10AX032H4F35I3LG

IC FPGA 384 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 21040128 320000 1152-BBGA, FCBGA

Quantity 1,049 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O384Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs119900Number of Logic Elements/Cells320000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits21040128

Overview of 10AX032H4F35I3LG – Arria 10 GX FPGA, 320,000 Logic Elements, 1152‑BBGA

The 10AX032H4F35I3LG is an Intel Arria 10 GX field‑programmable gate array (FPGA) device built on a 20‑nm mid‑range architecture. It combines high logic capacity, significant embedded RAM, and broad I/O to address performance‑ and power‑sensitive applications across wireless, wireline, broadcast, computing, medical, and defense markets.

This surface‑mount FCBGA device is offered in a 1152‑ball package and is qualified for industrial operation, providing a defined operating range and power envelope for system designs that require robust temperature and voltage characteristics.

Key Features

  • Core Logic  320,000 logic elements for implementing large, complex digital designs; device family supports Arria 10 GX architecture.
  • Embedded Memory  21,040,128 total RAM bits of on‑chip memory to support buffering, frame storage, and embedded data structures.
  • I/O Density  384 general‑purpose I/Os to interface with peripherals, memory devices, and high‑speed front ends.
  • Transceivers and High‑Speed Interfaces  Arria 10 GX devices include low‑power serial transceivers and hard IP options such as PCIe Gen1/Gen2/Gen3 and 10 Gbps Ethernet (as described for the Arria 10 family in the device overview).
  • DSP and Signal Processing  Variable‑precision DSP blocks and dedicated resources (as described for the Arria 10 family) for complex arithmetic and signal processing tasks.
  • Clocking and PLLs  Fractional synthesis and I/O PLLs are supported by the device family to provide flexible clock management and timing architectures.
  • Configuration and Reconfiguration  Supports dynamic and partial reconfiguration capabilities (described in the Arria 10 overview) to update functions in‑field without full device reload.
  • Power and Voltage  Core supply range of 870 mV to 980 mV to match system power‑delivery designs and enable predictable power budgeting.
  • Package and Mounting  1152‑BBGA (FCBGA) supplier package, 35×35 mm footprint, surface‑mount for automated PCB assembly.
  • Temperature and Compliance  Industrial operating temperature range of −40 °C to 100 °C and RoHS compliance for environmental requirements.

Typical Applications

  • Wireless infrastructure: Channel and switch cards in remote radio heads and mobile backhaul systems leveraging the device’s DSP and transceiver capabilities.
  • Wireline and optical networking: Line cards, muxponders, and transponders where high logic capacity, embedded memory, and high‑speed interfaces are required.
  • Broadcast and media processing: Studio switches, video processing, and transport functions that need large on‑chip memory and flexible I/O.
  • Compute and storage acceleration: Server acceleration, flash cache, and cloud computing tasks that benefit from FPGA acceleration and on‑chip resources.
  • Medical and defense systems: Diagnostic imaging, radar, and electronic warfare applications that require industrial temperature operation and high logic/memory capacity.

Unique Advantages

  • High logic capacity: 320,000 logic elements support complex algorithms and large‑scale designs without immediate migration to larger device families.
  • Substantial on‑chip RAM: Over 21 million bits of embedded RAM reduce external memory dependence for buffering and frame storage.
  • Extensive I/O resources: 384 I/Os enable dense connectivity to peripherals, memory interfaces, and front‑end modules.
  • Industrial temperature range: −40 °C to 100 °C rating supports deployment in harsh or temperature‑variable environments.
  • Flexible power envelope: Core voltage support from 870 mV to 980 mV allows designers to align power delivery and thermal planning with system constraints.
  • Advanced family features: Arria 10 family capabilities such as variable‑precision DSP blocks, low‑power serial transceivers, PCIe/10 GbE hard IP, and dynamic/partial reconfiguration provide design flexibility and system‑level integration.

Why Choose 10AX032H4F35I3LG?

The 10AX032H4F35I3LG positions itself as a high‑capacity, industrial‑grade Arria 10 GX FPGA suitable for mid‑range designs that require a balance of logic density, on‑chip memory, and versatile I/O. Its support for Arria 10 family features — including advanced DSP resources, serial transceivers, and configuration flexibility — makes it well suited for systems where performance and power efficiency must be balanced within a constrained form factor.

Designers targeting wireless and wireline infrastructure, broadcast, compute acceleration, medical imaging, or defense systems will find this device offers a compelling mix of integration, reconfigurability, and environmental robustness to support long‑lifecycle deployments.

If you would like pricing, availability, or a formal quote for 10AX032H4F35I3LG, submit a request and our team will respond with details tailored to your quantity and delivery needs.

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