10AX032H2F35I1SG

IC FPGA 384 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 21040128 320000 1152-BBGA, FCBGA

Quantity 647 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O384Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs119900Number of Logic Elements/Cells320000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits21040128

Overview of 10AX032H2F35I1SG – Arria 10 GX Field Programmable Gate Array (FPGA) IC

The 10AX032H2F35I1SG is an Arria 10 GX series FPGA in a 1152-FCBGA (35×35) package, offered as an industrial-grade, surface-mount device. It belongs to the Intel Arria 10 family of 20 nm mid-range FPGAs and SoCs and is aimed at applications that require high logic density, significant embedded memory, and broad I/O connectivity.

Typical markets for the Arria 10 family include wireless, wireline, broadcast, computing and storage, medical, and military systems where performance, power efficiency, and integration are important. This part pairs high logic capacity and embedded RAM with a compact FCBGA package and industrial temperature range for robust deployment.

Key Features

  • Core architecture  Part of the Intel Arria 10 family (20 nm mid-range FPGAs and SoCs) offering higher performance and power-efficiency characteristics described for the series.
  • Logic capacity  Approximately 320,000 logic elements suitable for complex programmable logic and system functions.
  • Embedded memory  Total on-chip RAM of 21,040,128 bits to support buffers, caches, and on-device data storage.
  • I/O  384 I/O pins to support broad peripheral and memory interfacing options.
  • DSP and signal processing blocks  Family-level features include variable-precision DSP blocks for arithmetic and signal processing functions (as described in the Arria 10 device documentation).
  • Serial and protocol support  Arria 10 family documentation notes low-power serial transceivers and hard IP for PCIe Gen1/2/3 and high-speed Ethernet use cases.
  • Package & mounting  1152-ball FCBGA (35×35) package, surface-mount design for dense board-level integration.
  • Power  Specified supply range: 0.870 V to 0.980 V, reflecting core voltage requirements for this device.
  • Temperature & grade  Industrial grade with operating range −40 °C to 100 °C for extended-environment deployment.
  • Environmental compliance  RoHS compliant.

Typical Applications

  • Wireless infrastructure  Channel and switch cards or remote radio head functions that require programmable logic and DSP capability.
  • Wireline networking  Line cards, muxponders, and transponders in 40G/100G systems that benefit from high logic density and high-speed serial interfaces.
  • Broadcast and professional AV  Studio switching and transport functions that need flexible I/O and embedded memory for buffering and protocol handling.
  • Compute acceleration and storage  Server acceleration, flash cache, and cloud compute functions leveraging on-chip RAM and DSP resources.
  • Medical and defense systems  Imaging, radar, and other mission-critical systems that require industrial temperature operation and programmable hardware adaptability.

Unique Advantages

  • High programmable logic density: 320,000 logic elements enable complex, large-scale digital designs on a single device.
  • Significant on-chip memory: 21,040,128 bits of embedded RAM reduce external memory dependency for many buffering and caching tasks.
  • Broad I/O count: 384 I/Os allow flexible interfacing to peripherals, memory, and high-speed links without extensive external multiplexing.
  • Industrial temperature range: −40 °C to 100 °C supports deployment in demanding environmental conditions.
  • Compact FCBGA package: 1152-ball (35×35) FCBGA balances high pin count with a compact board footprint for dense system designs.
  • Series-level protocol and power advantages: As part of the Arria 10 family, the device benefits from documented power-saving technologies and integrated hard IP for common high-speed protocols.

Why Choose 10AX032H2F35I1SG?

The 10AX032H2F35I1SG positions itself as an industrial-grade, mid-range FPGA solution with substantial logic and memory resources in a compact FCBGA package. It is suitable for engineers designing systems that require programmable acceleration, extensive I/O, and on-chip RAM while operating across a wide temperature range.

Selecting this Arria 10 GX device gives access to family-level features and documentation that support high-speed interfaces, DSP functionality, and power-management techniques—helping teams scale designs within the Arria 10 platform and rely on established device documentation during development.

Request a quote or submit an inquiry to learn about availability, pricing, and lead times for part number 10AX032H2F35I1SG.

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