10AX032H3F35I2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 21040128 320000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 914 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA, FC (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 384 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 119900 | Number of Logic Elements/Cells | 320000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21040128 |
Overview of 10AX032H3F35I2SG – Arria 10 GX FPGA, 320,000 logic elements, 384 I/O, 1152-BBGA
The 10AX032H3F35I2SG is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 1152-BBGA (35 × 35 mm) FCBGA package. It combines a high logic capacity with large embedded RAM and a broad I/O complement to support mid-range, performance-sensitive designs.
As a member of the Arria 10 device family, this FPGA targets high-performance, power-efficient applications across wireless, wireline, broadcast, computing and storage, and other markets that require substantial programmable logic, embedded memory, and flexible I/O in an industrial-grade package.
Key Features
- Core & architecture Part of the Intel Arria 10 device family, delivering higher performance and power efficiency for mid-range FPGA applications based on the device overview.
- Logic capacity 320,000 logic elements (logic cells) to implement complex custom logic and control functions.
- Embedded memory Total on-chip RAM of 21,040,128 bits for buffering, FIFOs, and on-chip data storage.
- I/O and package 384 I/O pins in a high-density 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA, FC (35×35 mm) for compact system integration.
- Power supply Core supply range from 870 mV to 930 mV, enabling controlled power budgeting for system power design.
- Operating range Industrial operating temperature range of −40°C to 100°C for reliable operation across demanding environments.
- Interfaces & hard IP Arria 10 devices include hardened communications and bus IP blocks in the family (for example PCIe Gen1/Gen2/Gen3 and enhanced PCS hard IP referenced in the device overview).
- High-speed serial capability The Arria 10 device overview references low-power serial transceivers and support for high-speed protocols such as 10 Gbps Ethernet and Interlaken, enabling high-bandwidth link implementations.
- RoHS compliant Manufactured to meet RoHS environmental requirements.
Typical Applications
- Wireless infrastructure Channel and switch cards, remote radio head processing, and mobile backhaul functions that require programmable logic and embedded memory for signal processing and control.
- Wireline communications Line cards, muxponders/multiplexers for 40G/100G systems and bridging/aggregation tasks leveraging hardened protocol IP and high-speed serial links.
- Broadcast and media Studio switching, video transport and processing where large on-chip RAM and configurable logic handle data buffering and real-time operations.
- Computing and storage Flash cache acceleration, server offload, and data-path processing where logic density and on-chip memory accelerate custom workloads.
Unique Advantages
- Substantial programmable capacity: 320,000 logic elements provide the headroom to implement complex algorithms, large state machines, and extensive control logic on a single device.
- On-chip memory for data-intense designs: Over 21 million bits of RAM reduce dependence on external memory for buffering and real-time data handling.
- Dense I/O in a compact package: 384 I/O in a 35×35 mm FCBGA package enables high-pin-count system designs while maintaining a compact board footprint.
- Industrial temperature rating: −40°C to 100°C operation supports deployment in harsh or temperature-variable environments.
- Family-level interface IP: Arria 10 family features such as PCIe Gen1/2/3 hard IP and high-speed serial transceivers simplify implementation of standard interfaces and high-bandwidth links.
- RoHS compliant manufacturing: Compliance supports environmental and regulatory requirements for modern electronics production.
Why Choose 10AX032H3F35I2SG?
The 10AX032H3F35I2SG delivers a balanced combination of large logic capacity, significant embedded RAM, and extensive I/O in an industrial-temperature, RoHS-compliant FCBGA package. It is positioned for mid-range designs that require programmable compute density and on-chip memory combined with hardened interface capabilities provided within the Arria 10 family.
This device is well suited to engineering teams developing wireless and wireline infrastructure, broadcast/video systems, and compute/storage acceleration where integration, temperature resilience, and predictable power budgeting are important. Choosing this part supports scalable designs that leverage the Arria 10 device family features and Intel-provided device documentation.
Request a quote or submit a purchase inquiry for availability and pricing on the 10AX032H3F35I2SG to begin integrating this Arria 10 GX FPGA into your design.

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