10AX032H3F34I2SG

The 10AX032H3F34I2SG is an Intel Arria 10 GX field programmable gate array (FPGA) IC offering high logic density and on‑chip memory for midrange, performance‑sensitive designs. It is part of the Arria 10 device family described as 20‑nm mid‑range FPGAs and SoCs in the product documentation.

Designed for industrial applications, this surface‑mount FPGA combines 320,000 logic elements, 21,040,128 bits of embedded RAM and 384 I/O pins in a 1152‑FBGA (35 × 35 mm) package. The device targets use cases across wireless, wireline, broadcast, computing and other markets outlined in the device overview.

Key Features

• Core Capacity — 320,000 logic elements provide large programmable logic resources for complex custom logic and data processing.
• Embedded Memory — 21,040,128 total RAM bits of on‑chip memory to support buffering, packet processing and local storage requirements.
• I/O and Packaging — 384 general‑purpose I/O in a 1152‑FBGA, FC (35×35 mm) surface‑mount package for dense board integration.
• Industrial Grade and Temperature Range — Industrial grade device rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
• Supply Voltage — Core voltage range specified at 870 mV to 930 mV to support platform power design and sequencing.
• High‑Speed Interfaces and Hard IP — Device family documentation lists support for low‑power serial transceivers, enhanced PCS hard IP (including Interlaken and 10 Gbps Ethernet) and PCIe Gen1/Gen2/Gen3 hard IP implementation options.
• Clocking and Reconfiguration — Clock network and PLL features are included in device documentation, along with support for dynamic and partial reconfiguration capabilities noted for the Arria 10 family.
• Compliance — RoHS compliant to support modern manufacturing and regulatory requirements.

Typical Applications

• Wireless Infrastructure — Channel and switch cards for remote radio heads and mobile backhaul equipment leveraging high logic density and embedded memory.
• High‑Speed Wireline — Line cards, muxponders and transponders (40G/100G) requiring hardened PCS/PHY and serial transceiver support described for the device family.
• Broadcast and Professional AV — Studio switches and signal processing systems that benefit from on‑chip memory and extensive I/O.
• Computing and Storage Acceleration — Flash cache, cloud computing servers and server acceleration tasks that use abundant logic and embedded RAM for custom acceleration functions.
• Imaging and Diagnostic Equipment — Medical diagnostic scanners and imaging subsystems that require high logic capacity and industrial temperature operation.

Unique Advantages

• High Logic Density: 320,000 logic elements enable complex system integration and higher functional consolidation on a single device.
• Substantial On‑Chip Memory: Over 21 million bits of embedded RAM reduce external memory dependence for many buffering and processing tasks.
• Industrial‑Class Reliability: Rated for −40 °C to 100 °C and specified as industrial grade to support deployment in harsh environments.
• Broad Interface Capability: Family documentation indicates support for PCIe, Interlaken and 10 Gbps Ethernet hard IP and low‑power serial transceivers for high‑bandwidth link implementations.
• Compact, High‑Pin‑Count Package: 1152‑FBGA (35×35 mm) package provides dense I/O and routing options while maintaining a compact board footprint.
• Power Design Visibility: Specified core supply range (870–930 mV) assists in precise power budgeting and sequencing on production boards.

Why Choose 10AX032H3F34I2SG?

The 10AX032H3F34I2SG positions itself as a high‑capacity Arria 10 GX FPGA suited to midrange, high‑performance and power‑sensitive applications described in the Array 10 family overview. Its combination of extensive logic elements, significant embedded RAM and hardened interface capabilities make it appropriate for networking, broadcast, compute acceleration and industrial systems.

Backed by the Arria 10 device documentation, this industrial‑grade FPGA provides a scalable platform for designs that require dense programmable logic, on‑chip memory and a wide operating temperature window—helping streamline BOM and integration for complex systems.

Request a quote or submit an inquiry to receive pricing and availability for the 10AX032H3F34I2SG and to discuss how it fits your design requirements.