10AX057K4F35I3SG

IC FPGA 396 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 396 42082304 570000 1152-BBGA, FCBGA

Quantity 915 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O396Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs217080Number of Logic Elements/Cells570000
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits42082304

Overview of 10AX057K4F35I3SG – Arria 10 GX FPGA, 1152‑FCBGA

The 10AX057K4F35I3SG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 1152‑FCBGA (35×35) package. It is part of the Arria 10 family of 20 nm mid‑range FPGAs and SoCs designed for high performance and power efficiency.

With 570,000 logic elements, 42,082,304 total RAM bits and 396 I/O pins, this industrial‑grade device targets mid‑range applications across wireless, wireline, broadcast, computing, medical and defense markets where high integration, low power and advanced I/O are required.

Key Features

  • Core Logic — 570,000 logic elements provide substantial programmable capacity for complex mid‑range FPGA designs; Arria 10 architecture includes adaptive logic resources and variable‑precision DSP capability described in the device family overview.
  • Embedded Memory — 42,082,304 total RAM bits of on‑chip memory and embedded memory block options to support buffering, caching and high‑throughput data handling.
  • I/O and High‑Speed Interfaces — 396 I/O pins and family features for FPGA general‑purpose I/O and external memory interfaces; Arria 10 device documentation references PCIe Gen1/Gen2/Gen3 hard IP and enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet.
  • Serial Transceivers and IP — Family documentation highlights low‑power serial transceivers and hard IP for high‑speed serial protocols to simplify integration of multi‑Gb/s links.
  • Power — Core supply range of 870 mV to 930 mV and family‑level power‑saving technologies aimed at power‑sensitive applications.
  • Package & Mounting — 1152‑BBGA (FCBGA) surface‑mount package (35×35 mm) delivering high pin density for compact system designs.
  • Temperature & Reliability — Industrial operating temperature range from −40 °C to 100 °C; family documentation includes features for SEU detection and correction, dynamic and partial reconfiguration, and power management.
  • Compliance — RoHS compliant.

Typical Applications

  • Wireless infrastructure: Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging high logic density and serial transceivers.
  • Wireline networking: 40G/100G muxponders, transponders and line cards that benefit from PCIe hard IP and enhanced PCS support for Interlaken and 10 Gbps Ethernet.
  • Broadcast and media: Studio switches, videoconferencing and professional audio/video processing using large on‑chip memory and DSP capabilities.
  • Computing and storage: Flash cache, cloud servers and acceleration cards that require extensive logic, on‑chip RAM and high‑speed interfaces.
  • Medical and defense systems: Diagnostic imaging, radar and secure communications where industrial temperature range and reliability features are important.

Unique Advantages

  • High programmable capacity: 570,000 logic elements enable implementation of complex mid‑range architectures without immediate escalation to larger device families.
  • Large on‑chip memory: Over 42 million RAM bits for deep buffering, tightly coupled caches or streaming data processing within the FPGA fabric.
  • Comprehensive I/O and protocol support: 396 I/Os plus Arria 10 family hard IP for PCIe and 10 Gbps Ethernet reduce external logic and simplify board‑level design.
  • Industrial temperature rating: −40 °C to 100 °C operation supports deployment in a wide range of environmental conditions.
  • Power‑aware operation: Core voltage specification (870–930 mV) and family‑level power management features help optimize energy use in power‑sensitive systems.
  • High‑density package: 1152‑FCBGA (35×35) offers a compact, high‑pin‑count solution for space‑constrained designs.

Why Choose 10AX057K4F35I3SG?

The 10AX057K4F35I3SG positions itself as a high‑capacity, industrial‑grade Arria 10 GX device for mid‑range applications requiring a balance of logic resources, on‑chip memory and advanced I/O. Its Arria 10 family features—such as DSP resources, embedded memory blocks, hard IP for common high‑speed protocols, and support for serial transceivers—combine to simplify system integration and accelerate time to market.

This device is suitable for engineers and system designers building wireless infrastructure, high‑speed networking, broadcast and compute/acceleration platforms who need scalable logic, substantial memory, broad interface support and industrial temperature operation backed by Arria 10 device documentation and design resources.

Request a quote or submit a pricing inquiry to receive availability and ordering information for the 10AX057K4F35I3SG.

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