10AX048E2F29E2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 5664768 480000 780-BBGA, FCBGA |
|---|---|
| Quantity | 105 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA, FC (29x29) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 183590 | Number of Logic Elements/Cells | 480000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5664768 |
Overview of 10AX048E2F29E2SG – Arria 10 GX FPGA, 480,000 Logic Elements
The Intel Arria 10 GX 10AX048E2F29E2SG is a high-density Field Programmable Gate Array (FPGA) in a 780‑ball FCBGA package. Built on the Arria 10 device family architecture, this part combines large on-chip logic and embedded memory with a significant I/O count for mid‑range, performance‑sensitive applications.
This device targets markets where a balance of performance and power efficiency is required, including wireless and wireline infrastructure, broadcast, computing and storage, medical imaging, and defense electronics. Key value propositions include high logic density, substantial embedded RAM, and a compact surface‑mount package suitable for board‑level integration.
Key Features
- High logic density — 480,000 logic elements to implement complex FPGA designs and custom accelerators.
- On‑chip memory — 5,664,768 total RAM bits for buffering, packet processing, and on‑chip data storage.
- Generous I/O — 360 I/O pins to support multiple external interfaces and high‑pin‑count connectivity.
- Package & mounting — 780‑BBGA (FCBGA) supplier package, 29 × 29 mm nominal footprint, surface‑mount for compact PCB designs.
- Power requirements — Core voltage supply range 870 mV to 980 mV, enabling designs tuned for the Arria 10 power rails.
- Operating range & grade — Extended grade with an operating temperature range of 0°C to 100°C for applications requiring above‑commercial temperature coverage.
- RoHS compliant — Conforms to RoHS environmental requirements.
Typical Applications
- Wireless infrastructure — Channel processing and radio head functions that leverage on‑chip logic and memory density for real‑time signal tasks.
- Wireline and telecom — Line cards, muxponders and transponders benefiting from high I/O counts and on‑chip buffering.
- Broadcast and professional A/V — High‑throughput switching, encoding/decoding assist, and transport functions using embedded RAM and logic resources.
- Compute acceleration and storage — Offload and acceleration tasks in servers and storage systems using the device’s logic resources and memory capacity.
- Medical and defense electronics — Imaging and signal processing pipelines that use dense logic and RAM for deterministic processing within the specified operating range.
Unique Advantages
- Substantial on‑chip resources: 480,000 logic elements and 5,664,768 RAM bits reduce dependence on external components and simplify board design.
- High connectivity: 360 I/O pins provide flexibility to interface with multi‑lane PHYs, memory interfaces, and peripheral devices.
- Compact BGA package: 780‑ball FCBGA (29×29) enables dense PCB layouts while remaining surface‑mount compatible.
- Extended operating range: 0°C to 100°C grade suits applications needing more than standard commercial temperature coverage.
- Vendor documentation and support: Part of the Intel Arria 10 family with published device overview and supporting documentation to aid development and integration.
Why Choose 10AX048E2F29E2SG?
The 10AX048E2F29E2SG Arria 10 GX FPGA delivers a balanced combination of high logic capacity, sizable embedded RAM, and a large I/O complement in a compact surface‑mount BGA. It is positioned for mid‑range systems where designers need significant on‑chip resources and a controlled operating envelope (0°C to 100°C) while remaining RoHS compliant.
This device suits system designers building wireless and wireline infrastructure, broadcast equipment, compute acceleration modules, medical imaging systems, and defense electronics that rely on deterministic FPGA-based processing. Backed by Intel Arria 10 device documentation, it offers a clear path for design implementation and lifecycle support.
If you would like pricing, availability, or a formal quote for 10AX048E2F29E2SG, submit a request and our team will provide details and lead‑time information.

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