10AX032H4F35I3LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 21040128 320000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,049 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA, FC (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 384 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 119900 | Number of Logic Elements/Cells | 320000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21040128 |
Overview of 10AX032H4F35I3LG – Arria 10 GX FPGA, 320,000 Logic Elements, 1152‑BBGA
The 10AX032H4F35I3LG is an Intel Arria 10 GX field‑programmable gate array (FPGA) device built on a 20‑nm mid‑range architecture. It combines high logic capacity, significant embedded RAM, and broad I/O to address performance‑ and power‑sensitive applications across wireless, wireline, broadcast, computing, medical, and defense markets.
This surface‑mount FCBGA device is offered in a 1152‑ball package and is qualified for industrial operation, providing a defined operating range and power envelope for system designs that require robust temperature and voltage characteristics.
Key Features
- Core Logic 320,000 logic elements for implementing large, complex digital designs; device family supports Arria 10 GX architecture.
- Embedded Memory 21,040,128 total RAM bits of on‑chip memory to support buffering, frame storage, and embedded data structures.
- I/O Density 384 general‑purpose I/Os to interface with peripherals, memory devices, and high‑speed front ends.
- Transceivers and High‑Speed Interfaces Arria 10 GX devices include low‑power serial transceivers and hard IP options such as PCIe Gen1/Gen2/Gen3 and 10 Gbps Ethernet (as described for the Arria 10 family in the device overview).
- DSP and Signal Processing Variable‑precision DSP blocks and dedicated resources (as described for the Arria 10 family) for complex arithmetic and signal processing tasks.
- Clocking and PLLs Fractional synthesis and I/O PLLs are supported by the device family to provide flexible clock management and timing architectures.
- Configuration and Reconfiguration Supports dynamic and partial reconfiguration capabilities (described in the Arria 10 overview) to update functions in‑field without full device reload.
- Power and Voltage Core supply range of 870 mV to 980 mV to match system power‑delivery designs and enable predictable power budgeting.
- Package and Mounting 1152‑BBGA (FCBGA) supplier package, 35×35 mm footprint, surface‑mount for automated PCB assembly.
- Temperature and Compliance Industrial operating temperature range of −40 °C to 100 °C and RoHS compliance for environmental requirements.
Typical Applications
- Wireless infrastructure: Channel and switch cards in remote radio heads and mobile backhaul systems leveraging the device’s DSP and transceiver capabilities.
- Wireline and optical networking: Line cards, muxponders, and transponders where high logic capacity, embedded memory, and high‑speed interfaces are required.
- Broadcast and media processing: Studio switches, video processing, and transport functions that need large on‑chip memory and flexible I/O.
- Compute and storage acceleration: Server acceleration, flash cache, and cloud computing tasks that benefit from FPGA acceleration and on‑chip resources.
- Medical and defense systems: Diagnostic imaging, radar, and electronic warfare applications that require industrial temperature operation and high logic/memory capacity.
Unique Advantages
- High logic capacity: 320,000 logic elements support complex algorithms and large‑scale designs without immediate migration to larger device families.
- Substantial on‑chip RAM: Over 21 million bits of embedded RAM reduce external memory dependence for buffering and frame storage.
- Extensive I/O resources: 384 I/Os enable dense connectivity to peripherals, memory interfaces, and front‑end modules.
- Industrial temperature range: −40 °C to 100 °C rating supports deployment in harsh or temperature‑variable environments.
- Flexible power envelope: Core voltage support from 870 mV to 980 mV allows designers to align power delivery and thermal planning with system constraints.
- Advanced family features: Arria 10 family capabilities such as variable‑precision DSP blocks, low‑power serial transceivers, PCIe/10 GbE hard IP, and dynamic/partial reconfiguration provide design flexibility and system‑level integration.
Why Choose 10AX032H4F35I3LG?
The 10AX032H4F35I3LG positions itself as a high‑capacity, industrial‑grade Arria 10 GX FPGA suitable for mid‑range designs that require a balance of logic density, on‑chip memory, and versatile I/O. Its support for Arria 10 family features — including advanced DSP resources, serial transceivers, and configuration flexibility — makes it well suited for systems where performance and power efficiency must be balanced within a constrained form factor.
Designers targeting wireless and wireline infrastructure, broadcast, compute acceleration, medical imaging, or defense systems will find this device offers a compelling mix of integration, reconfigurability, and environmental robustness to support long‑lifecycle deployments.
If you would like pricing, availability, or a formal quote for 10AX032H4F35I3LG, submit a request and our team will respond with details tailored to your quantity and delivery needs.

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