10AX090N3F40E2SG

IC FPGA 600 I/O 1517FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 600 59234304 900000 1517-BBGA, FCBGA

Quantity 527 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs339620Number of Logic Elements/Cells900000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits59234304

Overview of 10AX090N3F40E2SG – Arria 10 GX Field Programmable Gate Array (FPGA) IC

The 10AX090N3F40E2SG is an Intel Arria 10 GX family FPGA delivered in a 1517-FCBGA (40×40) package. It provides a high-density, power-conscious programmable fabric suited for mid-range applications that require significant logic capacity, on-chip memory, and large I/O counts.

Arria 10 devices target markets such as wireless, wireline, broadcast, computing and storage, medical, and military applications where a balance of performance and power efficiency matters. This part combines 900,000 logic elements and extensive embedded RAM to support complex, high-bandwidth designs.

Key Features

  • Core Logic Capacity  900,000 logic elements for implementing large state machines, datapaths, and custom accelerators.
  • Embedded Memory  Total on-chip RAM of 59,234,304 bits to support buffering, caches, and packet processing functions.
  • I/O Density  Up to 600 I/O pins to enable broad external connectivity and multi-channel interfaces.
  • Package & Mounting  1517-BBGA, FCBGA package (1517-FCBGA 40×40) with surface-mount mounting type for dense board integration.
  • Power Supply  Nominal supply range from 870 mV to 930 mV, enabling tight power delivery and regulation design.
  • Operating Temperature  Rated for 0 °C to 100 °C operation for extended-temperature applications.
  • Compliance  RoHS compliant.
  • Extended Grade  Device grade listed as Extended for designs requiring a wider operating window than commercial-only parts.
  • Series Capabilities (Arria 10)  Series-level features include power-optimized architecture, embedded memory and DSP resources, and integrated transceiver and high-speed interfaces as documented in the Arria 10 device overview.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards or remote radio head processing that leverage high logic density and on-chip memory for signal processing.
  • Wireline Communications  Line cards, muxponders, and transponder front-ends that require multi‑lane I/O density and programmable protocol handling.
  • Broadcast and Media  Studio switching, video transport, and professional audio/video processing where large on-chip RAM and logic implement custom pipelines.
  • Compute & Storage Acceleration  Server acceleration, flash cache controllers, and cloud compute offloads that use the FPGA fabric for application-specific acceleration.
  • Medical & Defense Systems  Diagnostic imaging and radar/signal-processing applications that demand dense logic, memory, and extended operational temperature range.

Unique Advantages

  • High Logic Density: 900,000 logic elements reduce the need to partition designs across multiple devices, simplifying system architecture.
  • Large On-Chip Memory: 59,234,304 bits of embedded RAM support deep buffering and complex dataflow without heavy external memory dependence.
  • Extensive I/O Count: 600 I/Os provide flexibility for multi-channel interfaces and high connector counts on system boards.
  • Compact, Surface-Mount FCBGA Packaging: 1517-FCBGA (40×40) enables dense PCB layouts while maintaining thermal and electrical connectivity for high-performance designs.
  • Designed for Power Efficiency: The Arria 10 family emphasizes performance-per-watt, and this device’s supply voltage range (870 mV–930 mV) supports optimized power delivery strategies.
  • Extended Temperature Grade: Rated for 0 °C to 100 °C to meet requirements beyond standard commercial operation.

Why Choose 10AX090N3F40E2SG?

The 10AX090N3F40E2SG positions itself as a high-capacity, power-aware FPGA suited for mid-range systems that demand significant programmable logic, substantial embedded memory, and broad external connectivity. Its Arria 10 lineage provides architecture and feature sets targeted at signal processing, high-speed communications, and compute acceleration.

Engineers and procurement teams can rely on this device for designs that need scalability within the Arria 10 family, consolidated logic and memory resources to reduce board complexity, and an extended operating window for applications outside narrow commercial temperature ranges.

Request a quote or submit an inquiry for pricing and availability to begin integrating the 10AX090N3F40E2SG into your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up