10AX032H3F35I2SG

IC FPGA 384 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 21040128 320000 1152-BBGA, FCBGA

Quantity 914 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O384Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs119900Number of Logic Elements/Cells320000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits21040128

Overview of 10AX032H3F35I2SG – Arria 10 GX FPGA, 320,000 logic elements, 384 I/O, 1152-BBGA

The 10AX032H3F35I2SG is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 1152-BBGA (35 × 35 mm) FCBGA package. It combines a high logic capacity with large embedded RAM and a broad I/O complement to support mid-range, performance-sensitive designs.

As a member of the Arria 10 device family, this FPGA targets high-performance, power-efficient applications across wireless, wireline, broadcast, computing and storage, and other markets that require substantial programmable logic, embedded memory, and flexible I/O in an industrial-grade package.

Key Features

  • Core & architecture  Part of the Intel Arria 10 device family, delivering higher performance and power efficiency for mid-range FPGA applications based on the device overview.
  • Logic capacity  320,000 logic elements (logic cells) to implement complex custom logic and control functions.
  • Embedded memory  Total on-chip RAM of 21,040,128 bits for buffering, FIFOs, and on-chip data storage.
  • I/O and package  384 I/O pins in a high-density 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA, FC (35×35 mm) for compact system integration.
  • Power supply  Core supply range from 870 mV to 930 mV, enabling controlled power budgeting for system power design.
  • Operating range  Industrial operating temperature range of −40°C to 100°C for reliable operation across demanding environments.
  • Interfaces & hard IP  Arria 10 devices include hardened communications and bus IP blocks in the family (for example PCIe Gen1/Gen2/Gen3 and enhanced PCS hard IP referenced in the device overview).
  • High-speed serial capability  The Arria 10 device overview references low-power serial transceivers and support for high-speed protocols such as 10 Gbps Ethernet and Interlaken, enabling high-bandwidth link implementations.
  • RoHS compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

  • Wireless infrastructure  Channel and switch cards, remote radio head processing, and mobile backhaul functions that require programmable logic and embedded memory for signal processing and control.
  • Wireline communications  Line cards, muxponders/multiplexers for 40G/100G systems and bridging/aggregation tasks leveraging hardened protocol IP and high-speed serial links.
  • Broadcast and media  Studio switching, video transport and processing where large on-chip RAM and configurable logic handle data buffering and real-time operations.
  • Computing and storage  Flash cache acceleration, server offload, and data-path processing where logic density and on-chip memory accelerate custom workloads.

Unique Advantages

  • Substantial programmable capacity: 320,000 logic elements provide the headroom to implement complex algorithms, large state machines, and extensive control logic on a single device.
  • On-chip memory for data-intense designs: Over 21 million bits of RAM reduce dependence on external memory for buffering and real-time data handling.
  • Dense I/O in a compact package: 384 I/O in a 35×35 mm FCBGA package enables high-pin-count system designs while maintaining a compact board footprint.
  • Industrial temperature rating: −40°C to 100°C operation supports deployment in harsh or temperature-variable environments.
  • Family-level interface IP: Arria 10 family features such as PCIe Gen1/2/3 hard IP and high-speed serial transceivers simplify implementation of standard interfaces and high-bandwidth links.
  • RoHS compliant manufacturing: Compliance supports environmental and regulatory requirements for modern electronics production.

Why Choose 10AX032H3F35I2SG?

The 10AX032H3F35I2SG delivers a balanced combination of large logic capacity, significant embedded RAM, and extensive I/O in an industrial-temperature, RoHS-compliant FCBGA package. It is positioned for mid-range designs that require programmable compute density and on-chip memory combined with hardened interface capabilities provided within the Arria 10 family.

This device is well suited to engineering teams developing wireless and wireline infrastructure, broadcast/video systems, and compute/storage acceleration where integration, temperature resilience, and predictable power budgeting are important. Choosing this part supports scalable designs that leverage the Arria 10 device family features and Intel-provided device documentation.

Request a quote or submit a purchase inquiry for availability and pricing on the 10AX032H3F35I2SG to begin integrating this Arria 10 GX FPGA into your design.

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