10AX090N3F45I2LG

IC FPGA 768 I/O 1932FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 768 59234304 900000 1932-BBGA, FCBGA

Quantity 912 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O768Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs339620Number of Logic Elements/Cells900000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits59234304

Overview of 10AX090N3F45I2LG – Arria 10 GX Field Programmable Gate Array (FPGA), 900000 logic elements

The 10AX090N3F45I2LG is an Intel Arria 10 GX FPGA in a 1932-FCBGA (45×45) package intended for industrial applications. This mid-range 20 nm family device integrates high logic capacity, large embedded memory, and extensive I/O to address demanding signal processing, communications, and compute-acceleration tasks.

With 900,000 logic elements, 59,234,304 total RAM bits, and 768 I/O, the device targets applications that require dense programmable logic, substantial on-chip memory, and broad interfacing capability while operating across an industrial temperature range.

Key Features

  • Core Logic 900,000 logic elements provide substantial programmable capacity for complex logic, custom datapaths, and large-scale state machines.
  • Embedded Memory 59,234,304 total RAM bits of on-chip memory support buffering, large lookup tables, and embedded data storage requirements.
  • I/O Density 768 user I/Os enable extensive external interfacing for high-pin-count systems and multi-channel connectivity.
  • Transceiver and IP Capabilities Arria 10 family features listed in the device overview include support for low-power serial transceivers, PCIe Gen1/2/3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and fractional/PLL clock synthesis.
  • DSP and Logic Architecture The device family references Adaptive Logic Modules and Variable-Precision DSP blocks for efficient implementation of signal processing and algorithmic workloads.
  • Package and Mounting 1932-FCBGA (45×45) package, surface-mount construction suitable for high-density board designs.
  • Power and Supply Supported voltage supply range of 870 mV to 930 mV enables defined core operating conditions for system power design.
  • Operating Range and Reliability Industrial-grade operation from −40 °C to 100 °C and RoHS compliance for use in regulated environments.

Typical Applications

  • Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul systems leveraging the device’s logic density and transceiver support.
  • Wireline Networking 40G/100G muxponders, transponders, and line cards that require high I/O counts and embedded memory for packet buffering and protocol handling.
  • Broadcast and Professional AV Studio switches, video transport, and streaming equipment using on-chip memory and DSP resources for real-time media processing.
  • Computing and Storage Server acceleration, flash cache, and cloud compute offloads that benefit from large logic capacity and PCIe hard IP integration.

Unique Advantages

  • High Logic Capacity: 900,000 logic elements enable complex designs and high gate-count implementations without external logic expansion.
  • Large On-Chip Memory: 59,234,304 RAM bits reduce dependency on external memory for buffering and LUT-based functions, simplifying system memory architecture.
  • Extensive I/O Footprint: 768 I/Os support multi-channel interfaces and high-density board-level integration for connectivity-rich applications.
  • Industrial Temperature Rating: −40 °C to 100 °C operating range suits deployments in industrial environments with wide temperature swings.
  • System-Level IP and Transceiver Support: Built-in hard IP blocks and low-power transceiver features (noted in the Arria 10 device overview) accelerate implementation of PCIe, Ethernet, and serial link protocols.
  • Compact, High-Density Package: 1932-FCBGA (45×45) packaging enables dense component placement and streamlined board layouts.

Why Choose 10AX090N3F45I2LG?

The 10AX090N3F45I2LG delivers a combination of large programmable logic, substantial embedded RAM, and broad I/O that positions it for mid-range to high-performance industrial designs. Its Arria 10 GX family attributes—such as DSP resources, PLL/clock network capabilities, and transceiver/IP support—make it suitable for communications, compute acceleration, and high-throughput signal processing tasks.

Engineers seeking a robust, industrial-grade FPGA with verified Arria 10 family features will find the 10AX090N3F45I2LG offers scalable logic capacity, on-chip memory, and I/O flexibility that support long-term design roadmaps and integration into complex systems.

Request a quote or submit an inquiry to evaluate 10AX090N3F45I2LG for your next design project. Our team can provide pricing, availability, and assistance with technical requirements.

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