10AX090N3F40E2LG

IC FPGA 600 I/O 1517FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 600 59234304 900000 1517-BBGA, FCBGA

Quantity 1,076 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs339620Number of Logic Elements/Cells900000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits59234304

Overview of 10AX090N3F40E2LG – Arria 10 GX FPGA, 900,000 logic elements, 1517-FCBGA

The 10AX090N3F40E2LG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1517-FCBGA (40×40) package. It delivers a high-capacity mid-range FPGA architecture combining large logic resources, extensive embedded memory, and broad I/O for performance-sensitive, power-conscious designs.

Typical target markets include wireless, wireline, broadcast, computing and storage, medical, and military applications where a balance of performance, integration and power efficiency is required. Key on‑device resources include 900,000 logic elements, 59,234,304 total RAM bits and 600 I/O pins.

Key Features

  • Core logic capacity — 900,000 logic elements provide substantial programmable fabric for mid-range to high-complexity designs.
  • Embedded memory — 59,234,304 total RAM bits for on-chip buffering, caching and data-path storage.
  • I/O density — 600 general-purpose I/O pins support wide parallel interfaces and complex system integration.
  • Package and mounting — 1517-BBGA / 1517-FCBGA (40×40) surface-mount package for dense board integration.
  • Voltage and power — Operates from 870 mV to 930 mV; part of a device family described as power-efficient through integrated power-saving technologies.
  • Temperature and grade — Extended grade with an operating range of 0 °C to 100 °C.
  • High-speed interfaces and hard IP — Family-level features include PCIe Gen1/Gen2/Gen3 hard IP and enhanced PCS hard IP for 10 Gbps Ethernet and Interlaken (per device family documentation).
  • Programmable compute and DSP — Family documentation lists variable-precision DSP blocks and adaptive logic modules for flexible signal processing and arithmetic acceleration.

Typical Applications

  • Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul modules that benefit from programmable logic and on-chip memory.
  • Wireline communications — 40G/100G muxponders, transponders and line cards leveraging high-speed serial interfaces and hard IP.
  • Broadcast and media — Studio switches, videoconferencing and professional audio/video processing that use large logic capacity and embedded RAM for media pipelines.
  • Computing and storage — Server acceleration, flash cache and cloud computing applications that require FPGA-based offload and buffering.
  • Medical and defense systems — Diagnostic imaging, radar, electronic warfare and secure communications where a combination of logic capacity, memory and I/O density is needed.

Unique Advantages

  • High programmable capacity: 900,000 logic elements enable complex custom hardware implementations without external ASIC development.
  • Large on-chip memory: 59,234,304 RAM bits reduce dependence on external memory for many buffering and caching tasks, simplifying board-level design.
  • Extensive I/O: 600 I/O pins allow broad connectivity to high-pin-count peripherals and multi-lane interfaces.
  • Compact, production-ready package: 1517-FCBGA (40×40) surface-mount package supports dense PCB layouts and automated assembly processes.
  • Power-aware operation: Supported supply range (870 mV–930 mV) and family-level power-saving technologies help manage system power consumption.
  • Documented ecosystem: Arria 10 family documentation includes device handbooks, errata and design recommendations to support development and qualification.

Why Choose 10AX090N3F40E2LG?

The 10AX090N3F40E2LG targets designs that require substantial programmable logic, large embedded memory and high I/O capacity in a single FPGA package. Its combination of 900,000 logic elements, 59+ million RAM bits and 600 I/O pins positions it for mid-range applications where integration and on-chip resources reduce system complexity.

Backed by Intel Arria 10 family documentation and support materials, this device is suitable for teams looking to leverage family-level features such as PCIe hard IP, high-speed serial connectivity and programmable DSP resources while maintaining control over power and thermal budgets within an extended temperature grade.

Request a quote or submit an inquiry to get pricing and availability for 10AX090N3F40E2LG and to discuss lead times and order quantities.

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