM bits provide on‑device buffering and storage for latency‑sensitive processing tasks.
• Robust I/O and Package: 384 I/O pins in a 1152‑BBGA footprint support high‑pin‑count designs and dense board routing for multi‑lane interfaces.
• Industrial Temperature Capability: Rated from −40 °C to 100 °C for deployment in harsh or uncontrolled thermal environments.
• Power‑Efficient 20‑nm Architecture: Core voltage range of 870 mV–980 mV and Arria 10 family design focus provide options for power‑sensitive applications.
• RoHS Compliance: Facilitates lead‑free manufacturing and regulatory alignment for many global markets.

Why Choose 10AX032H2F34I2SG?

The 10AX032H2F34I2SG positions itself as a scalable, mid‑range FPGA that balances high logic capacity, large embedded memory and robust I/O in a compact BGA package. It is appropriate for engineers developing midrange systems that need a combination of performance and power efficiency within the Arria 10 device family.

Design teams targeting wireless infrastructure, high‑speed networking, professional media, storage acceleration or temperature‑sensitive industrial and medical systems will find the device’s specified logic, memory and temperature characteristics aligned with these application requirements.

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