10AX032H2F35E2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 21040128 320000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 204 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA, FC (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 384 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 119900 | Number of Logic Elements/Cells | 320000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21040128 |
Overview of 10AX032H2F35E2SG – Arria 10 GX FPGA, 320,000 Logic Elements, 1152-BBGA
The 10AX032H2F35E2SG is an Intel Arria 10 GX field-programmable gate array (FPGA) device delivered in a 1152-ball FCBGA package. It combines a high logic-element count with large embedded RAM capacity and a comprehensive I/O complement, targeted at performance- and power-sensitive midrange applications.
Arria 10 devices are built on a 20 nm architecture and are positioned for markets including wireless, wireline, broadcast, computing and storage, medical imaging, and military/defense applications, where a balance of performance, power efficiency and configurable integration is required.
Key Features
- Logic Capacity — 320,000 logic elements to implement complex digital logic and custom accelerators.
- Embedded Memory — 21,040,128 total RAM bits for on-chip buffering, packet processing, and data path storage.
- I/O Resources — 384 I/O pins to support broad external interfacing and high-channel-count systems.
- Transceivers and Interfaces — Device family includes support for low-power serial transceivers, PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and multiple transceiver channel options.
- Clocking and PLLs — Comprehensive clock networks with fractional synthesis and I/O PLLs for flexible timing and clock domain management.
- Configuration and Reliability — Support for dynamic and partial reconfiguration and SEU error detection and correction features described for the device family.
- Power and Voltage — Operates with supply voltage range from 870 mV to 980 mV and includes family-level power management capabilities.
- Package and Mounting — 1152-ball BGA (FCBGA) package in a 35 × 35 mm footprint, surface-mount mounting type for board-level integration.
- Temperature and Grade — Extended grade device with an operating temperature range of 0 °C to 100 °C.
Typical Applications
- Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment where configurable logic and transceivers enable protocol and datapath flexibility.
- Wireline and Optical — 40G/100G muxponders, transponders, and high-speed line cards that leverage embedded memory and high-speed serial interfaces.
- Broadcast and Professional AV — Studio switches, servers, and video transport systems requiring high-throughput processing and flexible I/O.
- Computing and Storage Acceleration — Flash cache, cloud server accelerators, and server offload functions that use on-chip logic and memory for low-latency processing.
- Medical and Defense Systems — Diagnostic imaging, radar, and electronic warfare applications needing configurable processing and high channel counts.
Unique Advantages
- High Logic Density: 320,000 logic elements provide substantial capacity for complex custom logic, signal processing, and hardware acceleration.
- Large On‑Chip Memory: Over 21 million bits of embedded RAM enable deep buffering and stateful processing without immediate dependence on external memory.
- Broad I/O and Protocol Support: 384 I/Os combined with hardened IP for PCIe and Ethernet and low-power transceivers simplify integration of high-speed interfaces.
- Flexible Clocking and Reconfiguration: Advanced clock networks, PLL features, and support for dynamic/partial reconfiguration allow adaptable timing architectures and in-field updates.
- Compact, Board‑Ready Package: 1152-ball FCBGA (35 × 35 mm) surface-mount package supports high-density board integration for compact systems.
- Extended Grade Operation: Extended grade rating and 0 °C to 100 °C operating range support deployment in a wide range of commercial and industrial-adjacent environments.
Why Choose 10AX032H2F35E2SG?
The 10AX032H2F35E2SG Arria 10 GX FPGA combines ample logic density, significant embedded RAM, and extensive I/O in an FCBGA package, making it suitable for midrange applications that require configurable compute, high-speed interfaces, and power-aware operation. Its family-level features—such as hardened PCIe and Ethernet IP, low-power serial transceivers, and advanced clocking—provide a platform for rapid development of networking, streaming, and acceleration designs.
For engineering teams and procurement focused on scalable and reconfigurable hardware solutions, this device provides a balance of performance and integration with documented device-level reliability and configuration options recorded in the Arria 10 device overview.
Request a quote or submit an inquiry to receive pricing and availability for the 10AX032H2F35E2SG Arria 10 GX FPGA. Our team can provide lead-time information and assist with ordering details.

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