10AX057K4F40E3LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 696 42082304 570000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 312 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 217080 | Number of Logic Elements/Cells | 570000 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 42082304 |
Overview of 10AX057K4F40E3LG – Arria 10 GX FPGA, 570000 Logic Elements, 1517-FCBGA
The 10AX057K4F40E3LG is an Intel Arria 10 GX family field-programmable gate array (FPGA) delivered in a 1517-FCBGA (40×40) package. It combines a high-density programmable fabric with on-chip embedded memory and a large I/O complement for mid-range, performance-sensitive applications.
Designed on a 20 nm architecture, this device targets markets including wireless, wireline, broadcast, computing and storage, medical, and military systems where a balance of performance, power efficiency, and integration is required.
Key Features
- Core density: 570,000 logic elements providing substantial programmable logic capacity for complex designs and system integration.
- Embedded memory: 42,082,304 total RAM bits to support large on-chip buffering, caching, and algorithm acceleration without immediate external memory dependence.
- I/O and interfaces: 696 user I/Os to accommodate broad peripheral connectivity and multiple high-speed interface lanes.
- Serial transceivers and protocol support: Family-level features include low-power serial transceivers and support for high-speed protocols such as PCIe Gen1/2/3 and 10 Gbps Ethernet.
- Package and mounting: 1517-FCBGA (1517-BBGA) surface-mount package (40×40) for high-density board layouts.
- Power and thermal: Voltage supply range 870 mV to 930 mV and operating temperature range 0 °C to 100 °C; device is listed as Extended grade.
- Process and efficiency: Built on a 20 nm process with on-family power-saving technologies for improved power efficiency in mid-range FPGA applications.
- Compliance: RoHS compliant.
Typical Applications
- Wireless infrastructure: Channel and switch cards in remote radio heads and mobile backhaul solutions where programmable logic and transceiver integration accelerate baseband and transport functions.
- Wireline communications: 40G/100G muxponders, transponders and line cards that require large logic capacity and support for high-speed protocols.
- Broadcast and professional AV: Studio switches, transport and videoconferencing equipment benefiting from large on-chip memory and dense I/O.
- Computing and storage acceleration: Flash cache, cloud server acceleration, and server offload tasks that leverage extensive logic and embedded RAM for compute and buffering tasks.
- Medical and defense systems: Diagnostic imaging, radar, and secure communications where configurable logic and on-chip resources support specialized signal processing.
Unique Advantages
- Highly scalable logic capacity: 570,000 logic elements enable integration of large FPGA-based subsystems or consolidation of multiple functions into a single device.
- Large on-chip memory: Over 42 million RAM bits reduce external memory bandwidth requirements and simplify memory architecture for data-intensive designs.
- Extensive I/O footprint: 696 I/Os provide flexibility to interface with a wide range of peripherals, memory interfaces, and transceiver channels.
- Compact, high-density package: 1517-FCBGA (40×40) supports high pin-count designs while minimizing PCB area.
- Power-aware 20 nm architecture: Family-level power-saving technologies help manage system power in performance-sensitive applications.
- Extended operating range: Extended grade with 0 °C to 100 °C operating temperature and a defined supply voltage window (870–930 mV) for predictable system integration.
Why Choose 10AX057K4F40E3LG?
This Arria 10 GX device balances high logic density, substantial embedded memory, and broad I/O to address mid-range FPGA application needs where integration and performance matter. Its 20 nm architecture and family-level transceiver and protocol support make it suitable for designs requiring programmable acceleration, high-speed connectivity, and on-chip data handling.
Engineers and procurement teams will find the 10AX057K4F40E3LG suitable for scalable system designs across communications, compute, broadcast, medical, and defense markets where a combination of capacity, I/O, and power-aware operation delivers long-term value within the Intel Arria 10 ecosystem.
Request a quote or submit an inquiry to obtain pricing, availability, and detailed ordering information for the 10AX057K4F40E3LG. Our team can assist with volume pricing and lead-time details tailored to your design needs.

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