10AX090N3F40I2LG

IC FPGA 600 I/O 1517FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 600 59234304 900000 1517-BBGA, FCBGA

Quantity 612 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs339620Number of Logic Elements/Cells900000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits59234304

Overview of 10AX090N3F40I2LG – Arria 10 GX Field Programmable Gate Array (FPGA) IC 600 59234304 900000 1517-BBGA, FCBGA

The 10AX090N3F40I2LG is an Intel Arria 10 GX FPGA in a 1517-FCBGA (40×40) surface-mount package. It is part of the Intel Arria 10 device family — a line of 20 nm mid-range FPGAs designed for higher performance and power-efficient operation.

With 900,000 logic elements, 59,234,304 bits of embedded RAM and 600 I/O pins, this device targets high-performance, power-sensitive midrange applications across markets such as wireless, wireline, broadcast, computing and storage, medical, and military.

Key Features

  • Programmable Core  900,000 logic elements provide substantial programmable capacity for complex FPGA designs and system acceleration tasks.
  • Embedded Memory  59,234,304 total RAM bits of on-chip memory to support large buffering and data-path implementations.
  • I/O Density  600 programmable I/O pins support dense external interfacing and system connectivity in a single device.
  • Package & Mounting  1517-BBGA, FCBGA (1517-FCBGA, 40×40) surface-mount package for compact board integration.
  • Operating Range  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for temperature-demanding deployments.
  • Power Supply  Core voltage supply range 870 mV to 930 mV, enabling defined power delivery and system-level power planning.
  • High‑speed Interfaces  Device family documentation highlights support for PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers.
  • 20 nm Architecture  Part of the Arria 10 20 nm mid-range FPGA family, offering the performance and power-efficiency characteristics described in Intel’s device overview.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment where programmable logic and high I/O density are required.
  • Wireline Networking  40G/100G muxponders, transponders and line cards leveraging the device’s embedded memory and high‑speed interface hard IP.
  • Broadcast & Pro AV  Studio switching and professional audio/video processing with large on-chip RAM for buffering and real-time processing.
  • Computing & Storage  Flash cache and server acceleration applications that benefit from large logic capacity and integrated memory resources.
  • Medical & Military  Diagnostic imaging, radar, and electronic warfare systems that require industrial temperature operation and programmable hardware acceleration.

Unique Advantages

  • Substantial Programmable Capacity: 900,000 logic elements enable implementation of complex algorithms and large custom accelerators on a single FPGA.
  • Large On‑Chip Memory: 59,234,304 bits of embedded RAM reduce external memory dependency and improve data throughput for buffering and streaming workloads.
  • High I/O Count: 600 I/O pins support dense peripheral and memory interfaces without sacrificing board-level integration.
  • Industrial Temperature Range: Rated for −40 °C to 100 °C operation to meet thermal requirements in demanding environments.
  • Broad Interface Support: Device family-level features include PCIe Gen1/2/3 hard IP and 10 Gbps Ethernet support, enabling modern high-speed system designs.
  • Compact FCBGA Packaging: 1517-FCBGA (40×40) surface-mount package delivers a balance of integration density and PCB footprint efficiency.

Why Choose 10AX090N3F40I2LG?

The 10AX090N3F40I2LG Arria 10 GX FPGA combines large programmable logic capacity, substantial on-chip memory and a high I/O count in an industrial‑rated, compact FCBGA package. It is positioned for midrange, power-sensitive applications where performance, integration and thermal robustness are required.

Engineers implementing networking, wireless infrastructure, broadcast, compute acceleration or imaging systems can leverage the device’s logic and memory resources alongside Arria 10 family interface capabilities. The device is supported by Intel’s Arria 10 documentation and device overview for system-level integration and design planning.

Request a quote or submit an RFQ to receive pricing and availability for the 10AX090N3F40I2LG Arria 10 GX FPGA.

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