10AX032H2F35E2SG

IC FPGA 384 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 21040128 320000 1152-BBGA, FCBGA

Quantity 204 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O384Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs119900Number of Logic Elements/Cells320000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits21040128

Overview of 10AX032H2F35E2SG – Arria 10 GX FPGA, 320,000 Logic Elements, 1152-BBGA

The 10AX032H2F35E2SG is an Intel Arria 10 GX field-programmable gate array (FPGA) device delivered in a 1152-ball FCBGA package. It combines a high logic-element count with large embedded RAM capacity and a comprehensive I/O complement, targeted at performance- and power-sensitive midrange applications.

Arria 10 devices are built on a 20 nm architecture and are positioned for markets including wireless, wireline, broadcast, computing and storage, medical imaging, and military/defense applications, where a balance of performance, power efficiency and configurable integration is required.

Key Features

  • Logic Capacity — 320,000 logic elements to implement complex digital logic and custom accelerators.
  • Embedded Memory — 21,040,128 total RAM bits for on-chip buffering, packet processing, and data path storage.
  • I/O Resources — 384 I/O pins to support broad external interfacing and high-channel-count systems.
  • Transceivers and Interfaces — Device family includes support for low-power serial transceivers, PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and multiple transceiver channel options.
  • Clocking and PLLs — Comprehensive clock networks with fractional synthesis and I/O PLLs for flexible timing and clock domain management.
  • Configuration and Reliability — Support for dynamic and partial reconfiguration and SEU error detection and correction features described for the device family.
  • Power and Voltage — Operates with supply voltage range from 870 mV to 980 mV and includes family-level power management capabilities.
  • Package and Mounting — 1152-ball BGA (FCBGA) package in a 35 × 35 mm footprint, surface-mount mounting type for board-level integration.
  • Temperature and Grade — Extended grade device with an operating temperature range of 0 °C to 100 °C.

Typical Applications

  • Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment where configurable logic and transceivers enable protocol and datapath flexibility.
  • Wireline and Optical — 40G/100G muxponders, transponders, and high-speed line cards that leverage embedded memory and high-speed serial interfaces.
  • Broadcast and Professional AV — Studio switches, servers, and video transport systems requiring high-throughput processing and flexible I/O.
  • Computing and Storage Acceleration — Flash cache, cloud server accelerators, and server offload functions that use on-chip logic and memory for low-latency processing.
  • Medical and Defense Systems — Diagnostic imaging, radar, and electronic warfare applications needing configurable processing and high channel counts.

Unique Advantages

  • High Logic Density: 320,000 logic elements provide substantial capacity for complex custom logic, signal processing, and hardware acceleration.
  • Large On‑Chip Memory: Over 21 million bits of embedded RAM enable deep buffering and stateful processing without immediate dependence on external memory.
  • Broad I/O and Protocol Support: 384 I/Os combined with hardened IP for PCIe and Ethernet and low-power transceivers simplify integration of high-speed interfaces.
  • Flexible Clocking and Reconfiguration: Advanced clock networks, PLL features, and support for dynamic/partial reconfiguration allow adaptable timing architectures and in-field updates.
  • Compact, Board‑Ready Package: 1152-ball FCBGA (35 × 35 mm) surface-mount package supports high-density board integration for compact systems.
  • Extended Grade Operation: Extended grade rating and 0 °C to 100 °C operating range support deployment in a wide range of commercial and industrial-adjacent environments.

Why Choose 10AX032H2F35E2SG?

The 10AX032H2F35E2SG Arria 10 GX FPGA combines ample logic density, significant embedded RAM, and extensive I/O in an FCBGA package, making it suitable for midrange applications that require configurable compute, high-speed interfaces, and power-aware operation. Its family-level features—such as hardened PCIe and Ethernet IP, low-power serial transceivers, and advanced clocking—provide a platform for rapid development of networking, streaming, and acceleration designs.

For engineering teams and procurement focused on scalable and reconfigurable hardware solutions, this device provides a balance of performance and integration with documented device-level reliability and configuration options recorded in the Arria 10 device overview.

Request a quote or submit an inquiry to receive pricing and availability for the 10AX032H2F35E2SG Arria 10 GX FPGA. Our team can provide lead-time information and assist with ordering details.

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