10AX115H4F34I3SGES

The 10AX115H4F34I3SGES is an Intel Arria 10 GX field-programmable gate array (FPGA) device built on a 20 nm Arria 10 architecture. It delivers high logic capacity, substantial embedded memory, and a wide I/O count targeted at mid-range, performance-sensitive applications across wireless, wireline, broadcast, computing, medical, and military markets.

Designed for industrial-grade environments, this surface-mount FCBGA package combines dense integration with power-efficient operation to support complex digital designs requiring large logic resources and on-chip memory.

Key Features

• Core Logic — 1,150,000 logic elements to implement large-scale digital designs and complex custom logic functions.
• Embedded Memory — 68,857,856 total RAM bits for on-chip data buffering, frame storage, and algorithm state retention.
• I/O Density — 504 general-purpose I/O pins to support wide external connectivity and high-pin-count interfaces.
• Transceiver and High-Speed I/O (Arria 10 GX family) — Family-level support for low-power serial transceivers and enhanced PCS/PCS hard IP as described in the Arria 10 device documentation.
• Power — Core supply range of 0.870 V to 0.930 V to support controlled core-voltage designs and power management strategies.
• Package and Mounting — 1152-FCBGA (35×35) surface-mount package (1152-BBGA case) for compact board-level integration.
• Operating Temperature — Industrial temperature range from −40 °C to 100 °C for deployment in demanding environments.
• Regulatory — RoHS compliant.

Typical Applications

• Wireless Infrastructure — Channel processing and remote radio head control leveraging the device's high logic density and on-chip memory for signal processing and protocol handling.
• Wireline and Optical Networking — Line cards, muxponders, and transponders using the Arria 10 GX family's serial I/O capabilities and large logic resources for packet processing and aggregation functions.
• Broadcast and Professional AV — Studio switching, video transport, and real-time processing where large memory and flexible logic implement codecs, switching, and buffering.
• Computing and Storage Acceleration — Cloud and server acceleration tasks such as caching and data-path offload that benefit from extensive logic and embedded RAM.
• Medical and Defense Systems — Imaging systems, radar, and secure communications that use the device's temperature range and integration for reliable operation in fielded equipment.

Unique Advantages

• High Logic Capacity: 1,150,000 logic elements enable consolidation of multi-function designs into a single FPGA, reducing board-level complexity.
• Large On-Chip Memory: 68,857,856 RAM bits provide significant on-chip buffering and working storage for high-throughput algorithms.
• Extensive I/O Count: 504 I/Os allow flexible interfacing to multiple external devices and parallel data paths without immediate need for additional I/O expanders.
• Industrial Temperature Rating: −40 °C to 100 °C operational range supports deployment in harsh and temperature-variable environments.
• Compact, High-Density Package: 1152-FCBGA (35×35) packaging provides a high pin count in a compact footprint suitable for space-constrained boards.
• RoHS Compliant: Meets lead-free and restricted-substance directives for global manufacturing requirements.

Why Choose 10AX115H4F34I3SGES?

The 10AX115H4F34I3SGES positions itself for mid-range, performance-focused designs that require a balance of large logic capacity, abundant embedded memory, and significant I/O resources within an industrial-grade FPGA. It is suitable for engineers consolidating complex processing, buffering, and interface functions into a single, power-managed device.

Backed by the Arria 10 device family architecture and documentation, this part offers a path for scalable designs where integration density, thermal tolerance, and supply-chain compliance (RoHS) are priorities.

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