10AX115N1F40I2SGES

IC FPGA 600 I/O 1517FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 600 68857856 1150000 1517-BBGA, FCBGA

Quantity 330 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115N1F40I2SGES – Arria 10 GX FPGA, 1,150,000 logic elements, 68,857,856 RAM bits, 600 I/O

The 10AX115N1F40I2SGES is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 1517-FCBGA (40×40) package. It is built on the Arria 10 device family architecture—20 nm mid-range FPGAs designed for high performance and power efficiency.

With 1,150,000 logic elements, 68,857,856 total RAM bits and 600 I/O, this industrial-grade device targets midrange, power-sensitive applications across wireless, wireline, broadcast, computing, medical and defense markets where high logic density, embedded memory and flexible I/O are required.

Key Features

  • Logic Density — 1,150,000 logic elements provide substantial programmable fabric for complex digital designs.
  • Embedded Memory — 68,857,856 total RAM bits of on-chip memory for large buffering, caching and state storage.
  • High I/O Count — 600 device I/O pins to support wide external interfaces and parallel connectivity.
  • Device Architecture — Built on a 20 nm Arria 10 family architecture focused on performance and power efficiency.
  • Serial and Networking Support — Device family-level features include low-power serial transceivers and hard IP for PCIe and high-speed Ethernet (as described in the Arria 10 device overview).
  • Reconfiguration and System Features — Supports dynamic and partial reconfiguration techniques at the device-family level to enable runtime flexibility.
  • Industrial Temperature Range — Rated for operation from −40°C to 100°C for deployments in industrial environments.
  • Power Supply — Core voltage supply specified at 870 mV to 930 mV.
  • Package & Mounting — 1517-BBGA / 1517-FCBGA (40×40) package, surface-mount mounting type.
  • RoHS Compliance — Product is RoHS compliant.

Typical Applications

  • Wireless Infrastructure — Implementation of channel processing, switch cards and remote radio head functions where dense logic and high memory capacity support baseband and backhaul processing.
  • Wireline Networking — Line cards, muxponders and transponders for 40G/100G networks that benefit from abundant logic, high I/O and serial transceiver capability described in the device family overview.
  • Broadcast and Professional AV — Studio switching and video transport systems requiring large frame buffers and flexible I/O routing enabled by on-chip memory and high pin count.
  • Compute and Storage Acceleration — Server acceleration, flash cache and cloud compute functions that use high logic density and embedded RAM for offload tasks.
  • Medical and Imaging — Diagnostic imaging and scanner systems that need deterministic processing, high memory capacity and industrial temperature operation.

Unique Advantages

  • High logic capacity: 1,150,000 logic elements allow complex algorithms and parallel processing to be implemented on a single device, reducing board-level complexity.
  • Large on-chip memory: 68,857,856 total RAM bits enable substantial buffering and data staging without relying solely on external memory.
  • Extensive external connectivity: 600 I/O pins provide flexibility for multi-channel interfaces and broad peripheral integration.
  • Industrial readiness: Specified −40°C to 100°C operating range and surface-mount FCBGA packaging for use in industrial environments.
  • Power-focused architecture: Part of the 20 nm Arria 10 family designed for power efficiency, with a defined core voltage range (870 mV–930 mV) to support optimized power delivery.
  • Family-level system features: Device family documentation highlights support for serial transceivers, PCIe and Ethernet hard IP, and dynamic/partial reconfiguration for adaptable system architectures.

Why Choose 10AX115N1F40I2SGES?

The 10AX115N1F40I2SGES positions itself as a high-density, industrial-grade Arria 10 GX FPGA that combines substantial logic resources, large embedded memory and a high I/O count in a 1517-FCBGA package. These characteristics make it suitable for midrange, performance- and power-sensitive applications that require on-chip memory, extensive interfacing and deployment across a wide temperature range.

As a member of the Arria 10 device family, it benefits from the family-level capabilities described in the device overview—such as low-power serial transceivers, hard IP for high-speed interfaces, and support for dynamic and partial reconfiguration—delivering a scalable platform for system designers focused on integration, performance and reliability.

Request a quote or submit an inquiry to initiate procurement for the 10AX115N1F40I2SGES FPGA and discuss quantity, availability and delivery options.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up