10AX115N1F40I2SGES
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 600 68857856 1150000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 330 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115N1F40I2SGES – Arria 10 GX FPGA, 1,150,000 logic elements, 68,857,856 RAM bits, 600 I/O
The 10AX115N1F40I2SGES is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 1517-FCBGA (40×40) package. It is built on the Arria 10 device family architecture—20 nm mid-range FPGAs designed for high performance and power efficiency.
With 1,150,000 logic elements, 68,857,856 total RAM bits and 600 I/O, this industrial-grade device targets midrange, power-sensitive applications across wireless, wireline, broadcast, computing, medical and defense markets where high logic density, embedded memory and flexible I/O are required.
Key Features
- Logic Density — 1,150,000 logic elements provide substantial programmable fabric for complex digital designs.
- Embedded Memory — 68,857,856 total RAM bits of on-chip memory for large buffering, caching and state storage.
- High I/O Count — 600 device I/O pins to support wide external interfaces and parallel connectivity.
- Device Architecture — Built on a 20 nm Arria 10 family architecture focused on performance and power efficiency.
- Serial and Networking Support — Device family-level features include low-power serial transceivers and hard IP for PCIe and high-speed Ethernet (as described in the Arria 10 device overview).
- Reconfiguration and System Features — Supports dynamic and partial reconfiguration techniques at the device-family level to enable runtime flexibility.
- Industrial Temperature Range — Rated for operation from −40°C to 100°C for deployments in industrial environments.
- Power Supply — Core voltage supply specified at 870 mV to 930 mV.
- Package & Mounting — 1517-BBGA / 1517-FCBGA (40×40) package, surface-mount mounting type.
- RoHS Compliance — Product is RoHS compliant.
Typical Applications
- Wireless Infrastructure — Implementation of channel processing, switch cards and remote radio head functions where dense logic and high memory capacity support baseband and backhaul processing.
- Wireline Networking — Line cards, muxponders and transponders for 40G/100G networks that benefit from abundant logic, high I/O and serial transceiver capability described in the device family overview.
- Broadcast and Professional AV — Studio switching and video transport systems requiring large frame buffers and flexible I/O routing enabled by on-chip memory and high pin count.
- Compute and Storage Acceleration — Server acceleration, flash cache and cloud compute functions that use high logic density and embedded RAM for offload tasks.
- Medical and Imaging — Diagnostic imaging and scanner systems that need deterministic processing, high memory capacity and industrial temperature operation.
Unique Advantages
- High logic capacity: 1,150,000 logic elements allow complex algorithms and parallel processing to be implemented on a single device, reducing board-level complexity.
- Large on-chip memory: 68,857,856 total RAM bits enable substantial buffering and data staging without relying solely on external memory.
- Extensive external connectivity: 600 I/O pins provide flexibility for multi-channel interfaces and broad peripheral integration.
- Industrial readiness: Specified −40°C to 100°C operating range and surface-mount FCBGA packaging for use in industrial environments.
- Power-focused architecture: Part of the 20 nm Arria 10 family designed for power efficiency, with a defined core voltage range (870 mV–930 mV) to support optimized power delivery.
- Family-level system features: Device family documentation highlights support for serial transceivers, PCIe and Ethernet hard IP, and dynamic/partial reconfiguration for adaptable system architectures.
Why Choose 10AX115N1F40I2SGES?
The 10AX115N1F40I2SGES positions itself as a high-density, industrial-grade Arria 10 GX FPGA that combines substantial logic resources, large embedded memory and a high I/O count in a 1517-FCBGA package. These characteristics make it suitable for midrange, performance- and power-sensitive applications that require on-chip memory, extensive interfacing and deployment across a wide temperature range.
As a member of the Arria 10 device family, it benefits from the family-level capabilities described in the device overview—such as low-power serial transceivers, hard IP for high-speed interfaces, and support for dynamic and partial reconfiguration—delivering a scalable platform for system designers focused on integration, performance and reliability.
Request a quote or submit an inquiry to initiate procurement for the 10AX115N1F40I2SGES FPGA and discuss quantity, availability and delivery options.

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