10AX090N3F45E2LG

IC FPGA 768 I/O 1932FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 768 59234304 900000 1932-BBGA, FCBGA

Quantity 77 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O768Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs339620Number of Logic Elements/Cells900000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits59234304

Overview of 10AX090N3F45E2LG – Arria 10 GX FPGA (900,000 logic elements, 1932‑FCBGA)

The 10AX090N3F45E2LG is an Intel Arria 10 GX Field Programmable Gate Array in a 1932‑FCBGA surface‑mount package. It combines a high logic density architecture with substantial on‑chip memory and extensive I/O to address mid‑range, performance‑sensitive FPGA designs.

Designed for applications across wireless, wireline, broadcast, computing/storage, and medical markets, this device leverages the Arria 10 family’s 20‑nm architecture to deliver performance and power efficiency for complex signal processing and system‑level integration.

Key Features

  • Core Logic Density  Provides 900,000 logic elements suitable for complex FPGA designs that require large programmable logic resources.
  • Embedded Memory  Total on‑chip RAM of 59,234,304 bits to support large buffers, packet processing, and algorithmic state storage.
  • I/O Capacity  768 user I/O pins to support wide parallel interfaces, multiple memory channels, and complex board connectivity.
  • Transceivers and DSP Capabilities  Part of the Arria 10 family that includes low‑power serial transceivers and variable‑precision DSP resources for high‑throughput data paths and signal processing.
  • Package and Mounting  1932‑FCBGA (45×45) surface‑mount package providing a high‑pin‑count, compact footprint for advanced system designs.
  • Power and Temperature  Core voltage supply range of 870 mV to 930 mV and an operating temperature range of 0 °C to 100 °C; device is graded as Extended.
  • Regulatory  RoHS compliant.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment that require programmable logic and DSP acceleration.
  • Wireline Communications  40G/100G muxponders, transponders, and line cards where high logic density and transceiver support enable high‑speed packet and waveform processing.
  • Broadcast and Professional AV  Studio switching, video processing and transport applications that benefit from large on‑chip memory and abundant I/O.
  • Computing and Storage  Flash cache, server acceleration, and cloud compute applications that leverage programmable hardware for offload and performance tuning.
  • Medical Imaging  Diagnostic scanners and imaging equipment that require deterministic, high‑throughput signal processing and large buffer memory.

Unique Advantages

  • High programmable density: 900,000 logic elements provide the capacity to implement large algorithms and multiple subsystems on a single device, reducing system complexity.
  • Substantial on‑chip RAM: 59,234,304 total RAM bits enable deep buffering and stateful processing without immediate reliance on external memory.
  • Extensive connectivity: 768 I/O pins support diverse parallel interfaces and multiple external memory or peripheral channels from a single FPGA.
  • Compact high‑pin package: 1932‑FCBGA (45×45) delivers high I/O density in a surface‑mount form factor for space‑constrained designs.
  • Targeted power envelope: Core supply range of 870–930 mV reflects the device’s operating voltage window, informing power delivery and thermal planning.
  • Extended operating grade: Rated for 0 °C to 100 °C operation, providing suitability for many commercial and industrial‑adjacent applications.

Why Choose 10AX090N3F45E2LG?

The 10AX090N3F45E2LG positions itself as a high‑density, mid‑range FPGA solution within the Intel Arria 10 family, offering a balance of logic capacity, on‑chip memory, and I/O resources for complex system designs. Its Arria 10 lineage brings features such as low‑power transceivers and DSP capabilities that support demanding signal processing and communications tasks.

This device is well suited to engineering teams who need scalable programmable logic with substantial embedded RAM and extensive external connectivity in a compact FCBGA package, while maintaining a defined power and thermal envelope for system integration and testing.

Request a quote or submit an RFQ to receive pricing, availability, and technical support for the 10AX090N3F45E2LG.

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