10AX090N3F45I2SG

IC FPGA 768 I/O 1932FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 768 59234304 900000 1932-BBGA, FCBGA

Quantity 95 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O768Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs339620Number of Logic Elements/Cells900000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits59234304

Overview of 10AX090N3F45I2SG – Arria 10 GX FPGA, 900,000 logic elements, 768 I/O, 1932‑FCBGA

The 10AX090N3F45I2SG is an Intel Arria 10 GX field programmable gate array (FPGA) IC designed for high‑performance, power‑sensitive midrange applications. It integrates 900,000 logic elements, 59,234,304 bits of embedded RAM, and 768 I/O to support complex, high‑density designs.

As part of the Arria 10 family — a 20 nm midrange FPGA/SoC portfolio — this industrial‑grade device targets markets such as wireless, wireline, broadcast, computing and storage, medical, and military systems where a balance of performance and power efficiency is required.

Key Features

  • Logic Capacity — 900,000 logic elements for implementing large, high‑complexity digital designs and custom logic.
  • Embedded Memory — 59,234,304 total RAM bits to support large on‑chip buffering, packet processing, and data‑path acceleration.
  • I/O and Package — 768 user I/O pins in a 1932‑FBGA (1932‑FCBGA, 45×45) surface‑mount package for high‑density board integration.
  • Transceivers and Interfaces — Arria 10 device family features low‑power serial transceivers, enhanced PCS hard IP for 10 Gbps Ethernet and Interlaken, and PCIe Gen1/Gen2/Gen3 hard IP support (series features).
  • Clocking and PLLs — Integrated clock networks with fractional synthesis and I/O PLLs to support flexible clocking and multi‑rate interfaces (series features).
  • DSP and Compute Blocks — Variable‑precision DSP blocks and Adaptive Logic Modules to accelerate signal processing and compute pipelines (series features).
  • Power and Supply — Operates from supply rails between 870 mV and 930 mV, enabling optimized power management for power‑sensitive implementations.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Compliance — RoHS compliant.

Typical Applications

  • Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging high logic density and embedded memory for signal processing.
  • Wireline Networking — 40G/100G muxponders, transponders, and line cards using integrated transceivers and high I/O count for high‑speed data paths.
  • Broadcast and Professional AV — Studio switches and video transport systems benefiting from large on‑chip RAM and flexible clocking for media streams.
  • Computing and Storage — Flash cache, server acceleration, and cloud computing server functions that use dense logic and DSP resources for acceleration tasks.
  • Medical and Defense Systems — Diagnostic imaging, radar, and secure communications where the industrial temperature range and high integration support robust deployments.

Unique Advantages

  • High logic density: 900,000 logic elements enable consolidation of multiple functions into a single device, reducing board complexity.
  • Large on‑chip memory: 59,234,304 RAM bits provide ample capacity for buffering, lookup tables, and on‑chip data processing.
  • Broad I/O and package options: 768 I/O in a 1932‑FCBGA (45×45) footprint supports high‑pin‑count system interfaces and dense routing.
  • Industrial robustness: −40 °C to 100 °C operating range and industrial grade classification support deployment in demanding environments.
  • Power‑aware operation: Narrow supply window (870 mV–930 mV) and the Arria 10 family’s power‑efficiency focus help optimize system power budgets.
  • Series ecosystem and documentation: Backed by Intel Arria 10 device documentation and device‑level resources for design guidance and configuration options.

Why Choose 10AX090N3F45I2SG?

The 10AX090N3F45I2SG positions itself as a high‑capacity, industrial‑grade Arria 10 GX FPGA offering a balance of logic density, embedded memory, and I/O richness for midrange systems that require both performance and power efficiency. Its package and thermal ratings make it suitable for complex board designs and harsh operating conditions.

Design teams targeting wireless and wireline infrastructure, broadcast, compute acceleration, or mission‑critical medical and defense applications will find a scalable, well‑documented platform in the Arria 10 family, supported by Intel's device resources for configuration, clocking, and high‑speed interface integration.

Request a quote or submit an inquiry for part 10AX090N3F45I2SG to receive pricing and availability information for your next design.

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