10AX057K4F40E3LG

IC FPGA 696 I/O 1517FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 696 42082304 570000 1517-BBGA, FCBGA

Quantity 312 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs217080Number of Logic Elements/Cells570000
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits42082304

Overview of 10AX057K4F40E3LG – Arria 10 GX FPGA, 570000 Logic Elements, 1517-FCBGA

The 10AX057K4F40E3LG is an Intel Arria 10 GX family field-programmable gate array (FPGA) delivered in a 1517-FCBGA (40×40) package. It combines a high-density programmable fabric with on-chip embedded memory and a large I/O complement for mid-range, performance-sensitive applications.

Designed on a 20 nm architecture, this device targets markets including wireless, wireline, broadcast, computing and storage, medical, and military systems where a balance of performance, power efficiency, and integration is required.

Key Features

  • Core density: 570,000 logic elements providing substantial programmable logic capacity for complex designs and system integration.
  • Embedded memory: 42,082,304 total RAM bits to support large on-chip buffering, caching, and algorithm acceleration without immediate external memory dependence.
  • I/O and interfaces: 696 user I/Os to accommodate broad peripheral connectivity and multiple high-speed interface lanes.
  • Serial transceivers and protocol support: Family-level features include low-power serial transceivers and support for high-speed protocols such as PCIe Gen1/2/3 and 10 Gbps Ethernet.
  • Package and mounting: 1517-FCBGA (1517-BBGA) surface-mount package (40×40) for high-density board layouts.
  • Power and thermal: Voltage supply range 870 mV to 930 mV and operating temperature range 0 °C to 100 °C; device is listed as Extended grade.
  • Process and efficiency: Built on a 20 nm process with on-family power-saving technologies for improved power efficiency in mid-range FPGA applications.
  • Compliance: RoHS compliant.

Typical Applications

  • Wireless infrastructure: Channel and switch cards in remote radio heads and mobile backhaul solutions where programmable logic and transceiver integration accelerate baseband and transport functions.
  • Wireline communications: 40G/100G muxponders, transponders and line cards that require large logic capacity and support for high-speed protocols.
  • Broadcast and professional AV: Studio switches, transport and videoconferencing equipment benefiting from large on-chip memory and dense I/O.
  • Computing and storage acceleration: Flash cache, cloud server acceleration, and server offload tasks that leverage extensive logic and embedded RAM for compute and buffering tasks.
  • Medical and defense systems: Diagnostic imaging, radar, and secure communications where configurable logic and on-chip resources support specialized signal processing.

Unique Advantages

  • Highly scalable logic capacity: 570,000 logic elements enable integration of large FPGA-based subsystems or consolidation of multiple functions into a single device.
  • Large on-chip memory: Over 42 million RAM bits reduce external memory bandwidth requirements and simplify memory architecture for data-intensive designs.
  • Extensive I/O footprint: 696 I/Os provide flexibility to interface with a wide range of peripherals, memory interfaces, and transceiver channels.
  • Compact, high-density package: 1517-FCBGA (40×40) supports high pin-count designs while minimizing PCB area.
  • Power-aware 20 nm architecture: Family-level power-saving technologies help manage system power in performance-sensitive applications.
  • Extended operating range: Extended grade with 0 °C to 100 °C operating temperature and a defined supply voltage window (870–930 mV) for predictable system integration.

Why Choose 10AX057K4F40E3LG?

This Arria 10 GX device balances high logic density, substantial embedded memory, and broad I/O to address mid-range FPGA application needs where integration and performance matter. Its 20 nm architecture and family-level transceiver and protocol support make it suitable for designs requiring programmable acceleration, high-speed connectivity, and on-chip data handling.

Engineers and procurement teams will find the 10AX057K4F40E3LG suitable for scalable system designs across communications, compute, broadcast, medical, and defense markets where a combination of capacity, I/O, and power-aware operation delivers long-term value within the Intel Arria 10 ecosystem.

Request a quote or submit an inquiry to obtain pricing, availability, and detailed ordering information for the 10AX057K4F40E3LG. Our team can assist with volume pricing and lead-time details tailored to your design needs.

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