10AX115N1F40I1SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 600 68857856 1150000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,388 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115N1F40I1SG – Arria 10 GX Field Programmable Gate Array (FPGA), 1517‑FCBGA
The 10AX115N1F40I1SG is an Intel Arria 10 GX FPGA in a 1517‑FCBGA (40×40) package designed for high‑performance, power‑sensitive midrange applications. As part of the Arria 10 family, this device combines a large logic fabric with substantial on‑chip memory and flexible I/O to address wireless, wireline, broadcast, computing, storage, medical and defense market segments.
This device offers a balance of compute density, embedded memory and I/O capacity while operating across an industrial temperature range and low core voltage to meet robust system requirements.
Key Features
- Core Density — 1,150,000 logic elements providing high logic capacity for complex custom logic, signal processing, and control tasks.
- Embedded Memory — 68,857,856 total RAM bits for large on‑chip buffering, lookup tables and memory‑intensive functions.
- I/O Capacity — 600 I/O pins to support wide external interface options and high‑pin‑count interconnect requirements.
- Power and Supply — Core voltage supply range of 0.870 V to 0.980 V to match system power rails and support efficient operation.
- Industrial Temperature Range — Rated for operation from −40°C to 100°C for deployment in industrial and demanding environments.
- Package and Mounting — 1517‑BBGA / 1517‑FCBGA (40×40) surface‑mount package for compact board integration.
- Series-Level IP and Capabilities — Arria 10 family features include adaptive logic modules, variable‑precision DSP blocks, embedded memory blocks, PLL and clock networks, PCIe Gen1/2/3 hard IP and 10 Gbps Ethernet/Interlaken support as part of the device family architecture.
- Compliance — RoHS compliant.
Typical Applications
- Wireless Infrastructure — Channel processing, remote radio head interfaces and mobile backhaul where high logic density and on‑chip memory accelerate real‑time signal processing.
- Wireline and Networking — 40G/100G line cards, muxponders and aggregation systems that require high I/O counts and series‑level hard IP for protocol acceleration.
- Broadcast and Pro AV — Studio switching and video/transport processing leveraging large embedded RAM and abundant logic for frame buffering and format conversion.
- Computing and Storage — Server acceleration, flash cache and cloud compute offload tasks that benefit from the device’s compute density and memory capacity.
- Medical and Defense Systems — Diagnostic imaging, radar and secure communications using industrial temperature capability and the device family’s DSP and memory resources.
Unique Advantages
- High logic capacity: 1,150,000 logic elements enable complex algorithms and large FPGA designs without immediate migration to larger device families.
- Large on‑chip memory: Nearly 69 million RAM bits reduce dependence on external memory for buffering and accelerate memory‑bound functions.
- Extensive I/O: 600 I/O pins simplify board design for multi‑lane interfaces and parallel external peripherals.
- Industrial operating range: −40°C to 100°C supports deployment in industrial and harsh thermal environments.
- Compact, serviceable package: 1517‑FCBGA (40×40) surface‑mount package balances board area and thermal considerations for dense system designs.
- Family-level integration: Access to Arria 10 series hard IP such as PCIe Gen1/2/3 and 10 Gbps Ethernet support streamlines system integration and protocol offload.
Why Choose 10AX115N1F40I1SG?
The 10AX115N1F40I1SG positions itself as a high‑density, midrange Arria 10 GX FPGA optimized for systems that require substantial logic, abundant embedded memory and a large I/O footprint within an industrial temperature envelope. Its low core voltage range and family‑level IP options make it suitable for designs that balance performance and power efficiency.
This device is well suited for engineering teams developing communications, networking, compute acceleration and imaging systems that need scalable logic resources, on‑chip memory capacity and the board‑level connectivity afforded by a 600‑pin I/O array.
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