10AX032H4F35I3SG

IC FPGA 384 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 21040128 320000 1152-BBGA, FCBGA

Quantity 768 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O384Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs119900Number of Logic Elements/Cells320000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits21040128

Overview of 10AX032H4F35I3SG – Arria 10 GX Field Programmable Gate Array (FPGA) IC, 320000 logic elements, 384 I/Os

The 10AX032H4F35I3SG is an Intel Arria 10 GX FPGA in a 1152‑BBGA (FCBGA) package designed for midrange, performance‑sensitive applications. It combines a high logic capacity and large embedded RAM with an Arria 10 architecture that emphasizes performance and power efficiency.

Typical use cases span wireless and wireline communications, broadcast and video systems, computing and storage acceleration, medical imaging and defense applications where a balance of integration, I/O density and thermal range are required.

Key Features

  • Programmable Logic Capacity – 320,000 logic elements to implement complex FPGA designs and system logic.
  • Embedded Memory – 21,040,128 total RAM bits for on‑chip buffering, packet processing or cache‑style data storage.
  • I/O and Package – 384 general purpose I/Os delivered in a 1152‑BBGA (FCBGA, 35 × 35 mm) supplier package for high‑density board designs and flexible I/O interfacing.
  • Power and Supply – Core voltage supply range of 870 mV to 980 mV to support controlled power domains.
  • Industrial Temperature Grade – Rated for operation from −40 °C to 100 °C for industrial environments.
  • Surface Mount Package – Designed for standard surface‑mount assembly processes in high‑density systems.
  • Embedded System and IP Support – Datasheet describes integrated features such as fractional synthesis and I/O PLLs, clock networks, PCIe Gen1/Gen2/Gen3 hard IP, low‑power serial transceivers, variable‑precision DSP blocks and embedded memory blocks.
  • Configuration and Reconfiguration – Supports dynamic and partial reconfiguration workflows described in the Arria 10 device overview for flexible deployment and in-field updates.
  • RoHS Compliant – Conforms to RoHS environmental requirements.

Typical Applications

  • Wireless Infrastructure – Channel and switch card designs, remote radio heads and mobile backhaul systems that require programmable signal processing and flexible I/O.
  • Wireline Networking – 40G/100G muxponders, transponders and line cards that benefit from integrated transceivers and PCIe hard IP.
  • Broadcast and Professional AV – Studio switching, video transport and conferencing systems that use on‑chip memory and DSP resources for real‑time processing.
  • Compute and Storage Acceleration – Server and storage acceleration tasks such as flash cache and cloud server offload where large logic capacity and embedded RAM improve throughput.
  • Medical and Defense Systems – Diagnostic imaging, radar and secure communications that require a combination of performance, reconfigurability and industrial temperature operation.

Unique Advantages

  • High logic density: 320,000 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing system complexity.
  • Significant on‑chip memory: 21,040,128 total RAM bits enable extensive buffering and data‑path staging without immediate reliance on external memory.
  • Dense I/O in a compact package: 384 I/Os in a 1152‑BBGA footprint support high channel counts and multi‑lane interfaces while keeping board area optimized.
  • Industrial temperature operation: −40 °C to 100 °C rating supports deployment in thermally demanding and industrial environments.
  • Integrated system IP and transceivers: On‑device PCIe hard IP, low‑power serial transceivers and DSP resources reduce external component needs and accelerate time‑to‑market.
  • Reconfiguration flexibility: Support for dynamic and partial reconfiguration enables in‑field updates and adaptable system behavior without full device reprogramming.

Why Choose 10AX032H4F35I3SG?

The 10AX032H4F35I3SG positions itself as a high‑capacity, power‑aware FPGA option within the Arria 10 family, providing a balanced combination of logic resources, embedded memory and integrated IP for midrange performance applications. Its industrial temperature rating and RoHS compliance make it suitable for demanding environments that require reliable operation over a wide thermal range.

This device is appropriate for engineers building communication systems, video processing platforms, compute accelerators or specialized industrial and defense equipment who need substantial on‑chip resources, flexible I/O and support for advanced configuration and transceiver features described in the Arria 10 device documentation.

Request a quote or submit a sales inquiry to obtain pricing, availability and technical purchasing details for 10AX032H4F35I3SG.

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