10AX090N3F40I2SG

The 10AX090N3F40I2SG is an Intel Arria 10 GX Field Programmable Gate Array supplied in a 1517-FCBGA (40×40) package. It is part of the Arria 10 device family of 20 nm mid-range FPGAs and SoCs targeted at high-performance, power-sensitive midrange applications.

With 900,000 logic elements, 59,234,304 total RAM bits and 600 I/O pins, this industrial-grade, surface-mount FPGA is suited to markets such as wireless, wireline, broadcast, computing and storage, medical, and military applications where high integration, I/O density and extended temperature range matter.

Key Features

• Core Capacity — 900,000 logic elements to implement large, complex logic designs and system-level integration.
• Embedded Memory — 59,234,304 total RAM bits for on-chip buffering, caching and memory-intensive functions.
• I/O Density — 600 user I/O pins to support high-channel-count interfaces and parallel connectivity.
• Package & Mounting — 1517-BBGA (1517-FCBGA, 40×40) surface-mount package suitable for compact board layouts.
• Power — Core supply range specified at 870 mV to 930 mV to match low-voltage power domains.
• Operating Range — Industrial temperature operation from −40 °C to 100 °C for demanding environments.
• Family Capabilities (from Arria 10) — Device family features include variable-precision DSP blocks, embedded memory blocks and configurations, clock networks with PLL clock sources, PCIe Gen1/2/3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers.
• Configuration & Reliability — Supports dynamic and partial reconfiguration and includes power management and SEU error detection and correction features as described for the Arria 10 family.
• Compliance — RoHS compliant.

Typical Applications

• Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul designs that require high logic and I/O capacity.
• Wireline networking — 40G/100G muxponders, transponders and line cards where PCIe and high-speed serial interfaces are needed.
• Broadcast and media — Studio switching, professional audio/video processing and videoconferencing systems leveraging large on-chip memory and DSP resources.
• Compute acceleration and storage — Server acceleration, flash cache and cloud compute functions that benefit from dense logic, embedded RAM and high I/O.
• Medical and defense systems — Diagnostic imaging, radar, missile guidance and secure communications requiring industrial temperature operation and on-board reliability features.

Unique Advantages

• High logic capacity: 900,000 logic elements enable consolidation of complex functions into a single FPGA, reducing BOM and board complexity.
• Large on-chip memory: 59,234,304 RAM bits provide substantial local buffering and fast data access for DSP and packet processing tasks.
• High I/O count: 600 I/Os support dense connectivity and multiple parallel interfaces without external multiplexing.
• Industrial temperature rating: −40 °C to 100 °C operation suits extended-environment applications and field-deployed systems.
• Low-voltage core: 870–930 mV supply range accommodates modern low-voltage power architectures for lower power consumption.
• Family-level IP and features: Arria 10 family capabilities such as DSP blocks, PLLs, PCIe hard IP and high-speed transceivers simplify system integration and accelerate development.

Why Choose 10AX090N3F40I2SG?

The 10AX090N3F40I2SG combines large logic and memory resources with high I/O density and industrial temperature capability, positioning it for demanding midrange designs that require both performance and robustness. As an Arria 10 GX device, it benefits from family-level architectural features—DSP functionality, rich clocking and high-speed serial and PCIe hard IP—that help shorten development time for complex signal processing, networking and compute acceleration projects.

Selecting this FPGA supports scalable, integrated designs where on-chip resources reduce external components and improve system reliability. Its RoHS compliance, surface-mount FCBGA package and specified voltage and temperature ranges make it suitable for engineered production environments and long-term deployments.

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