10AX032H4F34E3SG

The 10AX032H4F34E3SG is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 1152‑ball BGA package. It is part of the Arria 10 family of 20‑nm mid-range FPGAs designed for high-performance, power-efficient, midrange applications.

With 320,000 logic elements, 21,040,128 bits of embedded RAM, and 384 user I/O, this surface-mount device targets applications that require substantial logic capacity, dense on-chip memory, and flexible I/O integration while operating within an extended temperature grade (0 °C to 100 °C).

Key Features

• Logic Capacity — 320,000 logic elements to implement complex digital functions and high-density designs.
• Embedded Memory — 21,040,128 total RAM bits for large on-chip buffering, scratchpad memory, and packet/stream processing.
• I/O Resources — 384 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Package & Mounting — 1152‑BBGA surface-mount package (supplier package: 1152‑FBGA, FC, 35×35 mm) for compact board-level integration.
• Power Supply — Core voltage range 870 mV to 980 mV, allowing designs tuned for low-voltage operation.
• Operating Temperature & Grade — Extended grade operation from 0 °C to 100 °C to suit commercial and many embedded deployments.
• Standards Compliance — RoHS compliant for environmental and regulatory alignment.
• Family Attributes — Part of the Intel Arria 10 device family, a 20‑nm platform focused on performance and power efficiency for midrange systems.

Typical Applications

• Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment where logic density and power efficiency are required.
• Wireline Networking — 40G/100G muxponders, transponders, and line cards that need large on-chip memory and substantial I/O counts.
• Broadcast & Pro AV — Studio switches, transport and videoconferencing systems that benefit from dense logic and embedded memory for media processing.
• Computing & Storage — Flash cache, cloud server acceleration, and server offload designs that require high logic capacity and on-chip RAM.
• Medical & Aerospace — Diagnostic imaging, radar, and signal-processing applications within the specified extended temperature range.

Unique Advantages

• High Logic Density: 320,000 logic elements provide the capacity to consolidate complex functions and reduce external components.
• Large On‑Chip Memory: Over 21 million RAM bits enable substantial buffering and local data storage for high-throughput designs.
• Extensive I/O: 384 I/O supports broad interfacing options, simplifying multi-channel and parallel connectivity.
• Compact, Surface‑Mount Package: 1152‑BBGA (35×35 mm supplier package) offers a compact footprint for board-level integration without sacrificing pin count.
• Power‑Efficient Platform: 20‑nm Arria 10 family attributes with a low-voltage core range (870–980 mV) help manage power in demanding applications.
• Regulatory Compliance: RoHS compliance supports products targeting regions and customers with environmental requirements.

Why Choose 10AX032H4F34E3SG?

The 10AX032H4F34E3SG Arria 10 GX FPGA balances high logic density, large embedded RAM, and substantial I/O in a compact 1152‑BBGA surface-mount package. Its 20‑nm Arria 10 architecture and extended temperature grade make it suitable for midrange, performance-sensitive applications that require efficient on-chip resources.

This device is well suited for engineering teams designing wireless and wireline network equipment, professional media systems, and compute/storage acceleration where integration, memory capacity, and I/O flexibility are priorities. Its placement within the Arria 10 family enables scalability across similar device variants for evolving project requirements.

Request a quote or submit an inquiry for pricing and availability of the 10AX032H4F34E3SG to begin integrating this Arria 10 GX FPGA into your design.