10AX032H2F35I2SG

The 10AX032H2F35I2SG is an Intel Arria 10 GX field programmable gate array (FPGA) offered in a 1152-ball BGA package. It is part of the Arria 10 family of 20 nm mid-range FPGAs and SoCs designed for high-performance, power-efficient applications across communications, broadcast, computing, medical, and defense markets.

Built to deliver a balance of programmable logic, embedded memory and I/O capability, this device targets mid-range systems that require substantial logic density, embedded RAM and flexible interface support while operating across industrial temperatures.

Key Features

• Core — Logic Elements 320,000 logic elements provide substantial programmable fabric for complex combinational and sequential logic implementations.
• Embedded Memory 21,040,128 total RAM bits of on-chip memory for frame buffers, packet buffering and other high-bandwidth local storage needs.
• I/O Capacity 384 general-purpose I/O pins support broad external connectivity and peripheral interfacing for multi-channel designs.
• Transceivers and Hard IP Arria 10 family features listed in the device overview include low-power serial transceivers, PCIe Gen1/2/3 hard IP and enhanced PCS hard IP for protocols such as Interlaken and 10 Gbps Ethernet.
• Clocking and DSP Clock networks with PLL clock sources and variable-precision DSP block capability are part of the Arria 10 device architecture to support diverse signal processing and timing requirements.
• Power Designed on a 20 nm process with power-saving technologies; operating core voltage supply range is specified from 870 mV to 980 mV.
• Package and Mounting Surface-mount 1152-BBGA (FCBGA) package, supplier device package listed as 1152-FBGA, FC (35×35), suitable for compact system integration.
• Industrial Temperature Rating Rated for operation from −40 °C to 100 °C and specified as Industrial grade for deployment in temperature-challenging environments.

Typical Applications

• Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul equipment that require programmable logic and high-speed I/O.
• Wireline Networking 40G/100G muxponders, transponders and line cards where embedded memory and serial transceivers support packet aggregation and high-bandwidth transport.
• Broadcast and Pro AV Studio switches, video transport and conferencing systems leveraging on-chip RAM and flexible I/O for real-time media processing.
• Computing and Storage Server acceleration, flash cache and cloud computing modules that use programmable fabric and PCIe hard IP for custom offload logic.
• Medical and Defense Systems Diagnostic imaging, radar and secure communications that benefit from the device’s logic density, embedded memory and industrial temperature range.

Unique Advantages

• High logic density: 320,000 logic elements enable large, complex designs without moving to a higher-tier family.
• Significant on-chip RAM: Over 21 million bits of embedded RAM reduce external memory dependency for latency-sensitive buffering and storage.
• Broad interface support: 384 I/O pins plus Arria 10 family hard IP options (PCIe, Ethernet, Interlaken) simplify system-level integration.
• Industrial-ready operation: −40 °C to 100 °C rating and surface-mount BGA packaging support deployment in rugged environments.
• Power-optimized 20 nm architecture: Lower core voltage range (870–980 mV) and family-level power-saving features help control system power budgets.

Why Choose 10AX032H2F35I2SG?

The 10AX032H2F35I2SG delivers a combination of dense programmable logic, substantial embedded memory and flexible I/O in a single industrial-grade FPGA package. It is positioned for mid-range, performance-sensitive designs that need a balance of logic capacity, on-chip RAM and hardened interface options from the Arria 10 family.

For engineers and system designers, this device offers scalability within the Arria 10 family and the architectural building blocks—DSP capability, PLLs and serial/transceiver IP—required to implement complex signal processing, networking and acceleration tasks while maintaining control over power and thermal constraints.

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