10AX032H3F34E2LG

IC FPGA 384 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 21040128 320000 1152-BBGA, FCBGA

Quantity 519 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O384Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs119900Number of Logic Elements/Cells320000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits21040128

Overview of 10AX032H3F34E2LG – Arria 10 GX Field Programmable Gate Array (FPGA), 1152-BBGA

The 10AX032H3F34E2LG is an Arria 10 GX FPGA device in the 20 nm Arria 10 family, designed for mid-range, performance-sensitive applications. This device combines a high logic capacity with substantial on-chip RAM and extensive I/O to address demanding networking, broadcast, compute, and specialized embedded applications.

As an Arria 10 device, it benefits from family-level capabilities such as variable-precision DSP blocks, embedded memory architectures, high-speed serial transceivers, and hard IP for common protocols — enabling integration of complex functions into a single FPGA package.

Key Features

  • Logic Capacity — 320,000 logic elements provide substantial programmable logic resources for complex custom hardware designs.
  • On‑Chip Memory — Total RAM of 21,040,128 bits for buffering, caches, and embedded storage.
  • I/O Resources — 384 I/O pins to support dense external interfacing and board-level connectivity.
  • Power Supply — Core voltage supply range 870 mV to 930 mV for defined core-power requirements.
  • Package & Mounting — 1152-BBGA / FCBGA package (supplier package: 1152-FBGA, FC, 35×35 mm) with surface-mount mounting for compact board integration.
  • Operating Range & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C.
  • Compliance — RoHS compliant.
  • Arria 10 Family Capabilities — Series-level features documented for Arria 10 devices include variable‑precision DSP blocks, embedded memory blocks, clock networks and PLLs, PCIe Gen1/2/3 hard IP, enhanced PCS for Interlaken and 10 Gbps Ethernet, low-power serial transceivers, and support for dynamic and partial reconfiguration.

Typical Applications

  • Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul solutions where FPGA logic density and on-chip memory enable real-time signal processing.
  • Wireline networking — 40G/100G muxponders, transponders, and 100G line cards that require high-speed serial transceivers and protocol hard IP.
  • Broadcast and professional media — Studio switches, transport, and videoconferencing equipment that benefit from high I/O counts and embedded memory for buffering and format conversion.
  • Compute and storage acceleration — Flash cache, cloud compute servers, and server acceleration designs leveraging large logic capacity and DSP/memory resources.
  • Specialized medical and defense systems — Diagnostic imaging, radar, and electronic warfare systems that use high-density logic and reconfigurable DSP fabrics.

Unique Advantages

  • High programmable density: 320,000 logic elements enable implementation of substantial custom hardware functions without external ASICs or large multi-device arrays.
  • Significant on-chip RAM: Over 21 million bits of embedded RAM support buffering, look-up tables, and data staging for high-throughput designs.
  • Extensive I/O capability: 384 I/Os allow direct interfacing to numerous peripherals, memory devices, and board-level signals.
  • Integrated series-level IP: Arria 10 family features such as PCIe hard IP, Ethernet/Interlaken PCS, and low‑power transceivers reduce external component count and accelerate time to market.
  • Compact, manufacturable package: 1152‑ball FBGA in a 35×35 mm form factor with surface-mount mounting supports high-density PCB layouts.
  • Extended operating range: Extended grade and 0 °C to 100 °C operating temperature provide predictable behavior across typical commercial and embedded environments.

Why Choose 10AX032H3F34E2LG?

The 10AX032H3F34E2LG positions itself as a high-capacity, mid-range Arria 10 GX FPGA suited for applications that require a balance of logic density, on-chip memory, and high I/O. Its family-level capabilities (DSP blocks, serial transceivers, and protocol hard IP) enable integration of complex signal processing, networking, and compute functions into a single device.

This part is appropriate for engineers and system designers building networking, media, compute-acceleration, and specialized embedded systems who need a programmable platform with substantial resources and documented Arria 10 device features.

Request a quote or submit a pricing inquiry for part number 10AX032H3F34E2LG to receive availability and lead-time information.

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