10AX032H2F35I1SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 21040128 320000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 647 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 13 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 384 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 119900 | Number of Logic Elements/Cells | 320000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21040128 |
Overview of 10AX032H2F35I1SG – Arria 10 GX Field Programmable Gate Array (FPGA) IC
The 10AX032H2F35I1SG is an Arria 10 GX series FPGA in a 1152-FCBGA (35×35) package, offered as an industrial-grade, surface-mount device. It belongs to the Intel Arria 10 family of 20 nm mid-range FPGAs and SoCs and is aimed at applications that require high logic density, significant embedded memory, and broad I/O connectivity.
Typical markets for the Arria 10 family include wireless, wireline, broadcast, computing and storage, medical, and military systems where performance, power efficiency, and integration are important. This part pairs high logic capacity and embedded RAM with a compact FCBGA package and industrial temperature range for robust deployment.
Key Features
- Core architecture Part of the Intel Arria 10 family (20 nm mid-range FPGAs and SoCs) offering higher performance and power-efficiency characteristics described for the series.
- Logic capacity Approximately 320,000 logic elements suitable for complex programmable logic and system functions.
- Embedded memory Total on-chip RAM of 21,040,128 bits to support buffers, caches, and on-device data storage.
- I/O 384 I/O pins to support broad peripheral and memory interfacing options.
- DSP and signal processing blocks Family-level features include variable-precision DSP blocks for arithmetic and signal processing functions (as described in the Arria 10 device documentation).
- Serial and protocol support Arria 10 family documentation notes low-power serial transceivers and hard IP for PCIe Gen1/2/3 and high-speed Ethernet use cases.
- Package & mounting 1152-ball FCBGA (35×35) package, surface-mount design for dense board-level integration.
- Power Specified supply range: 0.870 V to 0.980 V, reflecting core voltage requirements for this device.
- Temperature & grade Industrial grade with operating range −40 °C to 100 °C for extended-environment deployment.
- Environmental compliance RoHS compliant.
Typical Applications
- Wireless infrastructure Channel and switch cards or remote radio head functions that require programmable logic and DSP capability.
- Wireline networking Line cards, muxponders, and transponders in 40G/100G systems that benefit from high logic density and high-speed serial interfaces.
- Broadcast and professional AV Studio switching and transport functions that need flexible I/O and embedded memory for buffering and protocol handling.
- Compute acceleration and storage Server acceleration, flash cache, and cloud compute functions leveraging on-chip RAM and DSP resources.
- Medical and defense systems Imaging, radar, and other mission-critical systems that require industrial temperature operation and programmable hardware adaptability.
Unique Advantages
- High programmable logic density: 320,000 logic elements enable complex, large-scale digital designs on a single device.
- Significant on-chip memory: 21,040,128 bits of embedded RAM reduce external memory dependency for many buffering and caching tasks.
- Broad I/O count: 384 I/Os allow flexible interfacing to peripherals, memory, and high-speed links without extensive external multiplexing.
- Industrial temperature range: −40 °C to 100 °C supports deployment in demanding environmental conditions.
- Compact FCBGA package: 1152-ball (35×35) FCBGA balances high pin count with a compact board footprint for dense system designs.
- Series-level protocol and power advantages: As part of the Arria 10 family, the device benefits from documented power-saving technologies and integrated hard IP for common high-speed protocols.
Why Choose 10AX032H2F35I1SG?
The 10AX032H2F35I1SG positions itself as an industrial-grade, mid-range FPGA solution with substantial logic and memory resources in a compact FCBGA package. It is suitable for engineers designing systems that require programmable acceleration, extensive I/O, and on-chip RAM while operating across a wide temperature range.
Selecting this Arria 10 GX device gives access to family-level features and documentation that support high-speed interfaces, DSP functionality, and power-management techniques—helping teams scale designs within the Arria 10 platform and rely on established device documentation during development.
Request a quote or submit an inquiry to learn about availability, pricing, and lead times for part number 10AX032H2F35I1SG.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018