10AX032H3F35E2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 21040128 320000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,676 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA, FC (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 384 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 119900 | Number of Logic Elements/Cells | 320000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21040128 |
Overview of 10AX032H3F35E2SG – Arria 10 GX FPGA, 320000 logic elements, 1152‑BBGA
The 10AX032H3F35E2SG is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 1152‑BBGA (FCBGA) package. It belongs to the 20‑nm Arria 10 family of mid‑range FPGAs and SoCs designed for high performance and power efficiency.
With a high logic capacity, large embedded RAM, and abundant I/O, this device targets wireless, wireline, broadcast, computing, storage, medical, and military applications where performance, integration, and power efficiency are priorities.
Key Features
- Logic Capacity — 320,000 logic elements providing substantial programmable fabric for complex digital designs.
- Embedded Memory — 21,040,128 total RAM bits to support large on‑chip buffers, caches, and intermediate storage.
- I/O Density — 384 I/O pins to support wide external connectivity and multi‑channel interfaces.
- Transceiver and Interface Capabilities (Device Family) — Arria 10 devices include support for high‑speed serial transceivers, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and PCIe Gen1/Gen2/Gen3 hard IP as documented in the device overview.
- Power and Clocking (Device Family) — Power‑efficient architecture with advanced clock networks, fractional synthesis and I/O PLLs as described in the Arria 10 overview.
- Supply Voltage — Core supply range of 870 mV to 930 mV to match system power rails and regulator designs.
- Package & Mounting — 1152‑BBGA (supplier package: 1152‑FBGA, FC 35×35) surface‑mount package for dense board integration.
- Operating Conditions — Extended grade with an operating temperature range of 0 °C to 100 °C and RoHS compliance.
Typical Applications
- Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging high logic density and on‑chip memory for PHY/MAC processing.
- Wireline Networking — 40G/100G muxponders, transponders and line cards that utilize the device family's serial transceivers and hard IP for high‑speed packet handling.
- Broadcast and Pro AV — Studio switches, video transport and processing systems that require large on‑chip buffers and flexible I/O to handle multi‑channel media streams.
- Computing and Storage Acceleration — Server offload, flash cache, and compute acceleration tasks that benefit from programmable logic and substantial embedded RAM.
Unique Advantages
- High Logic Density: 320,000 logic elements enable integration of complex custom logic, accelerators, and protocol engines on a single device.
- Significant On‑Chip Memory: Over 21 million bits of RAM reduce reliance on external memory for temporary storage and buffering.
- Flexible I/O Count: 384 I/Os allow broad interfacing options for multi‑lane and multi‑port system designs.
- Designed for High‑Speed Interfaces: The Arria 10 family includes support for serial transceivers and common high‑speed hard IP blocks, simplifying implementation of Ethernet, PCIe, and protocol bridging.
- Compact, Surface‑Mount Packaging: 1152‑BBGA (35×35) package provides a high‑density, manufacturable solution for space‑constrained PCBs.
- Extended Grade Operation: 0 °C to 100 °C operating range and RoHS compliance for deployment in commercial and many industrial‑style environments.
Why Choose 10AX032H3F35E2SG?
The 10AX032H3F35E2SG delivers a balanced combination of programmable logic density, embedded memory, and I/O resources in an Arria 10 GX device tailored for mid‑range, performance‑sensitive applications. Its specified core voltage range and extended temperature grade simplify power‑rail planning and thermal considerations for production systems.
This part is suited to engineers and system designers building wireless infrastructure, high‑speed networking equipment, broadcast/video systems, and compute/storage accelerators who require a power‑efficient FPGA platform with proven family‑level features and vendor documentation support.
If you would like pricing, availability, or to request a quote for the 10AX032H3F35E2SG, please submit a sales inquiry or request a formal quote through your procurement channels.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018